NXP Semiconductors - MCIMX6L8DVN10AA

MCIMX6L8DVN10AA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX6L8DVN10AA
Description SoC; Terminal Form: BALL; No. of Terminals: 432; Package Code: TFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.1 mm;
NAME DESCRIPTION
Minimum Supply Voltage: 1.375 V
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.1 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 432
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B432
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 95 Cel
Package Code: TFBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SoC
Maximum Supply Voltage: 1.5 V
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA432,24X24,20
Length: 13 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
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