Microprocessors

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
AM3358BZCZA100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.378 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.325 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	1000 rpm	YES	e1
MIMXRT1062DVL6B	NXP Semiconductors	MICROCONTROLLER, RISC																					TIN SILVER COPPER												40	260														3				e1
MIMXRT1062DVJ6B	NXP Semiconductors	MICROCONTROLLER, RISC																					TIN SILVER												40	260														3				e2
MIMXRT1062DVL6A	NXP Semiconductors	MICROCONTROLLER, RISC																					TIN SILVER COPPER												40	260														3				e1
MIMXRT1062DVJ6A	NXP Semiconductors	MICROCONTROLLER, RISC																					TIN SILVER												40	260														3				e2
AM3352BZCZD80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.26 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AM3352BZCZ100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.378 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.272 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.325 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	1000 rpm	YES	e1
MIMXRT1176DVMAA	NXP Semiconductors	MICROPROCESSOR, RISC																																	40	260														3
AM3358BZCZ100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.378 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.272 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.325 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	1000 rpm	YES	e1
ATSAMA5D31A-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39		10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
ATSAMA5D35A-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39		10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
MIMXRT1062XVN5B	NXP Semiconductors	MICROPROCESSOR																																	40	260														3
MIMXRT1176AVM8A	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.71 V	125 Cel		-40 Cel			BOTTOM		1.52 mm		2097152	14 mm		YES		48 MHz	40	260	14 mm		CMOS	850 mA	1.8 V	32		1			.8 mm	FLOATING-POINT	S-PBGA-B289	3		800 rpm	YES
AM3352BZCZA100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.378 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.325 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	1000 rpm	YES	e1
ATSAMA5D36A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39		10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
ATSAMA5D35A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39		10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
ATSAMA5D31A-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39		10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
STM32MP157FAC1	STMicroelectronics	MICROPROCESSOR, RISC
MPC8270CVRMIBA	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32		32	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.45 V				TIN SILVER		BOTTOM		2.55 mm			27 mm		YES	64	266 MHz	30	245	27 mm		CMOS		1.5 V				Other uPs/uCs/Peripheral ICs		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
STM32MP157AAA3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	125 Cel		-40 Cel			BOTTOM		1.32 mm		724992	18 mm		YES	0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	18 mm		CMOS	1000 mA	.9 V	48					.8 mm	FLOATING POINT	S-PBGA-B448			650 rpm	YES
MC9328MX1CVM15R2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		25		32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL		BOTTOM		1.6 mm			14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz	40	260	14 mm		CMOS		1.8 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
AM3359BZCZA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		65536	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.26 V	64		4	Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AM3352BZCZ60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.1 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3354BZCZA100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.378 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.272 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.325 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	1000 rpm	YES	e1
OSD3358-512M-ICB	Octavo Systems	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			16				GRID ARRAY			85 Cel		-40 Cel			BOTTOM		2.6 mm			27 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	8			245	27 mm		CMOS		1.1 V						1.27 mm	FIXED POINT	S-PBGA-B400	4		1000 rpm	YES
MIMXRT1052DVL6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel	0	0 Cel	TIN SILVER COPPER		BOTTOM		1.43 mm		524288	10 mm		YES	0	24 MHz	40	260	10 mm		CMOS	105 mA		32		29			.65 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES	e1
MCIMX537CVP8C2	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8	26		32		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel			BOTTOM		1.85 mm		147456	19 mm		YES	32	27 MHz	40	260	19 mm		CMOS	800 mA	1.1 V	32		52			.8 mm	FLOATING POINT	S-PBGA-B529	3		800 rpm	YES
STM32MP157CAC3	STMicroelectronics	MICROPROCESSOR, RISC																																	NOT SPECIFIED	NOT SPECIFIED
AM3352BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.1 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
ATSAMA5D27C-D1G-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	16	0		16		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA289,17X17,32	1.14 V	85 Cel		-40 Cel			BOTTOM		1.2 mm		65536	14 mm		YES	0	24 MHz			14 mm		CMOS		1.2 V	51		1			.8 mm	FIXED POINT	S-PBGA-B289			500 rpm	YES
MCIMX535DVP1C2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.4 V	8	26		32		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel		-20 Cel			BOTTOM		1.85 mm		147456	19 mm		YES	32	27 MHz	40	260	19 mm		CMOS	800 mA	1.25 V			5			.8 mm	FLOATING POINT	S-PBGA-B529	3		1000 rpm	YES
AM3354BZCZ100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.378 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.272 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.325 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	1000 rpm	YES	e1
STM32MP157CAA3	STMicroelectronics	MICROPROCESSOR, RISC																																		260														3
STM32MP157AAC3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26		32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel			BOTTOM		1.2 mm		724992	12 mm		YES	0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm		CMOS	1000 mA	.9 V	48					.65 mm	FLOATING POINT	S-PBGA-B361			650 rpm	YES
MPC5200CVR400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		13				GRID ARRAY		1.42 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.65 mm			27 mm		YES	32	35 MHz	40	260	27 mm		CMOS		1.5 V						1.27 mm	FLOATING POINT	S-PBGA-B272	3		400 rpm	YES	e1
STM32MP157FAA1	STMicroelectronics	MICROPROCESSOR, RISC
ATSAMA5D36A-CUR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26		32	1.2	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	1	-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	48 MHz			15 mm		CMOS		1.2 V	39		10	Microprocessors		.8 mm	FLOATING POINT	S-PBGA-B324		Not Qualified	536 rpm	YES	e1
AM3505AZCNAC	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16		16	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		65536	17 mm		YES	16	26 MHz	30	260	17 mm		CMOS	1400 mA	1.2 V	32			Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B491	3	Not Qualified	600 rpm	YES	e1
STM32MP157DAB1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	105 Cel		-20 Cel			BOTTOM		1.29 mm		724992	16 mm		YES	16	64 MHz			16 mm		CMOS	865 mA	.9 V	48					.8 mm	FLOATING POINT	S-PBGA-B354			800 rpm	YES
AT91SAM9260B-QU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8	26	NO	32	1.8,1.8/3.3,3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	1.65 V	85 Cel	3	-40 Cel	MATTE TIN	YES	QUAD	YES	4.1 mm	32768	8192	28 mm	ALSO OPERATES AT 3.3V SUPPLY	YES	32	50 MHz			28 mm	8192	CMOS		1.8 V	22	YES	1	Microcontrollers	FLASH	.5 mm	FIXED POINT	S-PQFP-G208	3	Not Qualified	180 rpm	YES	e3	96
MIMXRT1171AVM8A	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8					GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.71 V	125 Cel		-40 Cel			BOTTOM		1.52 mm		2097152	14 mm		YES		48 MHz	40	260	14 mm		CMOS	850 mA	1.8 V	32		1			.8 mm	FLOATING-POINT	S-PBGA-B289	3		800 rpm	YES
MCF5251VM140	NXP Semiconductors	MICROPROCESSOR	COMMERCIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		24		32	1.2,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	1.08 V	70 Cel		0 Cel			BOTTOM		1.6 mm			13 mm		YES	32	140 MHz	40	260	13 mm		CMOS		1.2 V				Microprocessors		.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	140 rpm	NO
STM32MP157FAB1	STMicroelectronics	MICROPROCESSOR, RISC
AM3354BZCZD80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28		32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm		131072	15 mm		YES	16	26 MHz	30	260	15 mm		CMOS	400 mA	1.26 V	64			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
MCF5329CVM240	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		24		32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.6 mm			17 mm		YES	32	80 MHz	40	260	17 mm		CMOS		1.5 V						1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
AM3894CCYGA120	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	28		32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		3.31 mm		65536	25 mm		YES	16	27 MHz	30	245	25 mm		CMOS		1 V	72			Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	1200 rpm	YES	e1
AM3517AZCNA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16		16	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm		65536	17 mm		YES	16	26 MHz	30	260	17 mm		CMOS	1500 mA	1.2 V	32			Microprocessors		.65 mm	FLOATING POINT	S-PBGA-B491	3	Not Qualified	600 rpm	YES	e1
MIMXRT1052DVJ6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0		32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	95 Cel	0	0 Cel	TIN SILVER		BOTTOM		1.52 mm		524288	12 mm		YES	0	24 MHz	40	260	12 mm		CMOS	105 mA		32		29			.8 mm	FLOATING-POINT	S-PBGA-B196	3		600 rpm	YES	e2