Microchip Technology - A2F200M3F-CSG288I

CY8C4045AZI-S413 by Infineon: Operates at 1.71-1.89V, -40 to 85°C temp range, with PSoC tech for industrial apps. Features 48 terminals in a low profile, fine pitch flatpack package suitable for surface mount assembly. Terminal finish is pure tin with gull wing form factor and 0.5mm pitch.

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

SYSTEM ON CHIP;

The NXP MIMXRT1175CVM8A is a SoC peripheral IC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.1-1.15 V. Its grid array package has 289 terminals and measures 14x14 mm, making it suitable for various embedded applications.

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 485; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

ESP32-S3-WROOM-1U-N16R2 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage range of 3-3.6V. Ideal for IoT applications due to its compact size and surface mount capability.

CY8C21434-24LQXIT by Infineon is a 32-terminal, CMOS technology chip with a max supply voltage of 5.25V and operating temp range of -40 to 85°C. Ideal for industrial applications, this programmable SoC has a square shape, no lead terminal form, and very thin profile package style.

XA7Z020-1CLG484Q by Xilinx is a MICROPROCESSOR CIRCUIT with 484 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Features include 1.8V power supply, 0.8mm terminal pitch, and TIN SILVER COPPER finish.

MCIMX6X1AVK08AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.275V to 1.5V, making it ideal for automotive applications requiring low profile, fine pitch ICs.

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Qualification: Not Qualified;

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; Package Code: BGA; Package Shape: UNSPECIFIED; Package Style (Meter): GRID ARRAY; Technology: CMOS;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 441; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B441;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 491; Package Code: LFBGA; Package Shape: SQUARE;

CY8C3866AXI-040 by Infineon: 100-terminal FLATPACK IC with 3.3V supply, 65536 ROM bits, and -40 to 85°C temp range. Ideal for industrial applications requiring a programmable SoC solution in a compact form factor.

SoC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

XC7Z030-1FFG676C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.