NXP Semiconductors - MCIMX6X1AVK08AB

MCIMX6X1AVK08AB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX6X1AVK08AB
Description SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCIMX6X1AVK08AB Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.275 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.3 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 400
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B400
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: LFBGA
Width: 14 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.5 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA400,20X20,25
Length: 14 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
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