Texas Instruments - CC2541F128RHAR

SLB9670XQ20FW762XUMA1 by Infineon Technologies is a cryptographic authenticator with CMOS technology. It has a package style of chip carrier, heat sink/slug, and very thin profile. With a max supply voltage of 1.95V, it is suitable for industrial applications requiring secure authentication.

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR;

ESP32-WROOM-32E-H4 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact size (25.5mm x 18mm) and peak reflow temp of 250C.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

ESP32-WROOM-32E-N8 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 3V to 3.6V. Ideal for IoT applications due to its compact rectangular package style and surface mount capability.

MICROPROCESSOR CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1152,34X34,40;

LTC4263IDE#PBF by Analog Devices is a MICROPROCESSOR CIRCUIT with 14 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 4.5-5.5 V and comes in a small outline package suitable for industrial applications requiring CMOS technology.

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR;

MCIMX6S7CVM08AC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with a supply voltage range of 1.275V to 1.5V. This low-profile, fine-pitch IC with 624 terminals is ideal for industrial applications requiring high performance in a compact form factor.

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

Other uPs/uCs/Peripheral ICs;

XCZU4EV-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package with 784 terminals is ideal for industrial applications requiring high performance uPs/uCs.

PROGRAMMABLE RFSoC; Terminal Form: NO LEAD; No. of Terminals: 50; Package Code: XMA; Package Shape: RECTANGULAR; Maximum Supply Voltage: 4.2 V;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 24; Package Code: TFLGA; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;