Other Function uPs,uCs & Peripheral ICs

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
ATWINC3400-MR210CA122	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	4.2 V	TS 16949	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	2.087 mm	14.732 mm				30	260	22.428 mm	CMOS	3.6 V		1.204 mm	R-XXMA-N37
ESP32-WROOM-32E-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm				30	250	25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N38	3
NRF52832-QFAA-R	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm						6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
ESP32-WROOM-32UE-N16	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm				30	250	19.2 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N38	3
ESP32-WROOM-32UE-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm				30	250	19.2 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N38	3
NRF52832-QFAA-R7	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm						6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
ESP32-WROOM-32E-N16	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm				30	250	25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N38	3
ESP32-WROOM-32E-N8	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm				30	250	25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N38	3
ESP32-S3-WROOM-1-N8R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm					250	25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N41	3
ESP32-C3-MINI-1-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	53	QMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		QUAD	2.55 mm	13.2 mm						16.6 mm	CMOS	3.3 V			R-XQMA-N53	3
NRF52832-CIAA-R	Nordic Semiconductor Asa	SoC		BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,7X8,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.399 mm	2.956 mm						3.226 mm	CMOS	3 V		.4 mm	R-PBGA-B56
ESP32-S3-WROOM-1-N8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N41
NRF52832-QFAA-T	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm						6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
NRF52832-CIAA-R7	Nordic Semiconductor Asa	SoC		BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,7X8,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.399 mm	2.956 mm						3.226 mm	CMOS	3 V		.4 mm	R-PBGA-B56
ESP32-WROOM-32UE-N8	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm				30	250	19.2 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N38	3
ESP32-S3-WROOM-1-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1-N8R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1-N16	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N41
ESP32-WROOM-32E(M113EH3200PH3Q0)	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N38
ESP32-S3-WROOM-1-N16R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N41
NRF9160-SICA-R7	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V		GRID ARRAY	LGA127,21X30,20	3 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	10.5 mm						16 mm	CMOS	3.8 V		.5 mm	R-XBGA-N127
NRF5340-QKAA-R7	Nordic Semiconductor Asa	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	94	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC94,.27SQ,16	1.7 V	105 Cel	-40 Cel		QUAD	.85 mm	7 mm						7 mm	CMOS	3 V		.4 mm	S-XQCC-N94
ESP32-WROOM-32E-N8R2	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm				30	250	25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N38	3
NRF9160-SICA-R	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V		GRID ARRAY	LGA127,21X30,20	3 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	10.5 mm						16 mm	CMOS	3.8 V		.5 mm	R-XBGA-N127
ESP32-S3-WROOM-1-N4R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N41
NRF52832-QFAB-R	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm						6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
ESP32-S3-WROOM-1-N16R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N41
ATWINC1500-MR210UB1961	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel	-40 Cel		UNSPECIFIED	2.113 mm	14.73 mm				NOT SPECIFIED	NOT SPECIFIED	21.72 mm	CMOS	3.3 V			R-XXMA-N28
NRF5340-QKAA-R	Nordic Semiconductor Asa	CRYPTOGRAPHIC AUTHENTICATOR		GULL WING	94	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC94,.27SQ,16	1.7 V	105 Cel	-40 Cel		QUAD	.85 mm	7 mm						7 mm	CMOS	3 V		.4 mm	S-XQCC-N94
ESP32-WROOM-32E	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm				30	250	25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N38	3
XC7Z020-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm						17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
MIMXRT1062CVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm				40	260	10 mm	CMOS			.65 mm	S-PBGA-B196	3		e1
MIMXRT1062CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm				40	260	10 mm	CMOS			.65 mm	S-PBGA-B196	3		e1
NRF5340-CLAA-R7	Nordic Semiconductor Asa	CRYPTOGRAPHIC AUTHENTICATOR		BALL	95	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA95,12X12,14	1.7 V	105 Cel	-40 Cel		BOTTOM	.447 mm	3.994 mm						4.39 mm	CMOS	3 V		.35 mm	R-PBGA-B95
AR1100-I/MQ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V	TS 16949	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	3.135 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm	ALSO OPERATES AT 5V SUPPLY					5 mm	CMOS	3.3 V		.65 mm	S-PQCC-N20			e3
ESP32-S3-WROOM-1-N4R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm						25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N41
XC7Z010-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm						17 mm	CMOS	1 V		.8 mm	S-PBGA-B400	3		e1
MIMXRT1062CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm				40	260	12 mm	CMOS			.8 mm	S-PBGA-B196	3		e2
XC7Z020-2CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm						19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
XC7Z030-1SBG485C	Xilinx	SYSTEM ON CHIP		BALL	485	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY	BGA485,22X22,32	.95 V	85 Cel	0 Cel		BOTTOM	2.44 mm	19 mm						19 mm	CMOS	1 V		.8 mm	S-PBGA-B485
P82B715DR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V		SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm	VCCB(Min)(V) is 3, VCCB(Max)(V) is 12	0	.4 MHz	NOT SPECIFIED	260	4.9 mm	BIPOLAR	5 V	I2C	1.27 mm	R-PDSO-G8	1	Not Qualified	e4
NRF5340-CLAA-R	Nordic Semiconductor Asa	CRYPTOGRAPHIC AUTHENTICATOR		BALL	95	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA95,12X12,14	1.7 V	105 Cel	-40 Cel		BOTTOM	.447 mm	3.994 mm						4.39 mm	CMOS	3 V		.35 mm	R-PBGA-B95
ESP32-WROOM-32E-H4	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	105 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm				30	250	25.5 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N38	3
MIMXRT1062CVJ5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm				40	260	12 mm	CMOS			.8 mm	S-PBGA-B196	3		e2
NRF9160-SIBA-R7	Nordic Semiconductor Asa	MICROCONTROLLER, CISC	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	5.5 V		GRID ARRAY	LGA127,21X30,20	3 V	85 Cel	-40 Cel		BOTTOM	1.1 mm	10.5 mm						16 mm	CMOS	3.8 V		.5 mm	R-XBGA-N127
ESP32-C3-MINI-1U-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	53	QMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		QUAD	2.55 mm	12.5 mm						13.2 mm	CMOS	3.3 V			R-XQMA-N53	3
XC7Z020-1CLG484C	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	85 Cel	0 Cel		BOTTOM	1.6 mm	19 mm						19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
453-00052C	Laird Technologies	SoC