Multi-functional Peripherals

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
CY8C5868AXI-LP035	Infineon Technologies	MULTIFUNCTION PERIPHERAL		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		65536	14 mm		YES		33 MHz			14 mm			CMOS	.0255 mA	1.8 V				I2C; USB; PS/2	.5 mm	S-PQFP-G100	3				72
CY8C5888LTI-LP097	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		32768	8 mm		YES		33 MHz	30	260	8 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB	.4 mm	S-XQCC-N68	3	Not Qualified		e4	38
CY8C5868AXI-LP032	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1.6 mm		32768	14 mm		YES		33 MHz	30	260	14 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.5 mm	S-PQFP-G100	3	Not Qualified		e4	72
CY8C5888AXI-LP096	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN	N	QUAD	1.6 mm		32768	14 mm		YES		33 MHz			14 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB	.5 mm	S-PQFP-G100	3	Not Qualified			62
CY8C5888FNI-LP214T	Infineon Technologies		INDUSTRIAL	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			BOTTOM	.6 mm		32768	5.192 mm		YES	0	33 MHz			5.94 mm			CMOS		3.3 V				I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS	.5 mm	R-PBGA-B99	1			e1	62
CY8C4247AZI-M485	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP64(UNSPEC)	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		8192	10 mm		NO		48 MHz			10 mm			CMOS	13.8 mA		11			I2C; SPI; UART; IRDA; IDE; CAN; LIN	.5 mm	S-PQFP-G64	3	Not Qualified		e4	51
CY8C29466-24SXI	Infineon Technologies		INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	3.3/5	SMALL OUTLINE	SOP28,.4	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.67 mm	32768	1024	7.505 mm	ALSO OPERATES AT 3V SUPPLY	NO	0	24 MHz	20	260	17.905 mm		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH		1.27 mm	R-PDSO-G28	3	Not Qualified	24 rpm	e4	24
CY8C5868LTI-LP039	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		32768	8 mm		YES		33 MHz	30	260	8 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.4 mm	S-XQCC-N68	3	Not Qualified		e4	48
CY8C29466-24PVXIT	Infineon Technologies		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	2 mm	32768	1024	5.3 mm	ALSO OPERATES AT 3V SUPPLY	NO	0	24 MHz	20	260	10.2 mm		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH		.65 mm	R-PDSO-G28	3	Not Qualified	24 rpm	e3	24
MIMX8MM6CVTKZAA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.9 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM	1.25 mm		288K	14 mm	24MHZ NOM CRYSTAL FREQ AVAILABLE	YES			40	260	14 mm			CMOS		.95 V				ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB	.5 mm	S-PBGA-B486	3			e2	16
CY8C5868LTI-LP038	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		32768	8 mm		YES		33 MHz	30	260	8 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.4 mm	S-XQCC-N68	3	Not Qualified		e4	48
CY8C5888AXQ-LP096	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	0		1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN	N	QUAD	1.6 mm		32768	14 mm		YES	0	33 MHz			14 mm	2097152 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; I2S, LIN; PS/2; SPI, USB	.5 mm	S-PQFP-G100	3	Not Qualified			62
CY8C5888LTQ-LP097	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0		1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		32768	8 mm		YES	0	33 MHz			8 mm	2097152 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; I2S, LIN; PS/2; SPI, USB	.4 mm	S-XQCC-N68	3	Not Qualified		e4	38
MIMX8ML8CVNKZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.9 V	0			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.805 V	105 Cel		-40 Cel			BOTTOM	1.481 mm		888832	15 mm	ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE	YES	0	24 MHz	40	260	15 mm			CMOS		.85 V	16			ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3				160
CY8C27443-24PVXIT	Infineon Technologies		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	2 mm	16384	256	5.3 mm	ALSO OPERATES AT 3V WITH 93KHZ	NO	0	24 MHz	20	260	10.2 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	I2C; USB	.65 mm	R-PDSO-G28	3	Not Qualified	24 rpm	e3	24
CY8C29466-24SXIT	Infineon Technologies		INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	3.3/5	SMALL OUTLINE	SOP28,.4	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.67 mm	32768	1024	7.505 mm	ALSO OPERATES AT 3V SUPPLY	NO	0	24 MHz	20	260	17.905 mm		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH		1.27 mm	R-PDSO-G28	3	Not Qualified	24 rpm	e4	24
CY8C4245AXI-483	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V				FLATPACK, LOW PROFILE	QFP44,.47SQ,32	1.71 V	105 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		2048	10 mm		NO		48 MHz	20	260	10 mm			CMOS	13.8 mA	3.3 V	3			I2C; IDE; IRDA; LIN; SPI; UART	.8 mm	S-PQFP-G44	3	Not Qualified		e3	36
MIMX8ML8DVNLZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.95 V	95 Cel		0 Cel			BOTTOM	1.481 mm		888832	15 mm		YES	0	24 MHz	40	260	15 mm			CMOS	2200 mA	1 V	16			ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3				136
CY8C24423A-24PVXIT	Infineon Technologies		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	2.7/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	2 mm	4096	256	5.3 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO	0	24.6 MHz	20	260	10.2 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	USB	.65 mm	R-PDSO-G28	3	Not Qualified	24 rpm	e3	24
MIMX8MQ6CVAHZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, FINE PITCH		.9 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM	2.18 mm		81920	17 mm	0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE	YES		40 MHz	40	260	17 mm			CMOS		1 V				ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB	.65 mm	S-PBGA-B621	3			e2	16
CY8C24423A-24PVXI	Infineon Technologies		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	2.7/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	2 mm	4096	256	5.3 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO	0	24.6 MHz	20	260	10.2 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	USB	.65 mm	R-PDSO-G28	3	Not Qualified	24 rpm	e3	24
CY8C29466-24PVXI	Infineon Technologies		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	2 mm	32768	1024	5.3 mm	ALSO OPERATES AT 3V SUPPLY	NO	0	24 MHz	20	260	10.2 mm		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH		.65 mm	R-PDSO-G28	3	Not Qualified	24 rpm	e3	24
MIMX8MM5CVTKZAA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.9 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM	1.25 mm		288K	14 mm	24MHZ NOM CRYSTAL FREQ AVAILABLE	YES			40	260	14 mm			CMOS		.95 V				ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB	.5 mm	S-PBGA-B486	3			e2	16
MCIMX535DVV2C	NXP Semiconductors			BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V				GRID ARRAY, FINE PITCH		1.3 V				TIN SILVER		BOTTOM	1.85 mm			19 mm					40	260	19 mm			CMOS		1.35 V					.8 mm	S-PBGA-B529	3			e2
CY8C4245LQI-483T	Infineon Technologies																														NOT SPECIFIED	NOT SPECIFIED
MIMX8MQ5CVAHZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, FINE PITCH		.9 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM	2.18 mm		81920	17 mm	0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE	YES		40 MHz	40	260	17 mm			CMOS		1 V				ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB	.65 mm	S-PBGA-B621	3			e2	16
CY8C27443-24PVXI	Infineon Technologies		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	2 mm	16384	256	5.3 mm	ALSO OPERATES AT 3V WITH 93KHZ	NO	0	24 MHz	20	260	10.2 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	I2C; USB	.65 mm	R-PDSO-G28	3	Not Qualified	24 rpm	e3	24
CY8C4245LQI-483	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.71 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm		2048	6 mm		NO		48 MHz			6 mm			CMOS	13.8 mA	3.3 V	3			I2C; IDE; IRDA; LIN; SPI; UART	.5 mm	S-XQCC-N40	3	Not Qualified		e4	34
MIMX8MM4CVTKZAA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.9 V	105 Cel		-40 Cel	TIN SILVER		BOTTOM	1.25 mm		288K	14 mm	24MHZ NOM CRYSTAL FREQ AVAILABLE	YES			40	260	14 mm			CMOS		.95 V				ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB	.5 mm	S-PBGA-B486	3			e2	16
MIMX8QP5AVUFFAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	1313	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	0			GRID ARRAY, FINE PITCH		1.05 V	125 Cel		-40 Cel			BOTTOM	2.52 mm		524288	29 mm	lsio contains 8 GPIO lines	YES	0	24 MHz	40	260	29 mm			CMOS	5000 mA	1.1 V				CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.75 mm	S-PBGA-B1313	3				1
MCIMX6Q5EYM10ADR	NXP Semiconductors																			TIN SILVER COPPER											40	260													3
CY8C5468AXI-LP106	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	BGA99,9X11,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	N	QUAD	1.6 mm		32768	14 mm		YES		33 MHz	30	260	14 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.5 mm	S-PQFP-G100	3	Not Qualified		e3	72
MIMX8ML3CVNKZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.9 V	0			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.805 V	105 Cel		-40 Cel			BOTTOM	1.481 mm		888832	15 mm	ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE	YES	0	24 MHz	40	260	15 mm			CMOS		.85 V	16			ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3				160
CY8C5866AXI-LP020	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	N	QUAD	1.6 mm		8192	14 mm		YES		33 MHz	30	260	14 mm	524288 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.5 mm	S-PQFP-G100	3	Not Qualified		e3	72
CY8C24894-24LTXI	Infineon Technologies		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V	0	8	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		QUAD	1 mm	16384	512	8 mm	IT ALSO OPERATES AT 3 V MINIMUM SUPPLY	NO	0	24 MHz	20	260	8 mm		1024	CMOS	27 mA	5 V		Microcontrollers	FLASH	I2C; USB	.5 mm	S-XQCC-N56	3	Not Qualified	24.96 rpm	e3	50
CY8C4124PVI-432	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm		2048	5.3 mm		NO	0	24 MHz			10.2 mm			CMOS	7.2 mA	1.8 V	0			I2C, I2S, SPI, UART	.65 mm	R-PDSO-G28	3	Not Qualified		e4	24
CY8C5467AXI-LP108	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	BGA99,9X11,20	1.71 V	85 Cel		-40 Cel	PURE TIN	N	QUAD	1.6 mm		16384	14 mm		YES		33 MHz			14 mm	1048576 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.5 mm	S-PQFP-G100	3	Not Qualified			72
MIMX8ML4DVNLZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	0			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.95 V	95 Cel		0 Cel			BOTTOM	1.481 mm		888832	15 mm		YES	0	24 MHz	40	260	15 mm			CMOS	2200 mA	1 V	16			ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3				136
CY8C3866PVI-021	Infineon Technologies		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	0		2/5	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	DUAL	2.794 mm		4096	7.505 mm		YES	0	67 MHz	20	260	15.875 mm	65536 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs			.635 mm	R-PDSO-G48	3	Not Qualified		e4	31
CY8C4245PVI-482	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.8 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm		4K	7.8 mm		NO			30	260	10.2 mm			CMOS	13.8 mA	3.3 V				I2C; IDE; IRDA; LIN; SPI; UART	.65 mm	R-PDSO-G28	3	Not Qualified		e4	24
CY8C5866LTI-LP022	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		16K	8 mm		YES		33 MHz	30	260	8 mm	524288 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.4 mm	S-XQCC-N68	3	Not Qualified		e4	48
CY8C24894-24LTXIT	Infineon Technologies		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V	0	8	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		QUAD	1 mm	16384	512	8 mm	IT ALSO OPERATES AT 3 V MINIMUM SUPPLY	NO	0	24 MHz	20	260	8 mm		1024	CMOS	27 mA	5 V		Microcontrollers	FLASH	I2C; USB	.5 mm	S-XQCC-N56	3	Not Qualified	24.96 rpm	e3	50
MIMX8ML4CVNKZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.9 V	0			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.805 V	105 Cel		-40 Cel			BOTTOM	1.481 mm		888832	15 mm	ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE	YES	0	24 MHz	40	260	15 mm			CMOS		.85 V	16			ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3				160
CY8C4248AZI-L485	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	0			FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		32K	10 mm		YES	0	48 MHz			10 mm			CMOS	14.5 mA	1.8 V				I2C; USB; LPC	.5 mm	S-PQFP-G64	3				53
CY8C3866PVI-021T	Infineon Technologies		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	0		2/5	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	1.71 V	85 Cel		-40 Cel	PURE TIN	N	DUAL	2.794 mm		4096	7.505 mm		YES	0	67 MHz			15.875 mm	65536 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2; 8051	.635 mm	R-PDSO-G48	3	Not Qualified			31
MIMX8MQ6CVAHZAA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, FINE PITCH		.9 V	105 Cel		-40 Cel			BOTTOM	2.18 mm		81920	17 mm	0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE	YES		40 MHz		260	17 mm			CMOS		1 V				ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB	.65 mm	S-PBGA-B621	3				16
MIMX8ML6CVNKZAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	548	LFBGA	SQUARE	PLASTIC/EPOXY	YES	.9 V	0			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA548,29X29,20	.805 V	105 Cel		-40 Cel			BOTTOM	1.481 mm		888832	15 mm	ALSO OPERATES @ 0.9-1V SUPPLY IN OVERDRIVE MODE	YES	0	24 MHz	40	260	15 mm			CMOS		.85 V	16			ETHERNET, I2C, I2S, PCI, SPI, UART, USB	.5 mm	S-PBGA-B548	3				160
MIMX8QM6AVUFFAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	1313	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	0			GRID ARRAY, FINE PITCH		1.05 V	125 Cel		-40 Cel	TIN		BOTTOM	2.52 mm		524288	29 mm	lsio contains 8 GPIO lines	YES	0	24 MHz	40	260	29 mm			CMOS	5000 mA	1.1 V				CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.75 mm	S-PBGA-B1313	3			e3	1

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.