Quantum Research Group - QT60160-ISG

PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 124; Package Code: VFBGA; Package Shape: SQUARE; Maximum Seated Height: 1 mm;

SoC;

XC7Z007S-1CLG225C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95V to 1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.

XCC1312R1F3RGZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for INDUSTRIAL applications requiring high performance in compact spaces.

CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVQCCN; Package Shape: RECTANGULAR; Package Equivalence Code: SOLCC8,.08,20;

MICROPROCESSOR CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC32,.2SQ,20;

Other uPs/uCs/Peripheral ICs; Terminal Finish: Matte Tin (Sn); JESD-609 Code: e3;

MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Technology: CMOS;

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

The Xilinx XC7Z030-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

PSoC;

SoC; Terminal Form: BALL; No. of Terminals: 425; Package Code: VFBGA; Package Shape: SQUARE; Nominal Supply Voltage: .75 V;

XCZU11EG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, measuring 40x40 mm. Operating b/w 0-100°C, it requires a supply voltage of 0.825-0.876 V and can withstand peak reflow at 245°C for up to 30s.

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

SoC; Terminal Form: BALL; No. of Terminals: 425; Package Code: VFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel;

SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;

Nordic Semiconductor's NRF9160-SIBA-R is a CMOS microcontroller with 127 terminals in a grid array package. It operates b/w -40 to 85°C, suitable for industrial applications. With a supply voltage range of 3-5.5V, it is ideal for IoT devices requiring low power consumption and compact design.

SoC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;