Telecom - Encryption ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HCS300-I/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	2.5 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
HCS365/P	Microchip Technology	DATA ENCRYPTION CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		TS 16949	5 mA	5 V		IN-LINE	DIP8,.3		2.54 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDIP-T8		5.334 mm	7.62 mm	Not Qualified	e3			9.271 mm
HCS365I/SM	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	2.03 mm	5.21 mm	Not Qualified	e3	40	260	5.28 mm
HCS301T/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	12 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
HCS301-I/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	12 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
HCS300-I/SNVAO	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	2.5 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
HCS300T/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	2.5 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
HCS101-I/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	2 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
HCS300/P	Microchip Technology	DATA ENCRYPTION CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		TS 16949	2.5 mA	5 V		IN-LINE	DIP8,.3		2.54 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDIP-T8		5.33 mm	7.62 mm	Not Qualified	e3			9.271 mm
HCS300T-I/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	2.5 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
HCS300T-I/SNVAO	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	2.5 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
HCS101/P	Microchip Technology	DATA ENCRYPTION CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE			2.54 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDIP-T8		4.32 mm	7.62 mm	Not Qualified	e3			9.46 mm
HCS101/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G8	3	1.75 mm	3.9116 mm	Not Qualified	e3	40	260	4.9 mm
HCS300-I/P	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		TS 16949	2.5 mA	5 V		IN-LINE	DIP8,.3		2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDIP-T8		5.33 mm	7.62 mm	Not Qualified	e3			9.271 mm
HCS300/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	2.5 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
HCS101-I/P	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		TS 16949	2 mA	5 V		IN-LINE	DIP8,.3		2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDIP-T8		5.334 mm	7.62 mm	Not Qualified	e3			9.271 mm
HCS101T-I/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified	e3	40	260	4.9 mm
HCS365I/P	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDIP-T8		4.32 mm	7.62 mm	Not Qualified	e3			9.46 mm
HCS515-I/SL	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	2 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e3	40	260	8.65 mm
HCS362-I/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	1.2 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified	e3	40	260	4.9 mm
HCS362-I/SNVAO	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949	1.2 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm		e3	30	260	4.9 mm
HCS200/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	12 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
HCS301/SN	Microchip Technology	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	12 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
HCS512-I/SO	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	10 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G18	1	2.65 mm	7.5 mm	Not Qualified	e3		260	11.55 mm
HCS512T-I/SO	Microchip Technology	DATA ENCRYPTION CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949	10 mA	5 V	5	SMALL OUTLINE	SOP18,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G18	2	2.65 mm	7.5 mm	Not Qualified	e3	40	260	11.55 mm
TMS7500NL	Texas Instruments	DATA ENCRYPTION CIRCUIT	COMMERCIAL	THROUGH-HOLE		DIP		PLASTIC/EPOXY	NO		MOS					IN-LINE	DIP(UNSPEC)	Telecom Encryption Circuits		70 Cel	0 Cel		DUAL					Not Qualified
TMS75C00FNL	Texas Instruments	DATA ENCRYPTION CIRCUIT	COMMERCIAL	J BEND		QCCJ		PLASTIC/EPOXY	YES		CMOS					CHIP CARRIER	LDCC(UNSPEC)	Telecom Encryption Circuits		70 Cel	0 Cel		QUAD					Not Qualified
TMS75C00NL	Texas Instruments	DATA ENCRYPTION CIRCUIT	COMMERCIAL	THROUGH-HOLE		DIP		PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP(UNSPEC)	Telecom Encryption Circuits		70 Cel	0 Cel		DUAL					Not Qualified
ADSP-2141LKS-E1	Analog Devices	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0			28 mm
ADSP-2141L	Analog Devices	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0			28 mm
ADSP-2141LKS-N1	Analog Devices	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified	e0			28 mm
ST19NP18ER28PVMT	STMicroelectronics	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Telecom Encryption Circuits	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G28	3			Not Qualified	e3	30	260
ST19NP18ER28PVMO	STMicroelectronics	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Telecom Encryption Circuits	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G28	3			Not Qualified	e3	30	260
ST19NP18ER28PVMK	STMicroelectronics	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Telecom Encryption Circuits	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G28	3			Not Qualified	e3	30	260
ST19NP18ER28PVMX	STMicroelectronics	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Telecom Encryption Circuits	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G28	3			Not Qualified	e3	30	260
VMS115	NXP Semiconductors	DATA ENCRYPTION CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100		3.4 mm	14 mm	Not Qualified				20 mm
VMS113	NXP Semiconductors	DATA ENCRYPTION CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD	S-PQCC-J44		4.57 mm	16.5862 mm	Not Qualified				16.5862 mm
DS2160	Maxim Integrated	DATA ENCRYPTION CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP24,.6	Telecom Encryption Circuits	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24				Not Qualified	e0
DS2160Q	Maxim Integrated	DATA ENCRYPTION CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			5 V	5	CHIP CARRIER	LDCC28,.5SQ	Telecom Encryption Circuits	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J28				Not Qualified	e0
HS1-3447-8	Renesas Electronics	DATA ENCRYPTION CIRCUIT		THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC	NO		CMOS	38535Q/M;38534H;883B			4.6/6,4.6/7.8	IN-LINE	DIP16,.4	Telecom Encryption Circuits	2.54 mm				DUAL	R-XDIP-T16				Not Qualified

Telecom Encryption ICs are electronic components used in telecommunications systems to provide secure communication and protect sensitive data from unauthorized access. Encryption ICs are designed to provide high levels of security for data transmitted over telecommunications networks, preventing interception and eavesdropping by unauthorized parties.

Telecom Encryption ICs use various encryption algorithms, such as Advanced Encryption Standard (AES) and Rivest–Shamir–Adleman (RSA), to encrypt and decrypt data transmitted over the network. These algorithms use complex mathematical formulas and keys to scramble and unscramble the data, making it unintelligible to anyone without the decryption key.

Some common features of Telecom Encryption ICs include:

1. High-level encryption: Encryption ICs provide high levels of encryption to ensure the security and integrity of data transmitted over the network.

2. Key management: Encryption ICs manage the encryption keys used to encrypt and decrypt data, ensuring that the keys are protected and not compromised.

3. Authentication: Encryption ICs can also provide authentication features to ensure that only authorized parties have access to the data.

4. Compatibility: Encryption ICs are designed to be compatible with various communication protocols and networks, enabling them to be integrated into a wide range of telecommunications systems.

Telecom Encryption ICs are used in a variety of applications, including secure messaging systems, mobile devices, and financial transactions. They are also used in government and military communications systems to ensure the secure transmission of sensitive information.