NXP Semiconductors - MCIMX356AVM4B

MCIMX356AVM4B by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX356AVM4B
Description SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCIMX356AVM4B Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.22 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 400
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B400
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.47 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA400,20X20,32
Length: 17 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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