Digital Transmission Controllers

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	ISDN Access Rate	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PEF22554HTV31SLL6Z	Intel	FRAMER
DS2141AQ+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			CHIP CARRIER			1.27 mm	70 Cel			0 Cel	MATTE TIN	QUAD		S-PQCC-J44		3	4.57 mm			16.585 mm	Not Qualified		e3	30	260	16.585 mm
DS2141AQ	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5		CHIP CARRIER	LDCC44,.7SQ	Digital Transmission Controllers	1.27 mm	70 Cel			0 Cel	TIN LEAD	QUAD		S-PQCC-J44		3	4.57 mm			16.585 mm	Not Qualified		e0			16.585 mm
PEF22554HTV31	Intel	FRAMER
MT9076BB1	Microchip Technology	FRAMER	INDUSTRIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V			FLATPACK, LOW PROFILE			.65 mm	85 Cel			-40 Cel	MATTE TIN	QUAD		S-PQFP-G80			1.6 mm			14 mm	Not Qualified		e3			14 mm
DS2155L	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	70 Cel			0 Cel	TIN LEAD	QUAD		S-PQFP-G100		3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified		e0			14 mm
DS2155L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	70 Cel			0 Cel	MATTE TIN	QUAD		S-PQFP-G100		3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified		e3	30	260	14 mm
DS2155LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	85 Cel			-40 Cel	TIN LEAD	QUAD		S-PQFP-G100		3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified		e0			14 mm
DS2155LN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3		FLATPACK, LOW PROFILE, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD		S-PQFP-G100		3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified		e3	30	260	14 mm
82V2108PXG8	Renesas Electronics	FRAMER	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3		FLATPACK, FINE PITCH	QFP128,.67X.93,20	Digital Transmission Controllers	.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD		R-PQFP-G128			3.4 mm			14 mm	Not Qualified		e3			20 mm
DS2143Q	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5		CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel			0 Cel	TIN LEAD	QUAD		S-PQCC-J44		3	4.57 mm		CEPT PCM-30/E-1	16.585 mm	Not Qualified		e0		245	16.585 mm
DS2143Q+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V			CHIP CARRIER			1.27 mm	70 Cel			0 Cel	MATTE TIN	QUAD		S-PQCC-J44		3	4.57 mm			16.585 mm	Not Qualified		e3	30	260	16.585 mm
IDT82V2108PXG8	Renesas Electronics	FRAMER	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3		FLATPACK, FINE PITCH	QFP128,.67X.93,20	Digital Transmission Controllers	.5 mm	85 Cel			-40 Cel	MATTE TIN	QUAD		R-PQFP-G128			3.4 mm			14 mm	Not Qualified		e3			20 mm
DS3112N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3		GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	85 Cel			-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B256		3	2.34 mm			27 mm	Not Qualified		e0			27 mm
DS3112N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3		GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	85 Cel			-40 Cel	MATTE TIN	BOTTOM		S-PBGA-B256		3	2.34 mm			27 mm	Not Qualified		e3			27 mm
DS2155LNC2+	Analog Devices	FRAMER
DS3112+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3		GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	70 Cel			0 Cel	MATTE TIN	BOTTOM		S-PBGA-B256		3	2.34 mm			27 mm	Not Qualified		e3			27 mm
DS3112	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3		GRID ARRAY	BGA256,20X20,50	Digital Transmission Controllers	1.27 mm	70 Cel			0 Cel	TIN LEAD	BOTTOM		S-PBGA-B256		3	2.34 mm			27 mm	Not Qualified		e0			27 mm
DS3112DK	Analog Devices	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			GRID ARRAY			1.27 mm	70 Cel			0 Cel	TIN LEAD	BOTTOM		S-PBGA-B256			2.34 mm			27 mm	Not Qualified		e0			27 mm
DS21458N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3		GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel			-40 Cel	MATTE TIN	BOTTOM		S-PBGA-B256		3	1.5 mm			17 mm	Not Qualified		e3			17 mm
DS21458N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3		GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel			-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B256		3	1.5 mm			17 mm	Not Qualified		e0			17 mm
PEF2256HV2XSLL76	Intel	FRAMER		GULL WING	80	QFP	UNSPECIFIED	PLASTIC/EPOXY	YES	1						FLATPACK									QUAD		X-PQFP-G80										NOT SPECIFIED	NOT SPECIFIED
PM4351-RGI	Microchip Technology	FRAMER	INDUSTRIAL	BALL	81	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V			GRID ARRAY				85 Cel			-40 Cel	MATTE TIN	BOTTOM		S-PBGA-B81									e3
TP3404V	Texas Instruments	TIME SLOT ASSIGNER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	BASIC	CHIP CARRIER	LDCC28,.5SQ	Digital Transmission Interfaces	1.27 mm	70 Cel	2.4 V	.4 V	0 Cel	TIN LEAD	QUAD	.144 Mbps	S-PQCC-J28	U	2A	4.57 mm			11.43 mm	Not Qualified	1 Amp	e0		245	11.43 mm
TP3404V/NOPB	Texas Instruments	TIME SLOT ASSIGNER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	BASIC	CHIP CARRIER	LDCC28,.5SQ	Digital Transmission Interfaces	1.27 mm	70 Cel	2.4 V	.4 V	0 Cel	MATTE TIN	QUAD	.144 Mbps	S-PQCC-J28	U	3	4.57 mm			11.43 mm	Not Qualified	1 Amp	e3	30	245	11.43 mm
TP3404V/63SN	Texas Instruments	TIME SLOT ASSIGNER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES				5 V	5	BASIC	CHIP CARRIER	LDCC28,.5SQ	Digital Transmission Interfaces	1.27 mm	70 Cel	2.4 V	.4 V	0 Cel	MATTE TIN	QUAD	.144 Mbps	S-PQCC-J28	U	2A					Not Qualified	1 Amp	e3	30	245
DS34S104GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3		GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256		3	1.76 mm			17 mm	Not Qualified		e1	30	260	17 mm
DS34T102GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.55 mA	1.8 V	1.8/3.3		GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B484		3	2.41 mm			23 mm	Not Qualified		e1	30	260	23 mm
DS26514GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.25 mA	1.8 V	1.8,3.3		GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256		3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified		e1	30	260	17 mm
DS26503LN+GSW	Analog Devices	FRAMER
DS34S132GNA2+	Analog Devices	FRAMER	INDUSTRIAL			BGA				1			3.3 V						1 mm	85 Cel			-40 Cel						3	2.41 mm			27 mm						27 mm
DS26518GN	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.45 mA	1.8 V	1.8,3.3		GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel			-40 Cel		BOTTOM		S-PBGA-B256		3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified				245	17 mm
DS34T108GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.55 mA	1.8 V	1.8/3.3		GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B484		3	2.41 mm			23 mm	Not Qualified		e1	30	260	23 mm
DS26518GNB1+	Analog Devices	FRAMER
DS26514	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	UNSPECIFIED	YES	1			1.8 V			GRID ARRAY			1 mm	85 Cel			-40 Cel	TIN LEAD	BOTTOM		S-XBGA-B256			1.76 mm			17 mm	Not Qualified		e0			17 mm
DS34S108GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3		GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B484		3	2.41 mm			23 mm	Not Qualified		e1	30	260	23 mm
DS26514GN	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.25 mA	1.8 V	1.8,3.3		GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel			-40 Cel		BOTTOM		S-PBGA-B256		3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified					17 mm
DS26518GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.45 mA	1.8 V	1.8,3.3		GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel			-40 Cel		BOTTOM		S-PBGA-B256		3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified			30	260	17 mm
DS26504LN+GSW	Analog Devices	FRAMER
DS33R11+CJ2	Analog Devices	FRAMER
DS26528DK	Analog Devices	FRAMER
DS26518DK	Analog Devices	FRAMER
DS34S101GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3		GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256		3	1.76 mm			17 mm	Not Qualified		e1	30	260	17 mm
DS26401DK	Analog Devices	FRAMER
DS34S102GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3		GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel			-40 Cel		BOTTOM		S-PBGA-B256		3	1.76 mm			17 mm	Not Qualified					17 mm
DS26519DK	Analog Devices	FRAMER
DS34T104GN+	Analog Devices	FRAMER	INDUSTRIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.55 mA	1.8 V	1.8/3.3		GRID ARRAY	BGA484,22X22,40	Digital Transmission Interfaces	1 mm	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B484		3	2.41 mm			23 mm	Not Qualified		e1	30	260	23 mm
DS3171+	Analog Devices	FRAMER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.273 mA	3.3 V	3.3		GRID ARRAY	BGA400,20X20,50	Other Telecom ICs	1.27 mm	70 Cel			0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400			2.54 mm			27 mm	Not Qualified		e1			27 mm

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.