Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Wakefield Thermal Solutions |
HEAT SINK |
U |
ALUMINUM |
8.6 mm |
6.4 mm |
ANODIZED |
BLACK |
.82 g |
12.7 mm |
||||||||||
|
Crydom |
HEAT SINK |
SCREW |
ALUMINUM ALLOY |
RELAY |
LONGITUDINAL |
2 ohm |
80 mm |
45 mm |
353 g |
81 mm |
|||||||||
|
Boyd |
HEAT SINK |
U |
EXTRUDED |
10.16 mm |
12.7 mm |
SN/NI |
GRAY |
TR,13 INCH |
26.16 mm |
||||||||||
|
Ohmite Manufacturing |
HEAT SINK |
ALUMINUM |
TRANSISTOR |
EXTRUDED |
10.16 mm |
12.7 mm |
ANODIZED |
BLACK |
TR, 13 INCH |
3.8 g |
25.91 mm |
||||||||
|
Fischer Elektronik & Kg |
HEAT SINK |
COPPER |
IC |
10 mm |
13 mm |
BULK |
3.6 g |
26 mm |
|||||||||||
|
Boyd |
HEAT SINK |
U |
ALUMINUM |
TRANSISTOR |
CLIP |
27.3 ohm |
19.05 mm |
12.7 mm |
ANODIZED |
BLACK |
14.48 mm |
||||||||
|
Fischer Elektronik & Kg |
HEAT SINK |
ALUMINUM ALLOY |
TRANSISTOR |
TRANSVERSE |
25 ohm |
20.5 mm |
7 mm |
ANODIZED |
BLACK |
25 mm |
|||||||||
|
Crydom |
HEAT SINK |
||||||||||||||||||
|
Fischer Elektronik & Kg |
HEAT SINK |
IC |
FIN |
6 mm |
35 mm |
BLACK ANODIZED |
35 mm |
||||||||||||
|
Fischer Elektronik & Kg |
HEAT SINK |
COPPER |
IC |
10 mm |
13 mm |
TAPE AND REEL |
3.6 g |
26 mm |
|||||||||||
|
Boyd |
HEAT SINK |
SCREW |
ALUMINUM |
TRANSISTOR |
FIN |
TRANSVERSE |
24 ohm |
9.65 mm |
19.05 mm |
ANODIZED |
BLACK |
LOW PROFILE |
19.05 mm |
||||||
|
Boyd |
HEAT SINK |
U |
ALUMINUM |
CLIP |
TRANSVERSE |
27.3 ohm |
19.05 mm |
12.7 mm |
ANODIZED |
BLACK |
14.48 mm |
||||||||
|
Fischer Elektronik & Kg |
HEAT SINK |
COPPER |
IC |
10 mm |
8 mm |
BULK |
2.2 g |
26 mm |
|||||||||||
Assmann Wsw Components |
||||||||||||||||||||
|
Ohmite Manufacturing |
HEAT SINK |
CLIP |
ALUMINUM ALLOY |
TRANSISTOR |
EXTRUDED |
LONGITUDINAL |
11 ohm |
30.5 mm |
16 mm |
ANODIZED |
BLACK |
BULK |
12 g |
23.1 mm |
|||||
|
Fischer Elektronik & Kg |
HEAT SINK |
COPPER |
IC |
10 mm |
31 mm |
TIN LEAD |
3.9 g |
13 mm |
|||||||||||
|
Fischer Elektronik & Kg |
HEAT SINK |
ALUMINUM |
TRANSISTOR |
18 ohm |
8.3 mm |
25 mm |
29.4 mm |
||||||||||||
|
Fischer Elektronik & Kg |
HEAT SINK |
ALUMINUM |
TRANSISTOR |
12.7 mm |
14.5 mm |
ANODIZED |
BLACK |
19.05 mm |
|||||||||||
|
Boyd |
HEAT SINK |
COPPER |
IC |
FOLDEDBACK |
11 ohm |
11.43 mm |
19.38 mm |
TIN |
TAPE AND REEL |
25.4 mm |
|||||||||
|
Boyd |
HEAT SINK |
COPPER |
IC |
FOLDEDBACK |
11 ohm |
19.38 mm |
11.43 mm |
TIN |
25.4 mm |
||||||||||
|
Boyd |
HEAT SINK |
ALUMINUM |
IC |
EXTRUDED |
LONGITUDINAL |
17.4 ohm |
25.4 mm |
16.26 mm |
ANODIZED |
BLACK |
16.26 mm |
||||||||
|
Fischer Elektronik & Kg |
HEAT SINK |
ALUMINUM |
TRANSISTOR |
FIN |
12.7 mm |
14.5 mm |
ANODIZED |
BLACK |
19.05 mm |
||||||||||
|
Ohmite Manufacturing |
HEAT SINK |
ALUMINUM |
OMNIDIRECT |
50.8 mm |
25 mm |
ANODIZED |
BLACK |
51 g |
42 mm |
||||||||||
|
Fischer Elektronik & Kg |
HEAT SINK |
COPPER |
IC |
10 mm |
13 mm |
TAPE AND REEL |
3.3 g |
23 mm |
|||||||||||
Celduc Relais |
HEAT SINK |
|||||||||||||||||||
|
Fischer Elektronik & Kg |
HEAT SINK |
ADHESIVE |
IC |
OMNIDIRECT |
20 ohm |
14 mm |
14 mm |
ANODIZED |
BLACK |
14 mm |
|||||||||
|
Boyd |
HEAT SINK |
ALUMINUM |
CLIP |
27.3 ohm |
12.7 mm |
14.48 mm |
ANODIZED |
BLACK |
19.05 mm |
||||||||||
Celduc Relais |
HEAT SINK |
|||||||||||||||||||
|
Crydom |
HEAT SINK |
||||||||||||||||||
|
Ohmite Manufacturing |
HEAT SINK |
ALUMINUM |
OMNIDIRECT |
25.4 mm |
25 mm |
ANODIZED |
BLACK |
25 g |
42 mm |
||||||||||
|
Wakefield-vette |
HEAT SINK |
ALUMINUM |
OMNIDIRECT |
12.7 mm |
46 mm |
ANODIZED |
BLACK |
31.75 g |
46 mm |
||||||||||
|
Boyd |
HEAT SINK |
SOLDER |
COPPER |
IC |
15 ohm |
9.52 mm |
14.99 mm |
TIN |
TR |
25.91 mm |
|||||||||
|
Assmann Wsw Components |
|||||||||||||||||||
|
Boyd |
HEAT SINK |
U |
ALUMINUM |
FIN |
TRANSVERSE |
16.7 ohm |
29.97 mm |
12.7 mm |
ANODIZED |
BLACK |
25.4 mm |
||||||||
Ohmite Manufacturing |
HEAT SINK |
ALUMINUM |
9.5 mm |
13.2 mm |
ANODIZED |
BLACK |
19.1 mm |
|||||||||||||
|
Ohmite Manufacturing |
HEAT SINK |
||||||||||||||||||
|
Boyd |
HEAT SINK |
ALUMINUM |
EXTRUDED |
RADIAL |
13.4 ohm |
25.4 mm |
12.7 mm |
ANODIZED |
BLACK |
34.9 mm |
|||||||||
|
TE Connectivity |
HEAT SINK |
CLIP |
COLD-FORGED ALUMINUM,ALUMINUM |
TRANSCEIVER |
PIN FIN |
CSA, UL |
6.5 mm |
18 mm |
NICKEL |
57.25 mm |
15 W |
||||||||
|
Boyd |
HEAT SINK |
ALUMINUM |
SLIDE ON |
FOLDEDBACK |
21.2 ohm |
19.05 mm |
9.9 mm |
ANODIZED |
BLACK |
20.57 mm |
|||||||||
|
Wakefield-vette |
HEAT SINK |
EXTRUDED |
66.7 mm |
120.7 mm |
530.71 g |
140.2 mm |
|||||||||||||
Ohmite Manufacturing |
HEAT SINK |
ALUMINUM |
FLARED |
RADIAL |
38.1 mm |
12.7 mm |
ANODIZED |
BLACK |
15.88 g |
34.9 mm |
||||||||||
|
Ohmite Manufacturing |
HEAT SINK |
ALUMINUM |
OMNIDIRECT |
38.1 mm |
25 mm |
ANODIZED |
BLACK |
38 g |
42 mm |
||||||||||
|
Boyd |
HEAT SINK |
PIN FIN ARRAY |
ALUMINUM |
FIN |
OMNIDIRECT |
10 mm |
27 mm |
ANODIZED |
BLACK |
27 mm |
|||||||||
|
Wakefield Thermal Solutions |
HEAT SINK |
CLIP |
ALUMINIUM ALLOY |
IC |
EXTRUDED |
PIN FIN |
10.03 ohm |
12 mm |
35 mm |
BLACK ANODIZED |
35 mm |
||||||||
TDK |
HEAT SINK |
CONVERTER |
FIN PIN |
OMNIDIRECT |
8.24 ohm |
5.7 mm |
37.4 mm |
14.6 g |
50 mm |
|||||||||||
|
Boyd |
HEAT SINK |
COPPER |
TRANSISTOR |
15 ohm |
9.52 mm |
14.99 mm |
TIN |
25.91 mm |
|||||||||||
|
Wakefield-vette |
HEAT SINK |
EXTRUDED |
25.4 mm |
25.4 mm |
24.95 g |
41.9 mm |
|||||||||||||
|
Fischer Elektronik & Kg |
HEAT SINK |
COPPER |
IC |
10 mm |
8 mm |
BULK |
2.5 g |
31 mm |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.