Cellphone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD9361BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			e1		260	10 mm
CC1101RGPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.5 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
AD9361BBCZ-REEL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			e1		260	10 mm
AD9361BBCZ-CSL	Analog Devices	RF AND BASEBAND CIRCUIT		BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			150 mA	1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.7 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
NRF9160-SICA-B1A-R7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-N127		1.1 mm	10.5 mm						16 mm
NRF9160-SICA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-N127		1.1 mm	10.5 mm						16 mm
CC1101RGPT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.5 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
NRF9160-SIAA-B1A-R7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-N127		1.1 mm	10.5 mm						16 mm
NRF9160-SIAA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-N127		1.1 mm	10.5 mm						16 mm
NRF9160-SIBA-B1A-R7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-N127		1.1 mm	10.5 mm						16 mm
CC1101RGP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.5 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
S2-LPQTR	STMicroelectronics	RF AND BASEBAND CIRCUIT																								3						NOT SPECIFIED	260
ADL5561ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	1 mm	3 mm			e3	30	260	3 mm
ST25R3911B-AQFT	STMicroelectronics	RF AND BASEBAND CIRCUIT																				MATTE TIN				3					e3		260
LMH2110TMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		5.5 mA	4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.675 mm	.84 mm			e1	30	260	1.24 mm
ADF4360-4BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ST25R3916-AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
NRF24L01-REEL	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2	.95 mm	4 mm			e3		260	4 mm
ADF4360-7BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
BG95M1LA-64-SGNS	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	102	QMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		QUAD		R-XQMA-N102		2.2 mm	19.9 mm		EXTENDED TEMP AVAILABLE WITH -40 TO 85				23.6 mm
BG77LA-64-SGNS	Quectel Wireless Solutions	BASEBAND CIRCUIT		NO LEAD	94		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V						75 Cel	-35 Cel		BOTTOM		R-XBGA-N94		1.7 mm	12.9 mm		Extended Temperature Range also available -40 to 85				14.9 mm
ADF4360-4BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
A7682E	Simcom Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	85	XMA	SQUARE	UNSPECIFIED	NO	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N85		2.4 mm	19.6 mm						19.6 mm
LARA-R6001D-00B	U-blox Ag	RF AND BASEBAND CIRCUIT
SARA-R510M8S-00B	U-blox Ag	RF AND BASEBAND CIRCUIT
SARA-R410M-02B-01	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA96(UNSPEC)			65 Cel	-20 Cel		BOTTOM		R-XLGA-N96	4	2.78 mm	16 mm		-40 to 85 extended operating temp available				26 mm
ADF4360-4BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
SARA-R410M-02B	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM		R-XBGA-N96	4	2.78 mm	16 mm						26 mm
NRF24L01	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	2	.95 mm	4 mm			e3		260	4 mm
LE910C1EU06T060100	Telit Communications Plc	RF AND BASEBAND CIRCUIT		NO LEAD	181	XMA	SQUARE	UNSPECIFIED	NO	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N181		2.2 mm	28.2 mm						28.2 mm
ADL5561ACPZ-WP	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	1 mm	3 mm			e3	30	260	3 mm
ME310G1WW04T050400	Telit Communications Plc	RF AND BASEBAND CIRCUIT		NO LEAD	94	XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N94		2.6 mm	15 mm						18 mm
EG91EXGA-128-SGNS	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	102	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		UNSPECIFIED		R-XXMA-N102		2.3 mm	25 mm		Also has Extended temp from -40 Deg c to 85 Deg c				29 mm
OC2321VQFN8XTMA2	Infineon Technologies	RF AND BASEBAND CIRCUIT		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.24		1.27 mm	105 Cel	-40 Cel		DUAL		R-PDSO-N8	1	.9 mm	6 mm						5 mm
MAX4003EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
MAX4003EUA+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
LE910C1EU10T100700	Telit Communications Plc	RF AND BASEBAND CIRCUIT		NO LEAD		XMA	SQUARE	UNSPECIFIED	NO	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-N181		2.2 mm	28.2 mm						28.2 mm
CC110LRGPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	.6 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified		e4	30	260	4 mm
BGA725L6E6327FTSA1	Infineon Technologies	BASEBAND CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER			.2 mm	85 Cel	-40 Cel	GOLD	BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm			e4			1.1 mm
SARA-R422M8S-00B	U-blox Ag	RF AND BASEBAND CIRCUIT
BC66NB-04-STD	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	58	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		QUAD		R-XQMA-N58		2 mm	15.8 mm		EXTENDED TEMP AVAILABLE WITH -40 TO 85				17.7 mm
SARA-R422S-00B	U-blox Ag	RF AND BASEBAND CIRCUIT
HMC832LP6GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	.9 mm	6 mm			e3			6 mm
AD9361BBC-CSH	Analog Devices	RF AND BASEBAND CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
AT86RF233-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified		e3			5 mm
SARA-R422S-01B	U-blox Ag	RF AND BASEBAND CIRCUIT
LMH2110TM/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		5.5 mA	4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.675 mm	.84 mm			e1	30	260	1.24 mm
SARA-R422M10S-01B	U-blox Ag	RF AND BASEBAND CIRCUIT

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.