Other Function Telecom Interface ICs
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
35 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-XQMA-N35 |
2.2 mm |
13.2 mm |
e3 |
20.1 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
.4 mm |
75 Cel |
-25 Cel |
QUAD |
S-XQCC-N48 |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
40 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.7 V |
MICROELECTRONIC ASSEMBLY |
MODULE,40LEAD(UNSPEC) |
1.2 mm |
70 Cel |
-20 Cel |
UNSPECIFIED |
R-XXMA-N40 |
2.5 mm |
15 mm |
29 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
35 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,35LEAD(UNSPEC) |
1.2 mm |
85 Cel |
-40 Cel |
QUAD |
3 Mbps |
R-XQMA-N35 |
2.4 mm |
13.4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
75 Cel |
-25 Cel |
TIN |
QUAD |
S-XQCC-N48 |
.95 mm |
6 mm |
e3 |
6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
75 Cel |
-25 Cel |
QUAD |
S-XQCC-N48 |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
75 Cel |
-25 Cel |
TIN |
QUAD |
S-XQCC-N48 |
.95 mm |
6 mm |
e3 |
6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
75 Cel |
-25 Cel |
QUAD |
S-XQCC-N48 |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
75 Cel |
-25 Cel |
QUAD |
S-XQCC-N48 |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
73 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
BOTTOM |
S-XBCC-N73 |
2 |
.85 mm |
7 mm |
e3 |
7 mm |
||||||||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
35 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,35LEAD(UNSPEC) |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
3 Mbps |
R-XXMA-N35 |
2.4 mm |
13.4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
25.6 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
75 Cel |
-25 Cel |
TIN |
QUAD |
S-XQCC-N48 |
.95 mm |
6 mm |
e3 |
6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,32LEAD(UNSPEC) |
1 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
UNSPECIFIED |
3 Mbps |
R-XXMA-N32 |
2.4 mm |
13.4 mm |
e4 |
25.8 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N38 |
3.2 mm |
18 mm |
30 |
250 |
25.5 mm |
||||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
73 |
HLGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
GRID ARRAY, HEAT SINK/SLUG |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-N73 |
2 |
.85 mm |
7 mm |
7 mm |
||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
BUTT |
100 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.7 V |
2.9/4.8 |
GRID ARRAY |
LGA100(UNSPEC) |
Other Telecom ICs |
.7 mm |
70 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
100 Mbps |
R-PBGA-B100 |
3 |
2 mm |
13.3 mm |
Not Qualified |
e4 |
30 |
260 |
13.4 mm |
|||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,20LEAD(UNSPEC) |
2 mm |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
DUAL |
.3 Mbps |
R-XDMA-T20 |
24.4 mm |
e4 |
29.9 mm |
||||||||||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
TELECOM CIRCUIT |
3 |
240 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
3.3 |
MICROELECTRONIC ASSEMBLY |
MODULE,36LEAD,.8 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-XDMA-N36 |
2.7 mm |
21 mm |
Not Qualified |
e3 |
31 mm |
||||||||||||||||||||||||||||||||||||||
|
|
STMicroelectronics |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
TELECOM CIRCUIT |
NO LEAD |
40 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
MODULE,40LEAD(UNSPEC) |
UNSPECIFIED |
3 Mbps |
R-XXMA-N40 |
2.7 mm |
13.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
26 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
73 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-XBCC-N73 |
2 |
.85 mm |
7 mm |
7 mm |
||||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
75 Cel |
-25 Cel |
QUAD |
S-XQCC-N48 |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
BALL |
62 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
75 Cel |
-25 Cel |
BOTTOM |
R-PBGA-B62 |
.55 mm |
3.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3.83 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
2.5/3.3 |
CHIP CARRIER |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N16 |
3 |
1 mm |
4 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4 mm |
||||||||||||||||||||||||||||||||||
|
|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
102 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
75 Cel |
-35 Cel |
UNSPECIFIED |
1.119 Mbps |
R-XXMA-N102 |
2.2 mm |
19.9 mm |
SEATED HGT-NOM; Data Rate(kbps) :For LTE Cat M1-588(DL), Cat NB2-127(DL), 158.5(UL) |
23.6 mm |
||||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
75 Cel |
-25 Cel |
QUAD |
S-XQCC-N48 |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,16LEAD(UNSPEC) |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
.0086 Mbps |
R-XXMA-N16 |
2.16 mm |
9 mm |
30 |
260 |
11.5 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
Murata Manufacturing |
TELECOM CIRCUIT |
OTHER |
BUTT |
46 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.6 V |
MICROELECTRONIC ASSEMBLY |
70 Cel |
-30 Cel |
UNSPECIFIED |
R-XXMA-B46 |
3 |
1.1 mm |
5.15 mm |
6.95 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.5 Mbps |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
1 |
.95 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B144 |
3 |
1.7 mm |
10 mm |
e1 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,16LEAD(UNSPEC) |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
.01 Mbps |
R-XXMA-N16 |
2.16 mm |
9 mm |
11.5 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
33 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N33 |
2.1 mm |
11 mm |
13.9 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
|
STMicroelectronics |
TELECOM CIRCUIT |
NO LEAD |
86 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
GRID ARRAY |
LGA86(UNSPEC) |
.45 mm |
85 Cel |
-40 Cel |
BOTTOM |
2 Mbps |
R-XLGA-N86 |
1.428 mm |
7.3 mm |
11 mm |
||||||||||||||||||||||||||||||||||||||||||
|
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
AEC-Q100 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
4 |
2.6 mm |
12.2 mm |
16 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-T20 |
1 |
2 mm |
24.4 mm |
29.9 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
93 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA93,10X10,14 |
.35 mm |
85 Cel |
-40 Cel |
BOTTOM |
2 Mbps |
R-PBGA-B93 |
1 |
.514 mm |
3.544 mm |
3.607 mm |
||||||||||||||||||||||||||||||||||||||||
|
|
Laird Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
39 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
.75 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N39 |
3 |
2.2 mm |
10 mm |
30 |
260 |
14 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.2 Mbps |
S-PQCC-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
BALL |
62 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
75 Cel |
-25 Cel |
BOTTOM |
S-PBGA-B62 |
.55 mm |
3.83 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3.83 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
33 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N33 |
2.1 mm |
11 mm |
13.9 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
|
Nordic Semiconductor Asa |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.95 mm |
4 mm |
Not Qualified |
4 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N38 |
3.3 mm |
18 mm |
30 |
260 |
19.2 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,16LEAD(UNSPEC) |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
.01 Mbps |
R-XXMA-N16 |
2.16 mm |
9 mm |
11.5 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
U-blox Ag |
GNSS Module |
INDUSTRIAL |
BUTT |
54 |
LGA |
RECTANGULAR |
YES |
1 |
TS 16949 |
3 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B54 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,32LEAD(UNSPEC) |
1 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
UNSPECIFIED |
3 Mbps |
R-XXMA-N32 |
2.4 mm |
13.4 mm |
e4 |
25.8 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
150 Mbps |
R-XDMA-N38 |
3 |
3.45 mm |
18 mm |
250 |
31.4 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.