Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Maximum Noise | Battery Supply (V) | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Minimum Power Supply Rejection Ratio (PSRR) | Additional Features | Battery Feed | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Motorola |
SLIC |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
BIPOLAR |
-48 V |
.2 mA |
2-4 CONVERSION |
-48 |
IN-LINE |
DIP18,.3 |
Analog Transmission Interfaces |
2.54 mm |
70 Cel |
10 dBrnC |
-48 |
0 Cel |
TIN LEAD |
DUAL |
R-GDIP-T18 |
5.08 mm |
7.62 mm |
Not Qualified |
CONSTANT CURRENT |
e0 |
22.73 mm |
||||||||||
Motorola |
SLIC |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
-48 V |
2-4 CONVERSION |
-48 |
IN-LINE |
DIP18,.3 |
Analog Transmission Interfaces |
2.54 mm |
70 Cel |
-48 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
CONSTANT CURRENT |
e0 |
||||||||||||||||
Motorola |
SLIC |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
2-4 CONVERSION |
IN-LINE |
DIP18,.3 |
Analog Transmission Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
RESISTIVE |
e0 |
|||||||||||||||||||
Motorola |
SLIC |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
2-4 CONVERSION |
IN-LINE |
DIP18,.3 |
Analog Transmission Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
RESISTIVE |
e0 |
|||||||||||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.1 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
2970 Mbps |
S-XQCC-N16 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||
Motorola |
SLIC |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
-48 V |
2-4 CONVERSION |
-48 |
IN-LINE |
DIP18,.3 |
Analog Transmission Interfaces |
2.54 mm |
70 Cel |
-48 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
CONSTANT CURRENT |
e0 |
||||||||||||||||
Motorola |
SLIC |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
BIPOLAR |
2-4 CONVERSION |
IN-LINE |
DIP18,.3 |
Analog Transmission Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T18 |
Not Qualified |
RESISTIVE |
e0 |
|||||||||||||||||||
Motorola |
SLIC |
COMMERCIAL |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
2-4 CONVERSION |
IN-LINE |
DIP18,.3 |
Analog Transmission Interfaces |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
RESISTIVE |
e0 |
|||||||||||||||||||
Microchip Technology |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
1 |
.95 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.11 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
2970 Mbps |
S-XQCC-N16 |
3 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.1 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
2970 Mbps |
S-XQCC-N20 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
2.5 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16X.2,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N24 |
2 |
.8 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
||||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.11 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
2970 Mbps |
S-XQCC-N16 |
3 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.11 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
2970 Mbps |
S-XQCC-N16 |
3 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.1 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
2970 Mbps |
S-XQCC-N16 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.077 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
3 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
||||||||||||
Microchip Technology |
SLIC |
GULL WING |
80 |
HLQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
2-4 CONVERSION |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE |
.65 mm |
85 Cel |
19 dBrnC |
-40 Cel |
QUAD |
S-PQFP-G80 |
1.6 mm |
14 mm |
40 dB |
14 mm |
|||||||||||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.077 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
540 Mbps |
S-XQCC-N16 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 |
2.5 V |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16X.2,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQCC-N24 |
2 |
.8 mm |
4 mm |
Not Qualified |
e4 |
30 |
260 |
5 mm |
||||||||||||
Texas Instruments |
LINE EQUALIZER |
OTHER |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.077 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-N16 |
1 |
.8 mm |
4 mm |
Not Qualified |
e0 |
260 |
4 mm |
|||||||||||||
Renesas Electronics |
SLIC |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
8 mA |
5 V |
2-4 CONVERSION |
CHIP CARRIER |
LDCC28,.5SQ |
1.27 mm |
75 Cel |
19 dBrnC |
-24 TO -48 |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J28 |
3 |
4.57 mm |
11.505 mm |
CONSTANT CURRENT/RESISTIVE |
e3 |
30 |
245 |
11.505 mm |
|||||||||||
Intel |
SLIC |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
1 |
UNSPECIFIED |
|||||||||||||||||||||||||||||||||||
Silicon Labs |
SLIC |
INDUSTRIAL |
GULL WING |
38 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP38,.25,20 |
Analog Transmission Interfaces |
.5 mm |
85 Cel |
15 dBrnC |
-96 TO -10 |
-40 Cel |
DUAL |
R-PDSO-G38 |
1.2 mm |
4.4 mm |
Not Qualified |
40 dB |
CONSTANT CURRENT |
40 |
260 |
9.7 mm |
|||||||||||
Silicon Labs |
SLIC |
INDUSTRIAL |
GULL WING |
38 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP38,.25,20 |
Analog Transmission Interfaces |
.5 mm |
85 Cel |
15 dBrnC |
-96 TO -10 |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G38 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
40 dB |
CONSTANT CURRENT |
e3 |
40 |
260 |
9.7 mm |
||||||||
Silicon Labs |
SLIC |
COMMERCIAL |
NO LEAD |
40 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N40 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
Silicon Labs |
2 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
SLIC |
INDUSTRIAL |
J BEND |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.003 mA |
5 V |
2-4 CONVERSION |
5 |
CHIP CARRIER |
LDCC32,.5X.6 |
Analog Transmission Interfaces |
1.27 mm |
85 Cel |
13 dBrnC |
-24 AND -48 |
-40 Cel |
TIN LEAD |
QUAD |
R-PQCC-J32 |
1 |
3.55 mm |
11.43 mm |
Not Qualified |
CONSTANT CURRENT/RESISTIVE |
e0 |
13.97 mm |
||||||||||
Silicon Labs |
2 |
40 |
260 |
||||||||||||||||||||||||||||||||||||||
Microchip Technology |
SLIC |
GULL WING |
80 |
HLQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
2-4 CONVERSION |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE |
.65 mm |
85 Cel |
19 dBrnC |
-40 Cel |
QUAD |
S-PQFP-G80 |
1.6 mm |
14 mm |
40 dB |
14 mm |
|||||||||||||||||||
Silicon Labs |
SLIC |
NO LEAD |
38 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC38,.16X.24,16 |
.4 mm |
85 Cel |
14 dBrnC |
-100 TO -15 |
-40 Cel |
QUAD |
R-XQCC-N38 |
.9 mm |
4 mm |
CONSTANT CURRENT/RESISTIVE |
6 mm |
|||||||||||||||||||
Silicon Labs |
SLIC |
NO LEAD |
38 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC38,.16X.24,16 |
.4 mm |
85 Cel |
14 dBrnC |
-100 TO -15 |
-40 Cel |
QUAD |
R-XQCC-N38 |
.9 mm |
4 mm |
CONSTANT CURRENT/RESISTIVE |
6 mm |
|||||||||||||||||||
Texas Instruments |
LINE EQUALIZER |
OTHER |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.077 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
0 Cel |
MATTE TIN |
QUAD |
1485 Mbps |
S-XQCC-N16 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.078 mA |
2.5 V |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
2970 Mbps |
S-XQCC-N24 |
1 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||
Semtech |
LINE EQUALIZER |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
164 mA |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.16X.24,16 |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
R-XQCC-N40 |
3 |
1 mm |
4 mm |
e4 |
40 |
260 |
6 mm |
||||||||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.1 mA |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
2970 Mbps |
S-XQCC-N16 |
1 |
.8 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
|||||||||||||||
STMicroelectronics |
SLIC |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
SOP8,.3 |
1.27 mm |
125 Cel |
-120 TO 120 |
-55 Cel |
DUAL |
R-PDSO-G8 |
1 |
2.1 mm |
5.24 mm |
Hybrid fiber coax (HFC) AVAILABLE |
CONSTANT CURRENT/RESISTIVE |
5.3 mm |
|||||||||||||||||||
Microsemi |
SLIC |
COMMERCIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
FLATPACK, THIN PROFILE |
.8 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G44 |
1.2 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
45 mA |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N10 |
2 |
.8 mm |
2.5 mm |
e4 |
30 |
260 |
2.5 mm |
|||||||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.077 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N16 |
3 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
||||||||||||
Texas Instruments |
LINE EQUALIZER |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.077 mA |
3.3 V |
3.3 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
0 Cel |
MATTE TIN |
DUAL |
1485 Mbps |
R-PDSO-G16 |
1 |
1.753 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
9.902 mm |
|||||||||||
Texas Instruments |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
.065 mA |
2.5 V |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.16SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
2970 Mbps |
S-XQCC-N16 |
3 |
.8 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
||||||||||
Intersil |
SLIC |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.0135 mA |
5 V |
2-4 CONVERSION |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Analog Transmission Interfaces |
1.27 mm |
85 Cel |
13 dBrnC |
+100 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
1 |
4.57 mm |
11.505 mm |
Not Qualified |
45 dB |
CONSTANT CURRENT |
e0 |
11.505 mm |
||||||||
Microchip Technology |
LINE EQUALIZER |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
1 |
.95 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
|||||||||||||||||
Silicon Labs |
SLIC |
COMMERCIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
3.3/5 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Analog Transmission Interfaces |
.5 mm |
70 Cel |
15 dBrnC |
-15 TO -99 |
0 Cel |
QUAD |
S-PQFP-G64 |
1.2 mm |
10 mm |
Not Qualified |
40 dB |
CONSTANT CURRENT |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
|||||||||||
Silicon Labs |
SLIC |
COMMERCIAL |
NO LEAD |
40 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N40 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||
Silicon Labs |
SLIC |
NO LEAD |
42 |
HLGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
2-4 CONVERSION |
GRID ARRAY, HEAT SINK/SLUG |
LCC42,.27X.2,20 |
.5 mm |
70 Cel |
12 dBrnC |
-15 TO -110 |
0 Cel |
BOTTOM |
R-XLGA-N42 |
.9 mm |
5 mm |
CONSTANT CURRENT/RESISTIVE |
7 mm |
||||||||||||||||||
Silicon Labs |
SLIC |
||||||||||||||||||||||||||||||||||||||||
Intersil |
SLIC |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
.006 mA |
5 V |
2-4 CONVERSION |
5/12 |
IN-LINE |
DIP24,.6 |
Analog Transmission Interfaces |
2.54 mm |
75 Cel |
5 dBrnC |
-48 |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T24 |
6.35 mm |
15.24 mm |
Not Qualified |
15 dB |
CONSTANT CURRENT |
e0 |
31 mm |
Analog data transmission interfaces are used to transmit analog signals between electronic devices. They are commonly used in a variety of applications, such as audio and video equipment, medical devices, and industrial control systems.
Analog data transmission interfaces typically consist of a transmitter and a receiver. The transmitter converts the analog signal into a form that can be transmitted over a communication channel, such as a wire or radio frequency signal. The receiver then converts the transmitted signal back into its original analog form.
Some common types of analog data transmission interfaces include:
1. Analog audio interfaces: These are used to transmit audio signals between electronic devices, such as microphones, amplifiers, and speakers. Examples include XLR, RCA, and TRS connectors.
2. Composite video interfaces: These are used to transmit analog video signals, such as those used in standard definition television. Examples include RCA and BNC connectors.
3. VGA interfaces: These are used to transmit analog video signals from computers and other devices to displays, such as computer monitors and projectors.
4. Analog sensor interfaces: These are used to transmit analog signals from sensors, such as temperature sensors or pressure sensors, to electronic devices that can process and analyze the data.
Analog data transmission interfaces offer several advantages over digital interfaces. They are often simpler and less expensive to implement, and they can provide high-quality audio and video signals without the need for compression or conversion. However, they can also be susceptible to interference and noise, and their performance may be limited by the quality of the transmission channel.