Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Lattice Semiconductor |
EE PLD |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
64 |
36 |
PAD-TYPE |
1.8 |
1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
83 |
.5 mm |
90 Cel |
4 DEDICATED INPUTS, 32 I/O |
4 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
111 MHz |
40 |
32 |
260 |
7 mm |
YES |
32 |
|||||||
|
Xilinx |
EE PLD |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
256 |
CMOS |
3.3 |
3/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
2.7 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 120 I/O |
0 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e4 |
105 MHz |
20 mm |
YES |
120 |
||||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
9.1 ns |
YES |
1.89 V |
1700 |
CMOS |
203 |
1.8 |
1.8,1.2/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
1 mm |
85 Cel |
203 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
1.55 mm |
17 mm |
Not Qualified |
YES |
e1 |
247.5 MHz |
203 |
17 mm |
YES |
203 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
3.6 V |
32 |
32 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.8 mm |
105 Cel |
2 DEDICATED INPUTS, 30 I/O |
2 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
156 MHz |
40 |
30 |
260 |
10 mm |
YES |
30 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
32 |
32 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.8 mm |
105 Cel |
2 DEDICATED INPUTS, 30 I/O |
2 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
111 MHz |
40 |
30 |
260 |
10 mm |
YES |
30 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
128 |
96 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.64SQ,16 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.4 mm |
105 Cel |
4 DEDICATED INPUTS, 92 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G128 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
111 MHz |
40 |
92 |
260 |
14 mm |
YES |
92 |
|||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
4 ns |
YES |
1.9 V |
32 |
CMOS |
1.8 |
1.5/3.3,1.8 |
FLATPACK, THIN PROFILE |
LCC32,.2SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.8 mm |
70 Cel |
33 I/O |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e3 |
450 MHz |
30 |
260 |
10 mm |
YES |
33 |
|||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
324 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
11.2 ns |
YES |
1.89 V |
1700 |
CMOS |
271 |
1.8 |
1.8,1.2/3.3 |
GRID ARRAY, LOW PROFILE |
BGA324,18X18,40 |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
1 mm |
85 Cel |
271 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
1.55 mm |
19 mm |
Not Qualified |
YES |
e1 |
201.1 MHz |
271 |
19 mm |
YES |
271 |
|||||||||
|
Microchip Technology |
FLASH PLD |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
15 ns |
YES |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
TUBE |
5 |
SMALL OUTLINE |
SOP20,.4 |
Programmable Logic Devices |
MACROCELL |
4.5 V |
64 |
1.27 mm |
85 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
45 MHz |
40 |
8 |
250 |
12.8 mm |
8 |
|||||||
|
Microchip Technology |
EE PLD |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
15 ns |
YES |
5.5 V |
10 |
CMOS |
5 |
TUBE |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
Programmable Logic Devices |
NO |
MACROCELL |
4.5 V |
.65 mm |
85 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
NO |
e3 |
44 MHz |
7.8 mm |
NO |
10 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
COMMERCIAL EXTENDED |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Programmable Logic Devices |
MACROCELL |
4.75 V |
132 |
1.27 mm |
75 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
Not Qualified |
e3 |
55.5 MHz |
40 |
10 |
245 |
11.5062 mm |
10 |
||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
3.6 V |
64 |
36 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
90 Cel |
4 DEDICATED INPUTS, 32 I/O |
4 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
156 MHz |
40 |
32 |
260 |
7 mm |
YES |
32 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
128 |
74 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
105 Cel |
10 DEDICATED INPUTS, 64 I/O |
10 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
111 MHz |
40 |
64 |
260 |
14 mm |
YES |
64 |
|||||||
Cypress Semiconductor |
FLASH PLD |
COMMERCIAL EXTENDED |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Programmable Logic Devices |
MACROCELL |
4.75 V |
132 |
1.27 mm |
75 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
4.572 mm |
11.5316 mm |
Not Qualified |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
e0 |
76.9 MHz |
10 |
11.5316 mm |
10 |
|||||||||||
|
Renesas Electronics |
OT PLD |
NO LEAD |
12 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
12 |
9 |
PLA-TYPE |
1.8 |
CHIP CARRIER, VERY THIN PROFILE |
LCC12,.06SQ,16 |
NO |
MACROCELL |
1.71 V |
.4 mm |
85 Cel |
1 DEDICATED INPUTS, 8 I/O |
1 |
-40 Cel |
QUAD |
S-XQCC-N12 |
1 |
.6 mm |
1.6 mm |
CAN ALSO OPERATE AT 3.3V OR 5V SUPPLY |
8 |
1.6 mm |
NO |
8 |
||||||||||||||||
|
Renesas Electronics |
OT PLD |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
AEC-Q100 |
18 |
PLA-TYPE |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
NO |
MACROCELL |
1.71 V |
.65 mm |
105 Cel |
1 DEDICATED INPUTS, 17 I/O |
1 |
-40 Cel |
DUAL |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
17 |
6.5 mm |
NO |
17 |
||||||||||||||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 64 I/O |
0 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e4 |
333 MHz |
14 mm |
YES |
64 |
||||||||||
Lattice Semiconductor |
EE PLD |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 |
CHIP CARRIER |
LDCC20,.4SQ |
Programmable Logic Devices |
MACROCELL |
4.75 V |
64 |
1.27 mm |
70 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
0 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
Not Qualified |
PROGRAMMABLE OUTPUT POLARITY |
e0 |
66.7 MHz |
30 |
8 |
225 |
8.9662 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
2.5 ns |
YES |
3.6 V |
32 |
32 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.8 mm |
90 Cel |
2 DEDICATED INPUTS, 30 I/O |
2 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e3 |
250 MHz |
40 |
30 |
260 |
10 mm |
YES |
30 |
|||||||
|
Intel |
FLASH PLD |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
17.7 ns |
YES |
1.89 V |
192 |
CMOS |
114 |
1.8 |
1.8,1.2/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
.5 mm |
100 Cel |
114 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e3 |
118.3 MHz |
114 |
20 mm |
YES |
114 |
|||||||||
|
Microchip Technology |
FLASH PLD |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.5 V |
CMOS |
22 |
PAL-TYPE |
3.3 |
TUBE |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Programmable Logic Devices |
MACROCELL |
3 V |
132 |
1.27 mm |
85 Cel |
10 DEDICATED INPUTS, 10 I/O |
10 |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J28 |
4.572 mm |
11.5062 mm |
Not Qualified |
e3 |
71.4 MHz |
10 |
11.5062 mm |
10 |
||||||||||
|
Intel |
LOADABLE PLD |
INDUSTRIAL |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
.8 ns |
4992 |
YES |
3.6 V |
CMOS |
189 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
REGISTERED |
3 V |
.5 mm |
85 Cel |
4 DEDICATED INPUTS, 189 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
Not Qualified |
e3 |
189 |
32 mm |
189 |
||||||||||||
|
Intel |
EE PLD |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
32 |
CMOS |
36 |
PLA-TYPE |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
1024 |
.8 mm |
85 Cel |
0 DEDICATED INPUTS, 36 I/O |
0 |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
Not Qualified |
e3 |
138.9 MHz |
30 |
36 |
260 |
10 mm |
YES |
36 |
|||||
|
Intel |
EE PLD |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
70 Cel |
0 DEDICATED INPUTS, 36 I/O |
0 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
Not Qualified |
64 MICROCELLS; 4 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3 |
e3 |
100 MHz |
30 |
260 |
10 mm |
YES |
36 |
||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
2.5 ns |
YES |
3.6 V |
64 |
36 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
90 Cel |
4 DEDICATED INPUTS, 32 I/O |
4 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
250 MHz |
40 |
32 |
260 |
7 mm |
YES |
32 |
|||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
256 |
CMOS |
184 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
1 mm |
85 Cel |
0 DEDICATED INPUTS, 184 I/O |
0 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e1 |
108 MHz |
30 |
184 |
260 |
17 mm |
YES |
184 |
|||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
BALL |
56 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA56,10X10,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 45 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B56 |
3 |
1.35 mm |
6 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e1 |
333 MHz |
30 |
260 |
6 mm |
YES |
45 |
||||||||
Intel |
FLASH PLD |
OTHER |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
14 ns |
YES |
1.89 V |
192 |
79 |
1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
79 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
e0 |
118.3 MHz |
79 |
14 mm |
79 |
|||||||||||||||||
Microchip Technology |
FLASH PLD |
INDUSTRIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
20 ns |
YES |
5.5 V |
CMOS |
22 |
5 |
TR |
SMALL OUTLINE |
SOP24,.4 |
MACROCELL |
4.5 V |
132 |
1.27 mm |
85 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
-40 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
38.5 MHz |
10 |
15.4 mm |
NO |
10 |
||||||||||||||||
|
Intel |
FLASH PLD |
OTHER |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
5.4 ns |
YES |
2.625 V |
440 |
CMOS |
76 |
2.5 |
1.5/3.3,2.5/3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 76 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e3 |
76 |
14 mm |
YES |
76 |
|||||||||
Xilinx |
FLASH PLD |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
5.25 V |
108 |
CMOS |
5 |
3.3/5,5 |
CHIP CARRIER |
LDCC84,1.2SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
1.27 mm |
70 Cel |
0 DEDICATED INPUTS, 69 I/O |
0 |
0 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
Not Qualified |
YES |
e0 |
30 |
225 |
29.3116 mm |
YES |
69 |
||||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
6 ns |
YES |
3.6 V |
288 |
CMOS |
117 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 117 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e3 |
208.3 MHz |
30 |
117 |
260 |
20 mm |
YES |
117 |
||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
64 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
7.9 ns |
YES |
1.89 V |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
30 I/O |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
1.2 mm |
4.5 mm |
Not Qualified |
e1 |
184.1 MHz |
4.5 mm |
30 |
||||||||||||||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
64 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
14 ns |
YES |
1.89 V |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
30 I/O |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
3 |
1.2 mm |
4.5 mm |
Not Qualified |
e1 |
118.3 MHz |
30 |
260 |
4.5 mm |
30 |
|||||||||||||||||
|
Intel |
FLASH PLD |
BALL |
256 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
10 ns |
YES |
2.625 V |
980 |
CMOS |
212 |
2.5 |
1.5/3.3,2.5/3.3 |
GRID ARRAY |
BGA256,20X20,20 |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
.5 mm |
100 Cel |
0 DEDICATED INPUTS, 212 I/O |
0 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B256 |
3 |
11 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e1 |
212 |
11 mm |
YES |
212 |
|||||||||||
Lattice Semiconductor |
EE PLD |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
13 ns |
YES |
5.25 V |
32 |
CMOS |
5 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
1.27 mm |
70 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
Not Qualified |
YES |
e0 |
77 MHz |
30 |
225 |
16.5862 mm |
NO |
32 |
|||||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
6 ns |
YES |
1.9 V |
32 |
CMOS |
1.8 |
1.5/3.3,1.8 |
FLATPACK, THIN PROFILE |
LCC32,.2SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.8 mm |
85 Cel |
33 I/O |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e4 |
300 MHz |
10 mm |
YES |
33 |
|||||||||||
|
Microchip Technology |
EE PLD |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
3.6 V |
32 |
CMOS |
3.3 |
TUBE |
3 |
CHIP CARRIER |
LDCC44,.7SQ |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
1.27 mm |
85 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
Not Qualified |
YES |
e3 |
100 MHz |
40 |
245 |
16.5862 mm |
YES |
32 |
|||||||
|
Microchip Technology |
FLASH PLD |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
15 ns |
YES |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
TUBE |
5 |
SMALL OUTLINE |
SOP20,.4 |
Programmable Logic Devices |
MACROCELL |
4.5 V |
64 |
1.27 mm |
85 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
45 MHz |
40 |
8 |
250 |
12.8 mm |
8 |
|||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
7 ns |
YES |
2.625 V |
1700 |
CMOS |
272 |
2.5 |
1.5/3.3,2.5/3.3 |
GRID ARRAY |
BGA324,18X18,40 |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
1 mm |
85 Cel |
0 DEDICATED INPUTS, 272 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.2 mm |
19 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e1 |
272 |
19 mm |
YES |
272 |
|||||||||
|
Intel |
EE PLD |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
128 |
CMOS |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 96 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e3 |
98 MHz |
20 mm |
YES |
96 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 |
CHIP CARRIER |
LDCC20,.4SQ |
Programmable Logic Devices |
MACROCELL |
4.75 V |
64 |
1.27 mm |
70 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
Not Qualified |
e3 |
100 MHz |
40 |
8 |
250 |
8.9662 mm |
8 |
||||||||
|
Lattice Semiconductor |
EE PLD |
COMMERCIAL EXTENDED |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Programmable Logic Devices |
MACROCELL |
4.75 V |
132 |
1.27 mm |
75 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
Not Qualified |
e3 |
142.8 MHz |
40 |
10 |
245 |
11.5062 mm |
10 |
||||||||
Xilinx |
FLASH PLD |
COMMERCIAL |
BALL |
56 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
4 ns |
YES |
1.9 V |
32 |
CMOS |
1.8 |
1.5/3.3,1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA56,10X10,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
70 Cel |
33 I/O |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B56 |
3 |
1.35 mm |
6 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e0 |
450 MHz |
30 |
240 |
6 mm |
YES |
33 |
||||||||||
Microchip Technology |
FLASH PLD |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
15 ns |
NO |
5.5 V |
CMOS |
MIL-PRF-38535; MIL-STD-883 |
22 |
PAL-TYPE |
5 |
5 |
IN-LINE |
DIP24,.3 |
Programmable Logic Devices |
MACROCELL |
4.5 V |
132 |
2.54 mm |
125 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
-55 Cel |
Tin/Lead (Sn/Pb) - hot dipped |
DUAL |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
50 MHz |
NOT SPECIFIED |
10 |
NOT SPECIFIED |
32 mm |
10 |
|||||||||
|
Intel |
EE PLD |
COMMERCIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
4.5 ns |
YES |
3.6 V |
64 |
CMOS |
36 |
PLA-TYPE |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
2048 |
.8 mm |
70 Cel |
0 DEDICATED INPUTS, 36 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
Not Qualified |
e3 |
222.2 MHz |
36 |
10 mm |
YES |
36 |
|||||||
Intel |
EE PLD |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
10 ns |
YES |
5.5 V |
128 |
CMOS |
84 |
5 |
3.3/5,5 |
FLATPACK |
QFP100,.7X.9 |
Programmable Logic Devices |
YES |
MACROCELL |
4.5 V |
.65 mm |
85 Cel |
0 DEDICATED INPUTS, 84 I/O |
0 |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3 |
3.65 mm |
14 mm |
Not Qualified |
CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
e0 |
125 MHz |
84 |
20 mm |
YES |
84 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.