Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Lattice Semiconductor |
EE PLD |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
256 |
CMOS |
1.8 |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
14 DEDICATED INPUTS, 96 I/O |
14 |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e3 |
111 MHz |
40 |
260 |
20 mm |
YES |
96 |
|||||||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
36 |
CMOS |
34 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
85 Cel |
0 DEDICATED INPUTS, 34 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e3 |
138.88 MHz |
30 |
34 |
260 |
10 mm |
YES |
34 |
||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
256 |
CMOS |
1.8 |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
10 DEDICATED INPUTS, 64 I/O |
10 |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
YES |
e3 |
111 MHz |
40 |
260 |
14 mm |
YES |
64 |
|||||||||||
|
Intel |
FLASH PLD |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC |
14 ns |
SURFACE MOUNT |
64 |
CMOS |
AEC-Q100 |
1.8,1.2/3.3 |
FLATPACK |
TQFP64,.35SQ,16 |
Programmable Logic Devices |
YES |
.4 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||
|
Intel |
LOADABLE PLD |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
.6 ns |
576 |
YES |
5.25 V |
CMOS |
134 |
5 |
3.3/5 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
REGISTERED |
4.75 V |
.5 mm |
70 Cel |
4 DEDICATED INPUTS, 134 I/O |
4 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
576 LOGIC ELEMENTS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
e3 |
67.11 MHz |
134 |
28 mm |
134 |
||||||||||
|
Intel |
EE PLD |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
512 |
CMOS |
3.3 |
2.5/3.3,3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 172 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
YES |
e3 |
28 mm |
YES |
172 |
|||||||||||
Intel |
LOADABLE PLD |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
2.02 ns |
4160 |
YES |
1.89 V |
CMOS |
84 |
1.8 |
1.8,1.8/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
4 DEDICATED INPUTS, 92 I/O |
4 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e0 |
84 |
20 mm |
92 |
|||||||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
100 |
BGA |
SQUARE |
PLASTIC/EPOXY |
7 ns |
YES |
2.625 V |
440 |
CMOS |
76 |
2.5 |
1.5/3.3,2.5/3.3 |
GRID ARRAY |
BGA100,11X11,20 |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 76 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
3 |
6 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e1 |
76 |
6 mm |
YES |
76 |
||||||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.8 mm |
85 Cel |
0 DEDICATED INPUTS, 33 I/O |
0 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e4 |
200 MHz |
10 mm |
YES |
33 |
||||||||||
|
Intel |
FLASH PLD |
OTHER |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.9 ns |
YES |
1.89 V |
192 |
CMOS |
79 |
1.8 |
1.8,1.2/3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
79 I/O |
0 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
YES |
e3 |
184.1 MHz |
30 |
79 |
260 |
14 mm |
YES |
79 |
||||||
|
Intel |
EE PLD |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
4 ns |
YES |
2.625 V |
128 |
CMOS |
2.5 |
1.8/3.3,2.5 |
FLATPACK, LOW PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 84 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
Not Qualified |
YES |
e3 |
243.9 MHz |
14 mm |
YES |
84 |
||||||||||
|
Intel |
FLASH PLD |
OTHER |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
4.7 ns |
YES |
2.625 V |
192 |
CMOS |
80 |
2.5 |
1.5/3.3,2.5/3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 80 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e3 |
80 |
14 mm |
YES |
80 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
32 |
36 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
105 Cel |
4 DEDICATED INPUTS, 32 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
111 MHz |
40 |
32 |
260 |
7 mm |
YES |
32 |
|||||||
|
Lattice Semiconductor |
EE PLD |
COMMERCIAL EXTENDED |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Programmable Logic Devices |
MACROCELL |
4.75 V |
132 |
1.27 mm |
75 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-J28 |
1 |
4.572 mm |
11.5062 mm |
Not Qualified |
e3 |
83.3 MHz |
40 |
10 |
245 |
11.5062 mm |
10 |
||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
BALL |
48 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
72 |
CMOS |
38 |
3.3 |
2.5/3.3,3.3 |
GRID ARRAY, FINE PITCH |
BGA48,7X7,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
70 Cel |
0 DEDICATED INPUTS, 38 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B48 |
3 |
1.8 mm |
7 mm |
Not Qualified |
72 MACROCELLS |
e1 |
100 MHz |
30 |
38 |
260 |
7 mm |
YES |
38 |
||||||
|
Lattice Semiconductor |
EE PLD |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
25 ns |
NO |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 |
IN-LINE |
DIP20,.3 |
Programmable Logic Devices |
MACROCELL |
4.75 V |
64 |
2.54 mm |
70 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
Not Qualified |
e3 |
37 MHz |
8 |
260 |
26.162 mm |
8 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
256 |
CMOS |
1.8 |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
10 DEDICATED INPUTS, 64 I/O |
10 |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
YES |
e3 |
111 MHz |
40 |
260 |
14 mm |
YES |
64 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
64 |
36 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
130 Cel |
4 DEDICATED INPUTS, 32 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
111 MHz |
40 |
32 |
260 |
7 mm |
YES |
32 |
|||||||
|
Intel |
FLASH PLD |
AUTOMOTIVE |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
17.7 ns |
YES |
1.89 V |
440 |
CMOS |
1.8 |
1.8,1.2/3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
.5 mm |
125 Cel |
74 I/O |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
YES |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
YES |
74 |
|||||||||||||
|
Microchip Technology |
EE PLD |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.5 V |
5 |
TR |
FLATPACK, THIN PROFILE, FINE PITCH |
MACROCELL |
4.5 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 64 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
e3 |
125 MHz |
14 mm |
64 |
|||||||||||||||||||
|
Microchip Technology |
EE PLD |
INDUSTRIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
25 ns |
YES |
5.5 V |
5 |
TR |
FLATPACK, THIN PROFILE |
MACROCELL |
4.5 V |
.8 mm |
85 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
1.2 mm |
10 mm |
e3 |
60 MHz |
10 mm |
32 |
|||||||||||||||||||
|
Intel |
EE PLD |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.5 V |
128 |
CMOS |
5 |
3.3/5,5 |
FLATPACK, LOW PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.5 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 84 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
Not Qualified |
CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
e3 |
125 MHz |
14 mm |
YES |
84 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
32 |
36 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
105 Cel |
4 DEDICATED INPUTS, 32 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
86 MHz |
40 |
32 |
260 |
7 mm |
YES |
32 |
|||||||
|
Microchip Technology |
FLASH PLD |
INDUSTRIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
TUBE |
5 |
CHIP CARRIER |
LDCC20,.4SQ |
Programmable Logic Devices |
MACROCELL |
4.5 V |
64 |
1.27 mm |
85 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
4.572 mm |
8.966 mm |
Not Qualified |
e3 |
45 MHz |
8 |
8.966 mm |
8 |
||||||||||
|
Intel |
EE PLD |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
256 |
CMOS |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 120 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e3 |
126.6 MHz |
20 mm |
YES |
120 |
||||||||||
|
Microchip Technology |
FLASH PLD |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
15 ns |
NO |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
TUBE |
5 |
IN-LINE |
DIP20,.3 |
Programmable Logic Devices |
MACROCELL |
4.5 V |
64 |
2.54 mm |
85 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
Not Qualified |
e3 |
45 MHz |
8 |
25.908 mm |
8 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
3.6 V |
256 |
110 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
90 Cel |
14 DEDICATED INPUTS, 96 I/O |
14 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
156 MHz |
40 |
96 |
260 |
20 mm |
YES |
96 |
|||||||
|
Xilinx |
EE PLD |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
128 |
CMOS |
3.3 |
3/3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
2.7 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 84 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
YES |
e3 |
95 MHz |
30 |
260 |
14 mm |
YES |
84 |
||||||||
|
Intel |
FLASH PLD |
AUTOMOTIVE |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.89 V |
1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
MACROCELL |
1.71 V |
.4 mm |
125 Cel |
54 I/O |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
1.2 mm |
7 mm |
e3 |
7 mm |
54 |
|||||||||||||||||||||||
|
Microchip Technology |
FLASH PLD |
INDUSTRIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
5.5 V |
CMOS |
PAL-TYPE |
5 |
TUBE |
5 |
CHIP CARRIER |
LDCC20,.4SQ |
Programmable Logic Devices |
MACROCELL |
4.5 V |
64 |
1.27 mm |
85 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
4.572 mm |
8.966 mm |
Not Qualified |
e3 |
45 MHz |
8 |
8.966 mm |
8 |
|||||||||||
|
Intel |
LOADABLE PLD |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
1.73 ns |
4160 |
YES |
1.89 V |
CMOS |
84 |
1.8 |
1.8,1.8/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
4 DEDICATED INPUTS, 92 I/O |
4 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
84 |
20 mm |
92 |
||||||||||||
Intel |
FLASH PLD |
COMMERCIAL EXTENDED |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
2.625 V |
192 |
CMOS |
80 |
2.5 |
1.5/3.3,2.5/3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 80 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e0 |
80 |
14 mm |
YES |
80 |
||||||||||
|
Renesas Electronics |
OT PLD |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
19 |
13 |
PLA-TYPE |
2.5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
YES |
MACROCELL |
2.3 V |
.65 mm |
85 Cel |
0 DEDICATED INPUTS, 13 I/O |
0 |
-40 Cel |
DUAL |
R-PDSO-G20 |
1 |
1.2 mm |
4.4 mm |
15 |
6.5 mm |
NO |
13 |
|||||||||||||||||
|
Intel |
FLASH PLD |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
14 ns |
YES |
1.89 V |
64 |
CMOS |
1.8 |
1.8,1.2/3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
.5 mm |
100 Cel |
79 I/O |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
YES |
e3 |
118.3 MHz |
14 mm |
YES |
79 |
||||||||||||
|
Microchip Technology |
EE PLD |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
20 ns |
YES |
3.6 V |
3.3 |
TUBE |
CHIP CARRIER |
MACROCELL |
3 V |
1.27 mm |
85 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
3 |
4.572 mm |
16.586 mm |
Not Qualified |
e3 |
83.3 MHz |
40 |
245 |
16.586 mm |
32 |
|||||||||||||||
Intel |
LOADABLE PLD |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
1.73 ns |
4160 |
YES |
1.89 V |
CMOS |
84 |
1.8 |
1.8,1.8/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
4 DEDICATED INPUTS, 92 I/O |
4 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e0 |
84 |
20 mm |
92 |
|||||||||||||
|
Intel |
FLASH PLD |
INDUSTRIAL |
BALL |
100 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
17.7 ns |
YES |
1.89 V |
440 |
CMOS |
1.8 |
1.8,1.2/3.3 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA100,11X11,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
.5 mm |
100 Cel |
74 I/O |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
1.2 mm |
6 mm |
Not Qualified |
YES |
e1 |
118.3 MHz |
6 mm |
YES |
74 |
||||||||||||
|
Intel |
EE PLD |
INDUSTRIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.5 V |
192 |
CMOS |
5 |
3.3/5,5 |
FLATPACK |
QFP160,1.2SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.5 V |
.65 mm |
85 Cel |
0 DEDICATED INPUTS, 124 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G160 |
3 |
4.07 mm |
28 mm |
Not Qualified |
192 MACROCELLS; 12 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
e3 |
125 MHz |
28 mm |
YES |
124 |
||||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
72 |
CMOS |
36 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 52 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
72 MACROCELLS |
e3 |
125 MHz |
30 |
36 |
260 |
10 mm |
YES |
52 |
||||||
|
Intel |
FLASH PLD |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
14 ns |
YES |
1.89 V |
128 |
CMOS |
1.8 |
1.2/3.3,1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
.5 mm |
100 Cel |
79 I/O |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
YES |
e3 |
118.3 MHz |
14 mm |
YES |
79 |
||||||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
64 |
CMOS |
1.8 |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
10 DEDICATED INPUTS, 64 I/O |
10 |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
YES |
e3 |
111 MHz |
40 |
260 |
14 mm |
YES |
64 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
256 |
132 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
90 Cel |
4 DEDICATED INPUTS, 128 I/O |
4 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G176 |
3 |
1.6 mm |
21 mm |
Not Qualified |
e3 |
111 MHz |
40 |
128 |
260 |
21 mm |
YES |
128 |
|||||||
Microchip Technology |
FLASH PLD |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
15 ns |
NO |
5.5 V |
CMOS |
MIL-STD-883 |
22 |
PAL-TYPE |
5 |
TUBE |
5 |
IN-LINE |
DIP24,.3 |
Programmable Logic Devices |
MACROCELL |
4.5 V |
132 |
2.54 mm |
125 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
Not Qualified |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
e0 |
55.5 MHz |
10 |
32 mm |
10 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
128 |
CMOS |
1.8 |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
10 DEDICATED INPUTS, 64 I/O |
10 |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
YES |
e3 |
111 MHz |
40 |
260 |
14 mm |
YES |
64 |
|||||||||||
|
Intel |
EE PLD |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.25 V |
64 |
CMOS |
5 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
1.27 mm |
70 Cel |
0 DEDICATED INPUTS, 36 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
Not Qualified |
YES |
e3 |
125 MHz |
16.5862 mm |
NO |
36 |
||||||||||
|
Microchip Technology |
EE PLD |
COMMERCIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
5.25 V |
64 |
CMOS |
64 |
5 |
TRAY |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
YES |
MACROCELL |
4.75 V |
40 |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 64 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
POWER -UP RESET; SECURITY FUSE |
e3 |
166.7 MHz |
64 |
14 mm |
YES |
64 |
||||||||||
|
Microchip Technology |
EE PLD |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
5.25 V |
64 |
CMOS |
32 |
5 |
TUBE |
CHIP CARRIER |
LDCC44,.7SQ |
YES |
MACROCELL |
4.75 V |
40 |
1.27 mm |
70 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
3 |
4.57 mm |
16.5862 mm |
Not Qualified |
POWER -UP RESET; SECURITY FUSE |
e3 |
166.7 MHz |
40 |
32 |
245 |
16.5862 mm |
YES |
32 |
||||||
|
Microchip Technology |
FLASH PLD |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
7.5 ns |
YES |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
TUBE |
5 |
SMALL OUTLINE |
SOP24,.4 |
Programmable Logic Devices |
MACROCELL |
4.5 V |
132 |
1.27 mm |
70 Cel |
10 DEDICATED INPUTS, 10 I/O |
10 |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
125 MHz |
10 |
15.4 mm |
10 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.