Programmable Logic Devices (PLD)

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	Propagation Delay	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of Macro Cells	Technology Used	No. of Inputs	Architecture	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	In-System Programmable	Output Function	Minimum Supply Voltage	No. of Product Terms	Pitch Of Terminal	Maximum Operating Temperature	Organization	No. of Dedicated Inputs	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length	JTAG Boundary Scan Test	No. of I/O Lines
GAL22V10D-4LJN	Lattice Semiconductor	EE PLD	COMMERCIAL EXTENDED	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	4 ns		YES	5.25 V		CMOS	22	PAL-TYPE	5		5	CHIP CARRIER	LDCC28,.5SQ	Programmable Logic Devices		MACROCELL	4.75 V	132	1.27 mm	75 Cel	11 DEDICATED INPUTS, 10 I/O	11	0 Cel	Matte Tin (Sn)	QUAD	S-PQCC-J28	1	4.572 mm	11.5062 mm	Not Qualified		e3	167 MHz	40	10	245	11.5062 mm		10
ISPLSI2064A-80LT100I	Lattice Semiconductor	EE PLD	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	18.5 ns		YES	5.5 V	64	CMOS			5		5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Programmable Logic Devices	YES	MACROCELL	4.5 V		.5 mm	85 Cel	0 DEDICATED INPUTS, 64 I/O	0	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	YES	e0	57 MHz	30		240	14 mm	NO	64
XC2C256-7CPG132C	Xilinx	FLASH PLD	COMMERCIAL	BALL	132	TFBGA	SQUARE	PLASTIC/EPOXY	7.5 ns		YES	1.9 V	256	CMOS	106	PLA-TYPE	1.8		1.5/3.3,1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA132,14X14,20	Programmable Logic Devices	YES	MACROCELL	1.7 V		.5 mm	70 Cel	0 DEDICATED INPUTS, 106 I/O	0	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B132	3	1.1 mm	8 mm	Not Qualified	REAL DIGITAL DESIGN TECHNOLOGY	e1	300 MHz	30	106	260	8 mm	YES	106
XC9572XL-7VQ64C	Xilinx	FLASH PLD	COMMERCIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	7.5 ns		YES	3.6 V	72	CMOS	36		3.3		2.5/3.3,3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Programmable Logic Devices	YES	MACROCELL	3 V		.5 mm	70 Cel	0 DEDICATED INPUTS, 52 I/O	0	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	72 MACROCELLS	e4	125 MHz		36		10 mm	YES	52
XCR3256XL-10TQG144I	Xilinx	EE PLD	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	10 ns		YES	3.6 V	256	CMOS			3.3		3/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	Programmable Logic Devices	YES	MACROCELL	2.7 V		.5 mm	85 Cel	0 DEDICATED INPUTS, 120 I/O	0	-40 Cel	MATTE TIN	QUAD	S-PQFP-G144	3	1.6 mm	20 mm	Not Qualified	YES	e3	105 MHz	30		260	20 mm	YES	120
CY37128P100-100AXC	Cypress Semiconductor	EE PLD	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	12 ns		YES	5.25 V	128	CMOS			5		3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Programmable Logic Devices	YES	MACROCELL	4.75 V		.5 mm	70 Cel	1 DEDICATED INPUTS, 69 I/O	1	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	128 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	e3	80 MHz	40		260	14 mm	YES	69
EPM2210F324C5	Intel	FLASH PLD	COMMERCIAL EXTENDED	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	11.2 ns		YES	2.625 V	1700	CMOS	272		2.5		1.5/3.3,2.5/3.3	GRID ARRAY	BGA324,18X18,40	Programmable Logic Devices	YES	MACROCELL	2.375 V		1 mm	85 Cel	0 DEDICATED INPUTS, 272 I/O	0	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B324	3	2.2 mm	19 mm	Not Qualified	IT CAN ALSO OPERATE AT 3.3V	e0			272		19 mm	YES	272
EPM570GM100C5N	Intel	FLASH PLD	OTHER	BALL	100	BGA	SQUARE	PLASTIC/EPOXY	8.7 ns		YES	1.89 V	440	CMOS	76		1.8		1.5/3.3,1.8	GRID ARRAY	BGA100,11X11,20	Programmable Logic Devices	YES	MACROCELL	1.71 V		.5 mm	85 Cel	0 DEDICATED INPUTS, 76 I/O	0	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3		6 mm	Not Qualified	IT CAN ALSO OPERATE AT 3.3V	e1			76		6 mm	YES	76
EPM570ZM100C6N	Intel	FLASH PLD	OTHER	BALL	100	BGA	SQUARE	PLASTIC/EPOXY	9.5 ns		YES	1.89 V	440	CMOS	76		1.8		1.5/3.3,1.8	GRID ARRAY	BGA100,11X11,20	Programmable Logic Devices	YES	MACROCELL	1.71 V		.5 mm	85 Cel	0 DEDICATED INPUTS, 76 I/O	0	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3		6 mm	Not Qualified	IT CAN ALSO OPERATE AT 3.3V	e1			76		6 mm	YES	76
EPM570ZM100C7N	Intel	FLASH PLD	OTHER	BALL	100	BGA	SQUARE	PLASTIC/EPOXY	15.1 ns		YES	1.89 V	440	CMOS	76		1.8		1.5/3.3,1.8	GRID ARRAY	BGA100,11X11,20	Programmable Logic Devices	YES	MACROCELL	1.71 V		.5 mm	85 Cel	0 DEDICATED INPUTS, 76 I/O	0	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3		6 mm	Not Qualified	IT CAN ALSO OPERATE AT 3.3V	e1		30	76	260	6 mm	YES	76
EPM7064AETI44-7	Intel	EE PLD	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	7.5 ns		YES	3.6 V	64	CMOS	36	PLA-TYPE	3.3		2.5/3.3,3.3	FLATPACK, LOW PROFILE	TQFP44,.47SQ,32	Programmable Logic Devices	YES	MACROCELL	3 V	2048	.8 mm	85 Cel	0 DEDICATED INPUTS, 36 I/O	0	-40 Cel	TIN LEAD	QUAD	S-PQFP-G44	3	1.27 mm	10 mm	Not Qualified		e0	135.1 MHz		36		10 mm	YES	36
EPM7128SLI84-10N	Intel	EE PLD	INDUSTRIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	10 ns		YES	5.5 V	128	CMOS			5		3.3/5,5	CHIP CARRIER	LDCC84,1.2SQ	Programmable Logic Devices	YES	MACROCELL	4.5 V		1.27 mm	85 Cel	0 DEDICATED INPUTS, 68 I/O	0	-40 Cel		QUAD	S-PQCC-J84	3	5.08 mm	29.3116 mm	Not Qualified	CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V		125 MHz				29.3116 mm	YES	68
EPM7256SRI208-10	Intel	EE PLD	INDUSTRIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	10 ns		YES	5.5 V	256	CMOS			5		3.3/5,5	FLATPACK, FINE PITCH	HQFP208,1.2SQ,20	Programmable Logic Devices	YES	MACROCELL	4.5 V		.5 mm	85 Cel	0 DEDICATED INPUTS, 164 I/O	0	-40 Cel	TIN LEAD	QUAD	S-PQFP-G208	3	4.1 mm	28 mm	Not Qualified	256 MACROCELLS; 16 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	e0	125 MHz				28 mm	YES	164
GAL22V10D-15LPNI	Lattice Semiconductor	EE PLD	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	15 ns		NO	5.5 V		CMOS	22	PAL-TYPE	5		5	IN-LINE	DIP24,.3	Programmable Logic Devices		MACROCELL	4.5 V	132	2.54 mm	85 Cel	11 DEDICATED INPUTS, 10 I/O	11	-40 Cel	Matte Tin (Sn)	DUAL	R-PDIP-T24		5.334 mm	7.62 mm	Not Qualified	10 MACROCELLS; SHARED INPUT/CLOCK	e3	55.5 MHz	NOT SPECIFIED	10	NOT SPECIFIED	31.75 mm		10
ISPLSI2064A-80LT100	Lattice Semiconductor	EE PLD	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	18.5 ns		YES	5.25 V	64	CMOS			5		5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Programmable Logic Devices	YES	MACROCELL	4.75 V		.5 mm	70 Cel	0 DEDICATED INPUTS, 64 I/O	0	0 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	YES	e0	57 MHz	30		240	14 mm	NO	64
LC4064V-10TN100I	Lattice Semiconductor	EE PLD		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	10 ns		YES	3.6 V	64		74	PAD-TYPE	3.3		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Programmable Logic Devices	YES	MACROCELL	3 V	83	.5 mm	105 Cel	10 DEDICATED INPUTS, 64 I/O	10	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified		e3	86 MHz	40	64	260	14 mm	YES	64
LC4128V-75TN100E	Lattice Semiconductor	EE PLD		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	7.5 ns		YES	3.6 V	128		74	PAD-TYPE	3.3		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Programmable Logic Devices	YES	MACROCELL	3 V	83	.5 mm	130 Cel	10 DEDICATED INPUTS, 64 I/O	10	-40 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified		e3	111 MHz	40	64	260	14 mm	YES	64
LC4256V-3FTN256BC	Lattice Semiconductor	EE PLD		BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	3 ns		YES	3.6 V	256		164	PAD-TYPE	3.3		3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Programmable Logic Devices	YES	MACROCELL	3 V	83	1 mm	90 Cel	4 DEDICATED INPUTS, 160 I/O	4	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	S-PBGA-B256	3	1.55 mm	17 mm	Not Qualified		e1	212 MHz	40	160	260	17 mm	YES	160
LC4256V-5FTN256AC	Lattice Semiconductor	EE PLD		BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	5 ns		YES	3.6 V	256		132	PAD-TYPE	3.3		3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Programmable Logic Devices	YES	MACROCELL	3 V	83	1 mm	90 Cel	4 DEDICATED INPUTS, 128 I/O	4	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	S-PBGA-B256	3	1.55 mm	17 mm	Not Qualified		e1	156 MHz	40	128	260	17 mm	YES	128
LCMXO2280C-3TN100I4W	Lattice Semiconductor	FLASH PLD		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	5.1 ns	2280	YES	3.465 V		CMOS	73		1.8		1.8/2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Field Programmable Gate Arrays		MACROCELL	1.71 V		.5 mm		7 DEDICATED INPUTS, 73 I/O	7		Matte Tin (Sn)	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	IT CAN ALSO OPERATE AT 2.5V AND 3.3V	e3	388 MHz	40	73	260	14 mm		73
LCMXO640C-3TN100I4W	Lattice Semiconductor	FLASH PLD		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	4.9 ns	640	YES	3.465 V		CMOS	74		1.8		1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Field Programmable Gate Arrays		MACROCELL	1.71 V		.5 mm		7 DEDICATED INPUTS, 74 I/O	7		Matte Tin (Sn)	QUAD	S-PQFP-G100	3	1.6 mm	14 mm	Not Qualified	IT CAN ALSO OPERATE AT 2.5V AND 3.3V	e3	388 MHz	40	74	260	14 mm		74
XC2C128-7CPG132C	Xilinx	FLASH PLD	COMMERCIAL	BALL	132	TFBGA	SQUARE	PLASTIC/EPOXY	7.5 ns		YES	1.9 V	128	CMOS	100	PLA-TYPE	1.8		1.5/3.3,1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA132,14X14,20	Programmable Logic Devices	YES	MACROCELL	1.7 V		.5 mm	70 Cel	0 DEDICATED INPUTS, 100 I/O	0	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B132	3	1.1 mm	8 mm	Not Qualified	YES	e1	119 MHz	30	100	260	8 mm	YES	100
XC95108-10PQ100I	Xilinx	FLASH PLD	INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	10 ns		YES	5.5 V	108	CMOS	81		5		3.3/5,5	FLATPACK	QFP100,.7X.9	Programmable Logic Devices	YES	MACROCELL	4.5 V		.65 mm	85 Cel	0 DEDICATED INPUTS, 81 I/O	0	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	R-PQFP-G100	3	3.4 mm	14 mm	Not Qualified		e0	66.7 MHz	30	81	225	20 mm	YES	81
XC9536XL-7CSG48I	Xilinx	FLASH PLD	INDUSTRIAL	BALL	48	FBGA	SQUARE	PLASTIC/EPOXY	7.5 ns		YES	3.6 V	36	CMOS	36		3.3		2.5/3.3,3.3	GRID ARRAY, FINE PITCH	BGA48,7X7,32	Programmable Logic Devices	YES	MACROCELL	3 V		.8 mm	85 Cel	0 DEDICATED INPUTS, 36 I/O	0	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B48	3	1.8 mm	7 mm	Not Qualified	YES	e1	138.88 MHz	30	36	260	7 mm	YES	36
XCR3128XL-10TQG144C	Xilinx	EE PLD	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	10 ns		YES	3.6 V	128	CMOS			3.3		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	Programmable Logic Devices	YES	MACROCELL	3 V		.5 mm	70 Cel	0 DEDICATED INPUTS, 108 I/O	0	0 Cel	MATTE TIN	QUAD	S-PQFP-G144	3	1.6 mm	20 mm	Not Qualified	YES	e3	95 MHz	30		260	20 mm	YES	108
XCR3256XL-12TQ144C	Xilinx	EE PLD	COMMERCIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	12 ns		YES	3.6 V	256	CMOS			3.3		3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	Programmable Logic Devices	YES	MACROCELL	3 V		.5 mm	70 Cel	0 DEDICATED INPUTS, 120 I/O	0	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G144	3	1.6 mm	20 mm	Not Qualified	YES	e4	88 MHz				20 mm	YES	120
ATF22V10CQZ-20SC	Microchip Technology	FLASH PLD	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	20 ns		YES	5.25 V		CMOS			5			SMALL OUTLINE				MACROCELL	4.75 V		1.27 mm	70 Cel	11 DEDICATED INPUTS, 10 I/O	11	0 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm				38.5 MHz				15.4 mm		10
EPF10K50RC240-3N	Intel	LOADABLE PLD	COMMERCIAL	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	.6 ns	2880	YES	5.25 V		CMOS	189		5		3.3/5	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		REGISTERED	4.75 V		.5 mm	70 Cel	4 DEDICATED INPUTS, 189 I/O	4	0 Cel	MATTE TIN	QUAD	S-PQFP-G240	3	4.1 mm	32 mm	Not Qualified	2880 LOGIC ELEMENTS	e3	66.67 MHz		189		32 mm		189
EPF6024ATC144-2N	Intel	LOADABLE PLD	OTHER	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY			YES	3.6 V					3.3			FLATPACK, LOW PROFILE, FINE PITCH				MACROCELL	3 V		.5 mm	85 Cel	4 DEDICATED INPUTS, 117 I/O	4	0 Cel	MATTE TIN	QUAD	S-PQFP-G144	3	1.6 mm	20 mm	Not Qualified	CAN ALSO BE USED 24000 LOGIC GATES	e3	153 MHz				20 mm		117
EPM3064ATC100-7N	Intel	EE PLD	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	7.5 ns		YES	3.6 V	64	CMOS			3.3		2.5/3.3,3.3	FLATPACK, LOW PROFILE, FINE PITCH	TQFP100,.63SQ	Programmable Logic Devices	YES	MACROCELL	3 V		.5 mm	70 Cel	0 DEDICATED INPUTS, 66 I/O	0	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.27 mm	14 mm	Not Qualified	YES	e3	135.1 MHz				14 mm	YES	66
EPM570T100C4N	Intel	FLASH PLD	OTHER	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	7 ns		YES	2.625 V	440	CMOS	76		2.5		1.5/3.3,2.5/3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	Programmable Logic Devices	YES	MACROCELL	2.375 V		.5 mm	85 Cel	0 DEDICATED INPUTS, 76 I/O	0	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.2 mm	14 mm	Not Qualified	IT CAN ALSO OPERATE AT 3.3V	e3			76		14 mm	YES	76
EPM7128SLC84-15N	Intel	EE PLD	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	15 ns		YES	5.25 V	128	CMOS			5		3.3/5,5	CHIP CARRIER	LDCC84,1.2SQ	Programmable Logic Devices	YES	MACROCELL	4.75 V		1.27 mm	70 Cel	0 DEDICATED INPUTS, 68 I/O	0	0 Cel	MATTE TIN	QUAD	S-PQCC-J84	3	5.08 mm	29.3116 mm	Not Qualified	CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	e3	100 MHz				29.3116 mm	YES	68
GAL16V8D-7LPN	Lattice Semiconductor	EE PLD	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	7.5 ns		NO	5.25 V		CMOS	18	PAL-TYPE	5		5	IN-LINE	DIP20,.3	Programmable Logic Devices		MACROCELL	4.75 V	64	2.54 mm	70 Cel	8 DEDICATED INPUTS, 8 I/O	8	0 Cel	MATTE TIN	DUAL	R-PDIP-T20		5.334 mm	7.62 mm	Not Qualified		e3	100 MHz	30	8	260	26.162 mm		8
LC4032V-5TN44C	Lattice Semiconductor	EE PLD		GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	5 ns		YES	3.6 V	32		32	PAD-TYPE	3.3		3.3	FLATPACK, THIN PROFILE	TQFP44,.47SQ,32	Programmable Logic Devices	YES	MACROCELL	3 V	83	.8 mm	90 Cel	2 DEDICATED INPUTS, 30 I/O	2	0 Cel	MATTE TIN	QUAD	S-PQFP-G44	3	1.2 mm	10 mm	Not Qualified		e3	156 MHz	40	30	260	10 mm	YES	30
LC4032ZC-5TN48C	Lattice Semiconductor	EE PLD		GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	5 ns		YES	1.9 V	32		36	PAD-TYPE	1.8		1.8	FLATPACK, THIN PROFILE, FINE PITCH	QFP48,.35SQ,20	Programmable Logic Devices	YES	MACROCELL	1.7 V	83	.5 mm	90 Cel	4 DEDICATED INPUTS, 32 I/O	4	0 Cel	MATTE TIN	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified		e3	156 MHz	40	32	260	7 mm	YES	32
LC4064V-10TN44I	Lattice Semiconductor	EE PLD		GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	10 ns		YES	3.6 V	64		32	PAD-TYPE	3.3		3.3	FLATPACK, THIN PROFILE	TQFP44,.47SQ,32	Programmable Logic Devices	YES	MACROCELL	3 V	83	.8 mm	105 Cel	2 DEDICATED INPUTS, 30 I/O	2	-40 Cel	MATTE TIN	QUAD	S-PQFP-G44	3	1.2 mm	10 mm	Not Qualified		e3	86 MHz	40	30	260	10 mm	YES	30
LC4128ZE-7MN144C	Lattice Semiconductor	EE PLD		BALL	144	TFBGA	SQUARE	PLASTIC/EPOXY	7.5 ns		YES	1.9 V	128	CMOS			1.8		1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA144,12X12,20	Programmable Logic Devices	YES	MACROCELL	1.7 V		.5 mm		4 DEDICATED INPUTS, 96 I/O	4		TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.1 mm	7 mm	Not Qualified	YES	e1	111 MHz	40		260	7 mm	YES	96
XCR3032XL-7VQG44C	Xilinx	EE PLD	COMMERCIAL	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	7.5 ns		YES	3.6 V	32	CMOS			3.3		3.3	FLATPACK, THIN PROFILE	TQFP44,.47SQ,32	Programmable Logic Devices	YES	MACROCELL	3 V		.8 mm	70 Cel	0 DEDICATED INPUTS, 36 I/O	0	0 Cel	MATTE TIN	QUAD	S-PQFP-G44	3	1.2 mm	10 mm	Not Qualified	YES	e3	119 MHz	30		260	10 mm	YES	36
XCR3128XL-10VQ100C	Xilinx	EE PLD	COMMERCIAL	GULL WING	100	TFQFP	SQUARE	PLASTIC/EPOXY	10 ns		YES	3.6 V	128	CMOS			3.3		3.3	FLATPACK, THIN PROFILE, FINE PITCH	TQFP100,.63SQ	Programmable Logic Devices	YES	MACROCELL	3 V		.5 mm	70 Cel	0 DEDICATED INPUTS, 84 I/O	0	0 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.2 mm	14 mm	Not Qualified	YES	e0	95 MHz	30		240	14 mm	YES	84
5M1270ZT144C4	Intel	FLASH PLD	OTHER	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	8.1 ns		YES	1.89 V					1.8			FLATPACK, LOW PROFILE, FINE PITCH				MACROCELL	1.71 V		.5 mm	85 Cel	114 I/O		0 Cel	TIN LEAD	QUAD	S-PQFP-G144		1.6 mm	20 mm	Not Qualified		e0	247.5 MHz				20 mm		114
5M240ZM100I5N	Intel	FLASH PLD	INDUSTRIAL	BALL	100	TFBGA	SQUARE	PLASTIC/EPOXY	14 ns		YES	1.89 V	192	CMOS	79		1.8		1.8,1.2/3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA100,11X11,20	Programmable Logic Devices	YES	MACROCELL	1.71 V		.5 mm	100 Cel	79 I/O	0	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100		1.2 mm	6 mm	Not Qualified	YES	e1	118.3 MHz		79		6 mm	YES	79
ATF16V8C-7SU	Microchip Technology	FLASH PLD	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	7.5 ns		YES	5.25 V		CMOS	18	PAL-TYPE	5	TUBE	5	SMALL OUTLINE	SOP20,.4	Programmable Logic Devices		MACROCELL	4.75 V	64	1.27 mm	85 Cel	7 DEDICATED INPUTS, 8 I/O	7	-40 Cel	MATTE TIN	DUAL	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified	8 MACROCELLS	e3	100 MHz		8		12.8 mm		8
ATF22V10CQZ-20JC	Microchip Technology	FLASH PLD	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	20 ns		YES	5.25 V		CMOS			5			CHIP CARRIER				MACROCELL	4.75 V		1.27 mm	70 Cel	11 DEDICATED INPUTS, 10 I/O	11	0 Cel		QUAD	S-PQCC-J28		4.572 mm	11.506 mm				38.5 MHz				11.506 mm		10
ATF22V10CQZ-20JI	Microchip Technology	FLASH PLD	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	20 ns		YES	5.5 V		CMOS			5			CHIP CARRIER				MACROCELL	4.5 V		1.27 mm	85 Cel	11 DEDICATED INPUTS, 10 I/O	11	-40 Cel		QUAD	S-PQCC-J28		4.572 mm	11.506 mm				38.5 MHz				11.506 mm		10
EPF10K50ETI144-2	Intel	LOADABLE PLD	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	.6 ns	2880	YES	2.7 V		CMOS	102		2.5		2.5,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	Field Programmable Gate Arrays		MIXED	2.3 V		.5 mm	85 Cel	102 I/O		-40 Cel	TIN LEAD	QUAD	S-PQFP-G144	3	1.6 mm	20 mm	Not Qualified		e0			102		20 mm		102
EPF10K50ETI144-2N	Intel	LOADABLE PLD	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	.6 ns	2880	YES	2.7 V		CMOS	102		2.5		2.5,2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.63SQ,20	Field Programmable Gate Arrays		MIXED	2.3 V		.5 mm	85 Cel	102 I/O		-40 Cel	MATTE TIN	QUAD	S-PQFP-G144	3	1.6 mm	20 mm	Not Qualified		e3			102		20 mm		102
EPF10K50VRC240-3N	Intel	LOADABLE PLD	COMMERCIAL	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	.5 ns	2880	YES	3.6 V		CMOS	189		3.3		3.3	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP240,1.37SQ,20	Field Programmable Gate Arrays		REGISTERED	3 V		.5 mm	70 Cel	4 DEDICATED INPUTS, 189 I/O	4	0 Cel	MATTE TIN	QUAD	S-PQFP-G240	3	4.1 mm	32 mm	Not Qualified		e3			189		32 mm		189
EPM7128SQI100-10C	Altera	EE PLD	INDUSTRIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	10 ns		YES	5.5 V		CMOS			5			FLATPACK				MACROCELL	4.5 V		.65 mm	85 Cel	0 DEDICATED INPUTS, 80 I/O	0	-40 Cel	MATTE TIN	QUAD	R-PQFP-G100		3.65 mm	14 mm	Not Qualified	CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	e3	100 MHz				20 mm		80

Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.

PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.