Xilinx - XC2C256-7FTG256I

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XC2C256-7FTG256I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2C256-7FTG256I
Description FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
Datasheet XC2C256-7FTG256I Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Propagation Delay: 7.5 ns
Organization: 0 DEDICATED INPUTS, 184 I/O
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.55 mm
No. of Inputs: 184
Sub-Category: Programmable Logic Devices
Surface Mount: YES
No. of Outputs: 184
Position Of Terminal: BOTTOM
No. of Terminals: 256
JTAG Boundary Scan Test: YES
Package Style (Meter): GRID ARRAY, LOW PROFILE
No. of I/O Lines: 184
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 108 MHz
Package Shape: SQUARE
Maximum Operating Temperature: 85 Cel
Package Code: LBGA
Width: 17 mm
No. of Dedicated Inputs: 0
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: INDUSTRIAL
Programmable IC Type: FLASH PLD
Maximum Supply Voltage: 1.9 V
Architecture: PLA-TYPE
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: TIN SILVER COPPER
Length: 17 mm
Form Of Terminal: BALL
In-System Programmable: YES
Output Function: MACROCELL
Additional Features: REAL DIGITAL DESIGN TECHNOLOGY
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260
No. of Macro Cells: 256
Power Supplies (V): 1.5/3.3,1.8
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