Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Intel |
FLASH PLD |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
4.7 ns |
YES |
2.625 V |
192 |
CMOS |
80 |
2.5 |
1.5/3.3,2.5/3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
.5 mm |
100 Cel |
0 DEDICATED INPUTS, 80 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e3 |
80 |
14 mm |
YES |
80 |
||||||||||
|
Altera |
EE PLD |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
5.25 V |
32 |
CMOS |
5 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
1.27 mm |
70 Cel |
0 DEDICATED INPUTS, 36 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
Not Qualified |
YES |
e3 |
166.7 MHz |
16.5862 mm |
YES |
36 |
||||||||||
Lattice Semiconductor |
EE PLD |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
15 ns |
NO |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 |
IN-LINE |
DIP20,.3 |
Programmable Logic Devices |
MACROCELL |
4.75 V |
64 |
2.54 mm |
70 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T20 |
1 |
5.334 mm |
7.62 mm |
Not Qualified |
e0 |
45.5 MHz |
30 |
8 |
225 |
26.162 mm |
8 |
|||||||||
Lattice Semiconductor |
EE PLD |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
15 ns |
NO |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 |
IN-LINE |
DIP20,.3 |
Programmable Logic Devices |
MACROCELL |
4.5 V |
64 |
2.54 mm |
85 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
Not Qualified |
e0 |
45.5 MHz |
30 |
8 |
225 |
26.162 mm |
8 |
||||||||||
Lattice Semiconductor |
EE PLD |
INDUSTRIAL |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
18.5 ns |
YES |
5.5 V |
192 |
CMOS |
5 |
5 |
FLATPACK |
QFP128,1.2SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
4.5 V |
.8 mm |
85 Cel |
8 DEDICATED INPUTS, 96 I/O |
8 |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G128 |
3 |
4.1 mm |
28 mm |
Not Qualified |
USE ISPLSI1048EA FOR NEW DESIGNS; USE 1048E-70 FOR NEW 1048E-50 DESIGNS |
e0 |
56 MHz |
30 |
225 |
28 mm |
NO |
96 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
COMMERCIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
13 ns |
YES |
3.6 V |
32 |
CMOS |
3.3 |
3.3 |
FLATPACK, THIN PROFILE |
QFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
70 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e3 |
77 MHz |
260 |
10 mm |
NO |
32 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
256 |
132 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
105 Cel |
4 DEDICATED INPUTS, 128 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G176 |
3 |
1.6 mm |
21 mm |
Not Qualified |
e3 |
86 MHz |
40 |
128 |
260 |
21 mm |
YES |
128 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
256 |
74 |
PAD-TYPE |
1.8 |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
83 |
.5 mm |
130 Cel |
10 DEDICATED INPUTS, 64 I/O |
10 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
111 MHz |
40 |
64 |
260 |
14 mm |
YES |
64 |
|||||||
|
Lattice Semiconductor |
EE PLD |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.5 V |
96 |
CMOS |
PAL-TYPE |
5 |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
4.5 V |
.5 mm |
85 Cel |
4 DEDICATED INPUTS, 48 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
YES |
e3 |
62.5 MHz |
40 |
260 |
14 mm |
YES |
48 |
|||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
1.9 V |
512 |
CMOS |
173 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 173 I/O |
0 |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
YES |
e3 |
91 MHz |
30 |
173 |
245 |
28 mm |
YES |
173 |
|||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
288 |
CMOS |
117 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 117 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e3 |
125 MHz |
30 |
117 |
260 |
20 mm |
YES |
117 |
||||||
|
Xilinx |
EE PLD |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
64 |
CMOS |
3.3 |
3/3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
2.7 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 68 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
YES |
e3 |
95 MHz |
30 |
260 |
14 mm |
YES |
68 |
||||||||
Defense Logistics Agency |
OT PLD |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
30 ns |
NO |
5.5 V |
CMOS |
MIL-STD-883 |
5 |
IN-LINE |
MACROCELL |
4.5 V |
2.54 mm |
125 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
Qualified |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
e0 |
25 MHz |
31.877 mm |
10 |
|||||||||||||||||
Atmel |
UV PLD |
MILITARY |
THROUGH-HOLE |
24 |
WDIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
15 ns |
NO |
5.5 V |
CMOS |
38535Q/M;38534H;883B |
22 |
PAL-TYPE |
5 |
5 |
IN-LINE, WINDOW |
DIP24,.3 |
Programmable Logic Devices |
MACROCELL |
4.5 V |
132 |
2.54 mm |
125 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
Not Qualified |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
e0 |
50 MHz |
10 |
32 mm |
10 |
||||||||||
Atmel |
EE PLD |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.25 V |
32 |
CMOS |
5 |
3.3,5 |
CHIP CARRIER |
LDCC44,.7SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
1.27 mm |
70 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
Not Qualified |
YES |
e0 |
125 MHz |
225 |
16.586 mm |
YES |
32 |
||||||||||
Atmel |
EE PLD |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
5.25 V |
32 |
CMOS |
5 |
3.3,5 |
CHIP CARRIER |
LDCC44,.7SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
1.27 mm |
70 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J44 |
2 |
4.572 mm |
16.586 mm |
Not Qualified |
YES |
e0 |
100 MHz |
225 |
16.586 mm |
YES |
32 |
||||||||||
Atmel |
EE PLD |
COMMERCIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 64 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
YES |
e0 |
100 MHz |
240 |
14 mm |
YES |
64 |
||||||||||
Microchip Technology |
FLASH PLD |
INDUSTRIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
15 ns |
NO |
5.5 V |
CMOS |
5 |
IN-LINE |
MACROCELL |
4.5 V |
2.54 mm |
85 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
-40 Cel |
DUAL |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
55.5 MHz |
31.877 mm |
10 |
||||||||||||||||||||||
Intel |
LOADABLE PLD |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
1.93 ns |
6400 |
YES |
1.89 V |
CMOS |
80 |
1.8 |
1.8,1.8/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
4 DEDICATED INPUTS, 88 I/O |
4 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e0 |
160 MHz |
80 |
20 mm |
88 |
||||||||||||
Intel |
LOADABLE PLD |
COMMERCIAL |
GULL WING |
240 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
.8 ns |
9984 |
YES |
2.625 V |
CMOS |
182 |
2.5 |
2.5,2.5/3.3 |
FLATPACK, FINE PITCH |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
MIXED |
2.375 V |
.5 mm |
70 Cel |
182 I/O |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
Not Qualified |
e0 |
182 |
32 mm |
182 |
||||||||||||||
|
Intel |
LOADABLE PLD |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
.9 ns |
1728 |
YES |
3.6 V |
CMOS |
102 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
REGISTERED |
3 V |
.5 mm |
70 Cel |
4 DEDICATED INPUTS, 102 I/O |
4 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
1728 LOGIC ELEMENTS; 216 LABS |
e3 |
80 MHz |
102 |
20 mm |
102 |
||||||||||
|
Intel |
LOADABLE PLD |
COMMERCIAL |
GULL WING |
240 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
.8 ns |
2880 |
YES |
2.7 V |
CMOS |
189 |
2.5 |
2.5,2.5/3.3 |
FLATPACK, FINE PITCH |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
MIXED |
2.3 V |
.5 mm |
70 Cel |
189 I/O |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
Not Qualified |
2880 LOGIC ELEMENTS |
e3 |
140 MHz |
189 |
32 mm |
189 |
|||||||||||
Intel |
FLASH PLD |
COMMERCIAL EXTENDED |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
6.1 ns |
YES |
2.625 V |
192 |
CMOS |
80 |
2.5 |
1.5/3.3,2.5/3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 80 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e0 |
80 |
14 mm |
YES |
80 |
||||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
100 |
BGA |
SQUARE |
PLASTIC/EPOXY |
7.9 ns |
YES |
1.89 V |
192 |
CMOS |
80 |
1.8 |
1.5/3.3,1.8 |
GRID ARRAY |
BGA100,11X11,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 80 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
3 |
6 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e1 |
80 |
6 mm |
YES |
80 |
||||||||||
|
Intel |
EE PLD |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 |
CHIP CARRIER |
LDCC84,1.2SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
1.27 mm |
70 Cel |
0 DEDICATED INPUTS, 68 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J84 |
3 |
5.08 mm |
29.3116 mm |
Not Qualified |
CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
e3 |
166.7 MHz |
29.3116 mm |
YES |
68 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
128 |
100 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
105 Cel |
4 DEDICATED INPUTS, 96 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
86 MHz |
40 |
96 |
260 |
20 mm |
YES |
96 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
2.7 ns |
YES |
3.6 V |
128 |
100 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
90 Cel |
4 DEDICATED INPUTS, 96 I/O |
4 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
222 MHz |
40 |
96 |
260 |
20 mm |
YES |
96 |
|||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
6 ns |
YES |
3.6 V |
288 |
CMOS |
192 |
3.3 |
2.5/3.3,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
1 mm |
70 Cel |
0 DEDICATED INPUTS, 192 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
2 mm |
17 mm |
Not Qualified |
YES |
e1 |
208.3 MHz |
30 |
192 |
260 |
17 mm |
YES |
192 |
||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
288 |
CMOS |
192 |
3.3 |
2.5/3.3,3.3 |
GRID ARRAY |
BGA256,20X20,50 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
1.27 mm |
85 Cel |
0 DEDICATED INPUTS, 192 I/O |
0 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
2.55 mm |
27 mm |
Not Qualified |
YES |
e1 |
125 MHz |
30 |
192 |
250 |
27 mm |
YES |
192 |
||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
3.6 V |
36 |
CMOS |
34 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
70 Cel |
0 DEDICATED INPUTS, 34 I/O |
0 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e4 |
138.88 MHz |
34 |
10 mm |
YES |
34 |
||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
3.6 V |
72 |
CMOS |
34 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
70 Cel |
0 DEDICATED INPUTS, 34 I/O |
0 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
72 MACROCELLS |
e4 |
178.6 MHz |
34 |
10 mm |
YES |
34 |
||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
324 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
9.1 ns |
YES |
1.89 V |
1700 |
CMOS |
271 |
1.8 |
1.8,1.2/3.3 |
GRID ARRAY, LOW PROFILE |
BGA324,18X18,40 |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
1 mm |
85 Cel |
271 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
1.55 mm |
19 mm |
Not Qualified |
YES |
e1 |
247.5 MHz |
271 |
19 mm |
YES |
271 |
|||||||||
Atmel |
EE PLD |
INDUSTRIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
25 ns |
YES |
5.5 V |
32 |
CMOS |
5 |
3.3,5 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
4.5 V |
.8 mm |
85 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e0 |
60 MHz |
10 mm |
YES |
32 |
|||||||||||
Microchip Technology |
EE PLD |
INDUSTRIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
CMOS |
1.8 |
TRAY |
FLATPACK, THIN PROFILE |
MACROCELL |
1.7 V |
.8 mm |
85 Cel |
0 DEDICATED INPUTS, 33 I/O |
0 |
-40 Cel |
QUAD |
S-PQFP-G44 |
1.2 mm |
10 mm |
10 mm |
33 |
||||||||||||||||||||||
|
Microchip Technology |
FLASH PLD |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
7.5 ns |
NO |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
TUBE |
5 |
IN-LINE |
DIP20,.3 |
Programmable Logic Devices |
MACROCELL |
4.75 V |
64 |
2.54 mm |
85 Cel |
7 DEDICATED INPUTS, 8 I/O |
7 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
Not Qualified |
8 MACROCELLS |
e3 |
100 MHz |
8 |
25.908 mm |
8 |
|||||||||
Microchip Technology |
FLASH PLD |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
12 ns |
NO |
5.25 V |
CMOS |
5 |
IN-LINE |
MACROCELL |
4.75 V |
2.54 mm |
70 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
0 Cel |
DUAL |
R-PDIP-T24 |
5.334 mm |
7.62 mm |
55.5 MHz |
31.877 mm |
10 |
||||||||||||||||||||||
|
Intel |
FLASH PLD |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
5.4 ns |
YES |
1.89 V |
440 |
CMOS |
116 |
1.8 |
1.5/3.3,1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 116 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e3 |
116 |
20 mm |
YES |
116 |
|||||||||
|
Lattice Semiconductor |
EE PLD |
COMMERCIAL |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
18.5 ns |
YES |
5.25 V |
192 |
CMOS |
5 |
5 |
FLATPACK |
QFP128,1.2SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
.8 mm |
70 Cel |
8 DEDICATED INPUTS, 96 I/O |
8 |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G128 |
3 |
4.1 mm |
28 mm |
Not Qualified |
USE ISPLSI1048EA FOR NEW DESIGNS |
e3 |
56 MHz |
40 |
245 |
28 mm |
NO |
96 |
||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
3.6 V |
64 |
36 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
105 Cel |
4 DEDICATED INPUTS, 32 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
156 MHz |
40 |
32 |
260 |
7 mm |
YES |
32 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
256 |
110 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
90 Cel |
14 DEDICATED INPUTS, 96 I/O |
14 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
111 MHz |
40 |
96 |
260 |
20 mm |
YES |
96 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
256 |
110 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
130 Cel |
14 DEDICATED INPUTS, 96 I/O |
14 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
111 MHz |
40 |
96 |
260 |
20 mm |
YES |
96 |
|||||||
|
Lattice Semiconductor |
EE PLD |
BALL |
144 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
256 |
CMOS |
1.8 |
1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA144,12X12,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
4 DEDICATED INPUTS, 108 I/O |
4 |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B144 |
3 |
1.1 mm |
7 mm |
Not Qualified |
YES |
e1 |
111 MHz |
40 |
260 |
7 mm |
YES |
108 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
384 |
132 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
105 Cel |
4 DEDICATED INPUTS, 128 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G176 |
3 |
1.6 mm |
21 mm |
Not Qualified |
e3 |
86 MHz |
40 |
128 |
260 |
21 mm |
YES |
128 |
|||||||
|
Lattice Semiconductor |
EE PLD |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
512 |
212 |
PAD-TYPE |
3.3 |
3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
1 mm |
90 Cel |
4 DEDICATED INPUTS, 208 I/O |
4 |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
111 MHz |
40 |
208 |
260 |
17 mm |
YES |
208 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
512 |
132 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
90 Cel |
4 DEDICATED INPUTS, 128 I/O |
4 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G176 |
3 |
1.6 mm |
21 mm |
Not Qualified |
e3 |
111 MHz |
40 |
128 |
260 |
21 mm |
YES |
128 |
|||||||
Lattice Semiconductor |
EE PLD |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
12 ns |
YES |
5.25 V |
256 |
CMOS |
5 |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 68 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
YES |
e0 |
71.4 MHz |
30 |
240 |
14 mm |
YES |
68 |
|||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
1.9 V |
384 |
CMOS |
212 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
1 mm |
70 Cel |
0 DEDICATED INPUTS, 212 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
YES |
e1 |
83 MHz |
30 |
212 |
260 |
17 mm |
YES |
212 |
|||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
144 |
CMOS |
117 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 117 I/O |
0 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e4 |
125 MHz |
117 |
20 mm |
YES |
117 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.