Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Lattice Semiconductor |
EE PLD |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
1.9 V |
32 |
36 |
PAD-TYPE |
1.8 |
1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
83 |
.5 mm |
105 Cel |
4 DEDICATED INPUTS, 32 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
156 MHz |
40 |
32 |
260 |
7 mm |
YES |
32 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
128 |
74 |
PAD-TYPE |
1.8 |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
83 |
.5 mm |
130 Cel |
10 DEDICATED INPUTS, 64 I/O |
10 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
111 MHz |
40 |
64 |
260 |
14 mm |
YES |
64 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
128 |
CMOS |
1.8 |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
4 DEDICATED INPUTS, 96 I/O |
4 |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e3 |
111 MHz |
40 |
260 |
20 mm |
YES |
96 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
256 |
74 |
PAD-TYPE |
1.8 |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
83 |
.5 mm |
90 Cel |
10 DEDICATED INPUTS, 64 I/O |
10 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
111 MHz |
40 |
64 |
260 |
14 mm |
YES |
64 |
|||||||
NXP Semiconductors |
OT PLD |
COMMERCIAL EXTENDED |
J BEND |
68 |
QCCJ |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.25 V |
CMOS |
5 |
CHIP CARRIER |
MIXED |
4.75 V |
1.27 mm |
75 Cel |
9 DEDICATED INPUTS, 24 I/O |
9 |
0 Cel |
QUAD |
S-CQCC-J68 |
4.83 mm |
24.065 mm |
Not Qualified |
50 MHz |
24.065 mm |
24 |
||||||||||||||||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
128 |
CMOS |
80 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 80 I/O |
0 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
YES |
e4 |
119 MHz |
80 |
14 mm |
YES |
80 |
|||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 |
CHIP CARRIER |
LDCC44,.7SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
1.27 mm |
85 Cel |
0 DEDICATED INPUTS, 33 I/O |
0 |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-J44 |
3 |
4.572 mm |
16.5862 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e3 |
200 MHz |
30 |
245 |
16.5862 mm |
YES |
33 |
||||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
288 |
CMOS |
192 |
3.3 |
2.5/3.3,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
1 mm |
85 Cel |
0 DEDICATED INPUTS, 192 I/O |
0 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
2 mm |
17 mm |
Not Qualified |
YES |
e1 |
100 MHz |
30 |
192 |
260 |
17 mm |
YES |
192 |
||||||
Xilinx |
FLASH PLD |
COMMERCIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
6 ns |
YES |
3.6 V |
288 |
CMOS |
192 |
3.3 |
2.5/3.3,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
1 mm |
70 Cel |
0 DEDICATED INPUTS, 192 I/O |
0 |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
3 |
2 mm |
17 mm |
Not Qualified |
YES |
e0 |
208.3 MHz |
30 |
192 |
225 |
17 mm |
YES |
192 |
|||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
3.6 V |
72 |
CMOS |
72 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 72 I/O |
0 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
72 MACROCELLS |
e4 |
178.6 MHz |
72 |
14 mm |
YES |
72 |
||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
3.6 V |
72 |
CMOS |
72 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 72 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
72 MACROCELLS |
e3 |
178.6 MHz |
30 |
72 |
260 |
14 mm |
YES |
72 |
||||||
|
Xilinx |
EE PLD |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
128 |
CMOS |
3.3 |
3/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
2.7 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 108 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e3 |
119 MHz |
30 |
260 |
20 mm |
YES |
108 |
||||||||
|
Intel |
FLASH PLD |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC |
10 ns |
SURFACE MOUNT |
1.89 V |
980 |
CMOS |
AEC-Q100 |
1.8,1.2/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
1.71 V |
1 mm |
105 Cel |
0 DEDICATED INPUTS, 211 I/O |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
17 mm |
Not Qualified |
YES |
17 mm |
YES |
||||||||||||||||||
Atmel |
EE PLD |
COMMERCIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
3.6 V |
32 |
CMOS |
3.3 |
3 |
FLATPACK, THIN PROFILE |
QFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
70 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e0 |
100 MHz |
10 mm |
YES |
32 |
|||||||||||
Atmel |
EE PLD |
INDUSTRIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
3.6 V |
32 |
CMOS |
3.3 |
3 |
FLATPACK, THIN PROFILE |
QFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
85 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e0 |
100 MHz |
10 mm |
YES |
32 |
|||||||||||
Microchip Technology |
EE PLD |
MILITARY |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
15 ns |
NO |
5.5 V |
10 |
CMOS |
MIL-STD-883 |
5 |
TUBE |
5 |
IN-LINE |
DIP24,.3 |
Programmable Logic Devices |
NO |
MACROCELL |
4.5 V |
2.54 mm |
125 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T24 |
5.08 mm |
7.62 mm |
Not Qualified |
NO |
e0 |
55 MHz |
32 mm |
NO |
10 |
||||||||||
Intel |
LOADABLE PLD |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
.5 ns |
2880 |
YES |
2.625 V |
CMOS |
147 |
2.5 |
2.5,2.5/3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
MIXED |
2.375 V |
.5 mm |
70 Cel |
147 I/O |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
e0 |
147 |
28 mm |
147 |
||||||||||||||
Intel |
EE PLD |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 |
FLATPACK, LOW PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 84 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
Not Qualified |
CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
e0 |
100 MHz |
14 mm |
YES |
84 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
INDUSTRIAL |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
18.5 ns |
YES |
5.5 V |
192 |
CMOS |
5 |
5 |
FLATPACK |
QFP128,1.2SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
4.5 V |
.8 mm |
85 Cel |
8 DEDICATED INPUTS, 96 I/O |
8 |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G128 |
3 |
4.1 mm |
28 mm |
Not Qualified |
USE ISPLSI1048EA FOR NEW DESIGNS; USE 1048E-70 FOR NEW 1048E-50 DESIGNS |
e3 |
56 MHz |
40 |
245 |
28 mm |
NO |
96 |
||||||||
Texas Instruments |
OT PLD |
MILITARY |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
20 ns |
NO |
5.5 V |
TTL |
MIL-M-38510 Class B |
16 |
PAL-TYPE |
5 |
TUBE |
IN-LINE |
NO |
COMBINATORIAL |
4.75 V |
64 |
2.54 mm |
125 Cel |
10 DEDICATED INPUTS, 6 I/O |
10 |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T20 |
5.08 mm |
6.92 mm |
Not Qualified |
e0 |
40 MHz |
8 |
24.2 mm |
NO |
6 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
12 ns |
YES |
5.5 V |
32 |
CMOS |
34 |
PAL-TYPE |
5 |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
4.5 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
Not Qualified |
YES |
e3 |
52.6 MHz |
40 |
32 |
260 |
7 mm |
YES |
32 |
|||||
|
Renesas Electronics |
OT PLD |
NO LEAD |
14 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1.89 V |
19 |
12 |
PLA-TYPE |
1.8 |
CHIP CARRIER, VERY THIN PROFILE |
LCC14,.08X.09,16 |
NO |
MACROCELL |
1.71 V |
.4 mm |
85 Cel |
1 DEDICATED INPUTS, 11 I/O |
1 |
-40 Cel |
QUAD |
R-XQCC-N14 |
1 |
.6 mm |
2 mm |
CAN ALSO OPERATE AT 3.3V OR 5V SUPPLY |
11 |
2.2 mm |
NO |
11 |
||||||||||||||||
|
Renesas Electronics |
OT PLD |
NO LEAD |
14 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1.89 V |
19 |
12 |
PLA-TYPE |
1.8 |
BOX, TR, 7-INCH |
CHIP CARRIER, VERY THIN PROFILE |
LCC14,.08X.09,16 |
NO |
MACROCELL |
1.71 V |
.4 mm |
85 Cel |
1 DEDICATED INPUTS, 11 I/O |
1 |
-40 Cel |
QUAD |
R-XQCC-N14 |
.6 mm |
2 mm |
CAN ALSO OPERATE AT 3.3V OR 5V SUPPLY |
11 |
2.2 mm |
NO |
11 |
||||||||||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
BALL |
132 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
6 ns |
YES |
1.9 V |
128 |
CMOS |
100 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA132,14X14,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 100 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B132 |
3 |
1.1 mm |
8 mm |
Not Qualified |
YES |
e1 |
152 MHz |
30 |
100 |
260 |
8 mm |
YES |
100 |
|||||
|
Xilinx |
EE PLD |
INDUSTRIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
64 |
CMOS |
3.3 |
3/3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
2.7 V |
.8 mm |
85 Cel |
0 DEDICATED INPUTS, 36 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e3 |
95 MHz |
30 |
260 |
10 mm |
YES |
36 |
||||||||
|
Altera |
FLASH PLD |
INDUSTRIAL |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
17.7 ns |
YES |
440 |
CMOS |
1.8,1.2/3.3 |
FLATPACK |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G144 |
Not Qualified |
YES |
YES |
||||||||||||||||||||||||
Intel |
FLASH PLD |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
9.5 ns |
YES |
1.89 V |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
114 I/O |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G144 |
1.6 mm |
20 mm |
Not Qualified |
e0 |
184.1 MHz |
20 mm |
114 |
|||||||||||||||||||||
Intel |
FLASH PLD |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
17.7 ns |
YES |
1.89 V |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
114 I/O |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G144 |
1.6 mm |
20 mm |
Not Qualified |
e0 |
118.3 MHz |
20 mm |
114 |
|||||||||||||||||||||
Atmel |
FLASH PLD |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
15 ns |
NO |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 |
IN-LINE |
DIP20,.3 |
Programmable Logic Devices |
MACROCELL |
4.75 V |
64 |
2.54 mm |
70 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T20 |
1 |
5.334 mm |
7.62 mm |
Not Qualified |
8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
e0 |
45 MHz |
8 |
25.908 mm |
8 |
||||||||||
Atmel |
FLASH PLD |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
5.25 V |
CMOS |
22 |
PAL-TYPE |
5 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Programmable Logic Devices |
MACROCELL |
4.75 V |
132 |
1.27 mm |
70 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J28 |
2 |
4.57 mm |
11.5062 mm |
Not Qualified |
10 MACROCELLS; 1 EXTERNAL CLOCK; REGISTER PRELOAD; POWER-UP RESET; SHARED INPUT/CLOCK |
e0 |
125 MHz |
10 |
225 |
11.5062 mm |
10 |
|||||||||
|
Intel |
FLASH PLD |
OTHER |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
8.7 ns |
YES |
1.89 V |
440 |
CMOS |
76 |
1.8 |
1.5/3.3,1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 76 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e3 |
76 |
14 mm |
YES |
76 |
|||||||||
Altera |
EE PLD |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
5.25 V |
CMOS |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
MACROCELL |
4.75 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 80 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
1.27 mm |
14 mm |
Not Qualified |
CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
e3 |
76.9 MHz |
14 mm |
80 |
||||||||||||||||||
Altera |
EE PLD |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
5.25 V |
128 |
CMOS |
5 |
3.3/5,5 |
FLATPACK, LOW PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 84 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
Not Qualified |
YES |
e0 |
100 MHz |
220 |
14 mm |
YES |
84 |
||||||||||
|
Lattice Semiconductor |
EE PLD |
BALL |
56 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
32 |
36 |
PAD-TYPE |
1.8 |
1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA56,10X10,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
83 |
.5 mm |
90 Cel |
4 DEDICATED INPUTS, 32 I/O |
4 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B56 |
3 |
1.35 mm |
6 mm |
Not Qualified |
e1 |
111 MHz |
40 |
32 |
260 |
6 mm |
YES |
32 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
5.8 ns |
YES |
1.9 V |
32 |
CMOS |
1.8 |
1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
4 DEDICATED INPUTS, 32 I/O |
4 |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
YES |
e3 |
149 MHz |
40 |
260 |
7 mm |
YES |
32 |
|||||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
128 |
74 |
PAD-TYPE |
1.8 |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
83 |
.5 mm |
90 Cel |
10 DEDICATED INPUTS, 64 I/O |
10 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
111 MHz |
40 |
64 |
260 |
14 mm |
YES |
64 |
|||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
256 |
74 |
PAD-TYPE |
1.8 |
1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
83 |
.5 mm |
105 Cel |
10 DEDICATED INPUTS, 64 I/O |
10 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
111 MHz |
40 |
64 |
260 |
14 mm |
YES |
64 |
|||||||
|
Lattice Semiconductor |
EE PLD |
INDUSTRIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
5.5 V |
64 |
CMOS |
34 |
PAL-TYPE |
5 |
5 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
4.5 V |
.8 mm |
85 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e3 |
76.9 MHz |
40 |
32 |
260 |
10 mm |
YES |
32 |
|||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
OT PLD |
1 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
FLASH PLD |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC |
14 ns |
SURFACE MOUNT |
64 |
CMOS |
AEC-Q100 |
1.8,1.2/3.3 |
FLATPACK |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||
Atmel |
EE PLD |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.25 V |
64 |
CMOS |
5 |
3.3/5,5 |
CHIP CARRIER |
LDCC84,1.2SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
1.27 mm |
70 Cel |
0 DEDICATED INPUTS, 64 I/O |
0 |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-J84 |
2 |
4.57 mm |
29.3116 mm |
Not Qualified |
64 MACROCELLS; IN-SYSTEM PROGRAMMABLE; JTAG BOUNDARY-SCAN TEST CIRCUITRY |
e0 |
125 MHz |
225 |
29.3116 mm |
YES |
64 |
||||||||||
|
Intel |
LOADABLE PLD |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
.4 ns |
1728 |
YES |
2.625 V |
CMOS |
102 |
2.5 |
2.5,2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
MIXED |
2.375 V |
.5 mm |
85 Cel |
102 I/O |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
37.5 MHz |
102 |
20 mm |
102 |
||||||||||||
|
Intel |
LOADABLE PLD |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
.6 ns |
1152 |
YES |
5.25 V |
CMOS |
102 |
5 |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.63SQ,20 |
Field Programmable Gate Arrays |
REGISTERED |
4.75 V |
.5 mm |
70 Cel |
4 DEDICATED INPUTS, 102 I/O |
4 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
102 |
20 mm |
102 |
||||||||||||
Altera |
LOADABLE PLD |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
336 |
YES |
5.5 V |
CMOS |
68 |
5 |
3.3/5,5 |
CHIP CARRIER |
LDCC84,1.2SQ |
Field Programmable Gate Arrays |
REGISTERED |
4.5 V |
1.27 mm |
85 Cel |
4 DEDICATED INPUTS, 68 I/O |
4 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J84 |
5.08 mm |
29.3116 mm |
Not Qualified |
336 LOGIC ELEMENTS |
e0 |
385 MHz |
64 |
220 |
29.3116 mm |
68 |
||||||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
9.1 ns |
YES |
2.625 V |
1700 |
CMOS |
204 |
2.5 |
1.5/3.3,2.5/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
1 mm |
85 Cel |
0 DEDICATED INPUTS, 204 I/O |
0 |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e1 |
30 |
204 |
260 |
17 mm |
YES |
204 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.