Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL |
FLAT |
208 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
2880 |
YES |
3.63 V |
2880 |
CMOS |
246 |
32000 |
3.3 |
3.3,5 |
FLATPACK |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.97 V |
.5 mm |
70 Cel |
1 ns |
2880 CLBS, 32000 GATES |
0 Cel |
TIN LEAD |
QUAD |
S-CQFP-F208 |
3.06 mm |
29.21 mm |
Not Qualified |
48000 SYSTEM GATES AVAILABLE |
e0 |
205 MHz |
246 |
29.21 mm |
||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
FLAT |
208 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
2880 |
YES |
3.63 V |
2880 |
CMOS |
MIL-STD-883 Class B |
246 |
32000 |
3.3 |
3.3,5 |
FLATPACK |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.97 V |
.5 mm |
125 Cel |
1 ns |
2880 CLBS, 32000 GATES |
-55 Cel |
TIN LEAD |
QUAD |
S-CQFP-F208 |
3.06 mm |
29.21 mm |
Not Qualified |
48000 SYSTEM GATES AVAILABLE |
e0 |
205 MHz |
246 |
29.21 mm |
|||||||
Microsemi |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL |
FLAT |
208 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
2880 |
YES |
2.75 V |
2880 |
CMOS |
174 |
48000 |
2.5 |
2.5,3.3/5 |
FLATPACK |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
70 Cel |
1.2 ns |
2880 CLBS, 48000 GATES |
0 Cel |
TIN LEAD |
QUAD |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
Not Qualified |
32000 TYPICAL GATES AVAILABLE |
e0 |
238 MHz |
174 |
29.21 mm |
||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL |
FLAT |
208 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
2880 |
YES |
2.75 V |
2880 |
CMOS |
174 |
48000 |
2.5 |
2.5,3.3/5 |
FLATPACK |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
70 Cel |
1.2 ns |
2880 CLBS, 48000 GATES |
0 Cel |
TIN LEAD |
QUAD |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
Not Qualified |
32000 TYPICAL GATES AVAILABLE |
e0 |
238 MHz |
174 |
29.21 mm |
||||||||
Actel |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL |
FLAT |
208 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
2880 |
YES |
3.63 V |
2880 |
CMOS |
246 |
32000 |
3.3 |
3.3,5 |
FLATPACK |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.97 V |
.5 mm |
70 Cel |
1 ns |
2880 CLBS, 32000 GATES |
0 Cel |
TIN LEAD |
QUAD |
S-CQFP-F208 |
3.06 mm |
29.21 mm |
Not Qualified |
48000 SYSTEM GATES AVAILABLE |
e0 |
205 MHz |
246 |
225 |
29.21 mm |
|||||||
Actel |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
FLAT |
208 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
2880 |
YES |
3.63 V |
2880 |
CMOS |
MIL-STD-883 Class B |
246 |
32000 |
3.3 |
3.3,5 |
FLATPACK |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.97 V |
.5 mm |
125 Cel |
1 ns |
2880 CLBS, 32000 GATES |
-55 Cel |
TIN LEAD |
QUAD |
S-CQFP-F208 |
3.06 mm |
29.21 mm |
Not Qualified |
48000 SYSTEM GATES AVAILABLE |
e0 |
205 MHz |
246 |
225 |
29.21 mm |
||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
FLAT |
208 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
6036 |
YES |
2.75 V |
6036 |
CMOS |
171 |
108000 |
2.5 |
2.5,3.3/5 |
FLATPACK |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
125 Cel |
1.5 ns |
6036 CLBS, 108000 GATES |
-55 Cel |
TIN LEAD |
QUAD |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
Not Qualified |
72000 TYPICAL GATES AVAILABLE |
e0 |
217 MHz |
171 |
29.21 mm |
||||||||
Microsemi |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
FLAT |
208 |
QFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
6036 |
YES |
2.75 V |
6036 |
CMOS |
171 |
108000 |
2.5 |
2.5,3.3/5 |
FLATPACK |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
125 Cel |
1.5 ns |
6036 CLBS, 108000 GATES |
-55 Cel |
TIN LEAD |
QUAD |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
Not Qualified |
72000 TYPICAL GATES AVAILABLE |
e0 |
217 MHz |
171 |
29.21 mm |
||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
13824 |
CMOS |
600000 |
1.5 |
TRAY |
GRID ARRAY, LOW PROFILE |
1.425 V |
1 mm |
85 Cel |
13824 CLBS, 600000 GATES |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.68 mm |
17 mm |
Not Qualified |
e1 |
30 |
250 |
17 mm |
||||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
CMOS |
600000 |
1.5 |
TRAY |
GRID ARRAY, LOW PROFILE |
1.425 V |
1 mm |
100 Cel |
600000 GATES |
-55 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.7 mm |
17 mm |
Not Qualified |
e1 |
30 |
250 |
17 mm |
|||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
FLAT |
208 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
56320 |
YES |
2.7 V |
CMOS |
MIL-STD-883 Class B |
158 |
1000000 |
2.5 |
2.5,2.5/3.3 |
FLATPACK, GUARD RING |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
125 Cel |
1000000 GATES |
-55 Cel |
TIN LEAD |
QUAD |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
Not Qualified |
e0 |
180 MHz |
158 |
29.21 mm |
||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
FLAT |
208 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
56320 |
YES |
2.7 V |
CMOS |
MIL-STD-883 Class B |
158 |
1000000 |
2.5 |
2.5,2.5/3.3 |
FLATPACK, GUARD RING |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
125 Cel |
1000000 GATES |
-55 Cel |
TIN LEAD |
QUAD |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
Not Qualified |
e0 |
180 MHz |
158 |
29.21 mm |
||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
FLAT |
208 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
21504 |
YES |
2.7 V |
CMOS |
MIL-STD-883 Class B |
158 |
600000 |
2.5 |
2.5,2.5/3.3 |
FLATPACK, GUARD RING |
TPAK208,2.9SQ,20 |
Field Programmable Gate Arrays |
2.3 V |
.5 mm |
125 Cel |
600000 GATES |
-55 Cel |
TIN LEAD |
QUAD |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
Not Qualified |
e0 |
180 MHz |
158 |
29.21 mm |
||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
780 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
60100 |
350 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY |
BGA780,28X28,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
100 Cel |
60100 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B780 |
3 |
3.5 mm |
29 mm |
Not Qualified |
e1 |
640 MHz |
350 |
29 mm |
|||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
12060 |
YES |
1.575 V |
1206 |
249 |
1.5 |
1.5,1.5/3.3 |
GRID ARRAY |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
85 Cel |
1206 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
2.2 mm |
19 mm |
Not Qualified |
e1 |
320 MHz |
249 |
19 mm |
||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
12060 |
YES |
1.575 V |
1206 |
249 |
1.5 |
1.5,1.5/3.3 |
GRID ARRAY |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
100 Cel |
1206 CLBS |
-40 Cel |
Tin/Lead (Sn63Pb37) |
BOTTOM |
S-PBGA-B324 |
3 |
2.2 mm |
19 mm |
Not Qualified |
e0 |
320 MHz |
20 |
249 |
220 |
19 mm |
|||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
25660 |
YES |
1.575 V |
2852 |
CMOS |
455 |
1.5 |
1.5,1.5/3.3 |
GRID ARRAY |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
85 Cel |
2852 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
Not Qualified |
e1 |
455 |
27 mm |
||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
25660 |
YES |
1.575 V |
2852 |
CMOS |
455 |
1.5 |
1.5,1.5/3.3 |
GRID ARRAY |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
85 Cel |
2852 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B672 |
3 |
3.5 mm |
27 mm |
Not Qualified |
e1 |
455 |
27 mm |
||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
780 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
118143 |
YES |
.93 V |
4964 |
372 |
0.9 |
GRID ARRAY, HEAT SINK/SLUG |
BGA780,28X28,40 |
.87 V |
1 mm |
85 Cel |
4964 CLBS |
0 Cel |
BOTTOM |
S-PBGA-B780 |
2.6 mm |
29 mm |
372 |
29 mm |
||||||||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
14448 |
YES |
1.25 V |
903 |
CMOS |
315 |
1.2 |
1.2,1.5/3.3,3.3 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
903 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
ALSO REQUIRES 3.3 SUPPLY |
e1 |
402.5 MHz |
307 |
23 mm |
||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
33216 |
YES |
1.25 V |
2076 |
CMOS |
322 |
1.2 |
1.2,1.5/3.3,3.3 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
85 Cel |
2076 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.2 mm |
19 mm |
Not Qualified |
ALSO REQUIRES 3.3 SUPPLY |
e1 |
402.5 MHz |
306 |
19 mm |
||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
484 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
119088 |
YES |
1.25 V |
119088 |
CMOS |
283 |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
100 Cel |
119088 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
472.5 MHz |
283 |
23 mm |
||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
780 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
119088 |
YES |
1.25 V |
119088 |
CMOS |
531 |
1.2 |
GRID ARRAY |
BGA780,28X28,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
119088 CLBS |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B780 |
3 |
3.5 mm |
29 mm |
Not Qualified |
e1 |
472.5 MHz |
30 |
531 |
260 |
29 mm |
||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
780 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.25 V |
119088 |
1.2 |
GRID ARRAY |
1.15 V |
1 mm |
85 Cel |
119088 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B780 |
3.5 mm |
29 mm |
Not Qualified |
e1 |
472.5 MHz |
29 mm |
||||||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
55856 |
YES |
1.25 V |
3491 |
327 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
3491 CLBS |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B484 |
3 |
2.4 mm |
23 mm |
Not Qualified |
e0 |
472.5 MHz |
327 |
23 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
55856 |
YES |
1.03 V |
3491 |
327 |
1 |
1,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
.97 V |
1 mm |
85 Cel |
3491 CLBS |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B484 |
3 |
2.4 mm |
23 mm |
Not Qualified |
e0 |
265 MHz |
327 |
23 mm |
|||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
36 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
3520 |
YES |
1.26 V |
440 |
CMOS |
26 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.35 mm |
100 Cel |
9 ns |
440 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B36 |
1 |
.491 mm |
2.078 mm |
30 |
26 |
260 |
2.078 mm |
|||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
1200 |
YES |
3.465 V |
150 |
113 |
1.8 |
1.8/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
100 Cel |
150 CLBS |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
40 |
113 |
260 |
20 mm |
|||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
132 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
1200 |
YES |
3.465 V |
150 |
101 |
1.8 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA132,14X14,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
100 Cel |
150 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B132 |
3 |
1.35 mm |
8 mm |
Not Qualified |
e1 |
40 |
101 |
260 |
8 mm |
|||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
1200 |
YES |
3.465 V |
150 |
113 |
1.8 |
1.8/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 Cel |
150 CLBS |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
40 |
113 |
260 |
20 mm |
|||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
2112 |
YES |
3.465 V |
278 |
2.5 |
TRAY |
2.5/3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
2.375 V |
1 mm |
85 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e1 |
30 |
278 |
250 |
23 mm |
|||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
4320 |
YES |
3.465 V |
278 |
2.5 |
TRAY |
2.5/3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
2.375 V |
1 mm |
85 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e1 |
30 |
278 |
250 |
23 mm |
|||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
640 |
YES |
3.465 V |
80 |
78 |
2.5 |
TRAY |
2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 Cel |
80 CLBS |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e3 |
NOT SPECIFIED |
78 |
NOT SPECIFIED |
14 mm |
||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
9400 |
YES |
3.465 V |
1175 |
335 |
2.5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA400,20X20,32 |
2.375 V |
.8 mm |
85 Cel |
6.7 ns |
1175 CLBS |
0 Cel |
BOTTOM |
S-PBGA-B400 |
1.7 mm |
17 mm |
ALSO OPERATES 3.3V NOMINAL SUPPLY |
335 |
17 mm |
|||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
256 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
2100 |
YES |
1.26 V |
264 |
206 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.5 mm |
100 Cel |
264 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1 mm |
9 mm |
e1 |
206 |
260 |
9 mm |
|||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
49 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
2100 |
YES |
1.26 V |
264 |
38 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.4 mm |
100 Cel |
264 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B49 |
3 |
.6 mm |
3.106 mm |
e1 |
38 |
260 |
3.185 mm |
|||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
49 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
2100 |
YES |
1.26 V |
264 |
38 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.4 mm |
100 Cel |
264 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B49 |
3 |
.6 mm |
3.106 mm |
e1 |
38 |
260 |
3.185 mm |
|||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
858 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.5 mm |
85 Cel |
858 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1 mm |
9 mm |
e1 |
260 |
9 mm |
|||||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
3 |
260 |
||||||||||||||||||||||||||||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
121 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
17000 |
YES |
1.05 V |
4250 |
FDSOI |
23 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA121,11X11,20 |
.95 V |
.5 mm |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B121 |
3 |
1 mm |
6 mm |
e1 |
30 |
23 |
260 |
6 mm |
||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
121 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
39000 |
YES |
1.05 V |
9750 |
FDSOI |
23 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA121,11X11,20 |
.95 V |
.5 mm |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B121 |
3 |
1 mm |
6 mm |
e1 |
30 |
23 |
260 |
6 mm |
||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
20000 |
YES |
1.26 V |
2625 |
131 |
1.2 |
1.2 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 Cel |
.331 ns |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
e3 |
357 MHz |
40 |
131 |
245 |
28 mm |
||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
35000 |
YES |
1.26 V |
4000 |
331 |
1.2 |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 Cel |
.358 ns |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
311 MHz |
331 |
250 |
23 mm |
|||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
285 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.155 V |
10500 |
1.1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.045 V |
.5 mm |
85 Cel |
10500 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B285 |
3 |
1.3 mm |
10 mm |
e1 |
30 |
260 |
10 mm |
||||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
3 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
384 |
YES |
3.465 V |
384 |
CMOS |
62 |
1.8 |
1.8/2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 Cel |
.63 ns |
384 CLBS |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
375 MHz |
40 |
62 |
260 |
14 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.