Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
16 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
160 |
CMOS |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.35 mm |
100 Cel |
160 CLBS |
-40 Cel |
BOTTOM |
R-PBGA-B16 |
.491 mm |
1.4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
1.48 mm |
|||||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
49 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
48 |
CMOS |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.4 mm |
100 Cel |
48 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B49 |
1 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
3 mm |
|||||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
2112 |
YES |
1.26 V |
79 |
1.2 |
TRAY |
1.2 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
30 |
79 |
260 |
14 mm |
||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
4320 |
YES |
3.465 V |
206 |
2.5 |
TRAY |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
2.375 V |
1 mm |
85 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e1 |
30 |
206 |
260 |
17 mm |
||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
160 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.5 mm |
85 Cel |
160 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1 mm |
9 mm |
e1 |
260 |
9 mm |
||||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
256 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
1300 |
YES |
1.26 V |
160 |
206 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.5 mm |
100 Cel |
160 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1 mm |
9 mm |
e1 |
206 |
260 |
9 mm |
||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
1300 |
YES |
3.465 V |
160 |
206 |
2.5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
2.375 V |
.8 mm |
100 Cel |
160 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.7 mm |
14 mm |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e1 |
30 |
206 |
260 |
14 mm |
||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
81 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
4300 |
YES |
1.26 V |
540 |
63 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.4 mm |
100 Cel |
540 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B81 |
1 |
.567 mm |
3.693 mm |
e1 |
63 |
260 |
3.797 mm |
||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
3 |
260 |
|||||||||||||||||||||||||||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
|||||||||||||||||||||||||||||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
12000 |
YES |
1.26 V |
1500 |
193 |
1.2 |
1.2 |
GRID ARRAY |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 Cel |
.304 ns |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
Not Qualified |
e1 |
420 MHz |
40 |
193 |
250 |
17 mm |
|||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
50000 |
YES |
1.26 V |
6000 |
270 |
1.2 |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 Cel |
.331 ns |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
357 MHz |
270 |
250 |
23 mm |
||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
3 |
260 |
|||||||||||||||||||||||||||||||||||||||||
Microsemi |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
FLAT |
208 |
QFF |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
FLATPACK |
1.425 V |
.5 mm |
85 Cel |
6144 CLBS, 250000 GATES |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-F208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
e3 |
30.6 mm |
||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
27696 |
YES |
1.26 V |
138 |
1.2 |
TRAY |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
.8 mm |
100 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
1.56 mm |
14 mm |
e0 |
138 |
14 mm |
|||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
56340 |
YES |
1.26 V |
267 |
1.2 |
TRAY |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
100 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B484 |
3 |
2.44 mm |
23 mm |
Not Qualified |
30 |
267 |
250 |
23 mm |
|||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
300000 |
YES |
1.03 V |
CMOS |
244 |
1 |
GRID ARRAY |
BGA484,22X22,40 |
.97 V |
1 mm |
100 Cel |
0 Cel |
BOTTOM |
S-PBGA-B484 |
2.87 mm |
23 mm |
IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY |
244 |
23 mm |
|||||||||||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
AUTOMOTIVE |
BALL |
325 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
52160 |
YES |
1.05 V |
4075 |
HKMG |
AEC-Q100 |
150 |
1 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
Field Programmable Gate Arrays |
.95 V |
.8 mm |
125 Cel |
1.27 ns |
4075 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B325 |
3 |
1.5 mm |
15 mm |
Not Qualified |
e1 |
1098 MHz |
30 |
150 |
260 |
15 mm |
||||||
Xilinx |
3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
456 |
BGA |
SQUARE |
PLASTIC/EPOXY |
5292 |
YES |
2.625 V |
1176 |
288 |
200000 |
2.5 |
1.5/3.3,2.5 |
GRID ARRAY |
BGA456,22X22,40 |
Field Programmable Gate Arrays |
2.375 V |
1 mm |
100 Cel |
.7 ns |
1176 CLBS, 200000 GATES |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B456 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e0 |
263 MHz |
30 |
284 |
225 |
23 mm |
||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
5292 |
YES |
2.625 V |
1176 |
284 |
200000 |
2.5 |
1.5/3.3,2.5 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 Cel |
.6 ns |
1176 CLBS, 200000 GATES |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
MAXIMUM USABLE GATES 200000 |
e3 |
263 MHz |
30 |
284 |
245 |
28 mm |
||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
4320 |
YES |
1.26 V |
480 |
CMOS |
63 |
200000 |
1.2 |
1.2,1.2/3.3,2.5 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 Cel |
.61 ns |
480 CLBS, 200000 GATES |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
630 MHz |
30 |
63 |
260 |
14 mm |
||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
5508 |
YES |
1.26 V |
612 |
CMOS |
108 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 Cel |
.76 ns |
612 CLBS, 250000 GATES |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
572 MHz |
30 |
80 |
260 |
20 mm |
||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
1728 |
YES |
1.26 V |
192 |
CMOS |
97 |
50000 |
1.2 |
1.2,1.2/3.3,2.5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 Cel |
.53 ns |
192 CLBS, 50000 GATES |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
725 MHz |
30 |
97 |
260 |
20 mm |
||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
668 |
BGA |
SQUARE |
PLASTIC/EPOXY |
12312 |
YES |
1.26 V |
1368 |
CMOS |
320 |
1.2 |
GRID ARRAY |
BGA668,26X26,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
1368 CLBS |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B668 |
4 |
2.85 mm |
27 mm |
Not Qualified |
e1 |
1028 MHz |
30 |
320 |
250 |
27 mm |
||||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
24051 |
YES |
1.26 V |
1879 |
CMOS |
186 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
100 Cel |
.21 ns |
1879 CLBS |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e0 |
862 MHz |
30 |
186 |
225 |
17 mm |
|||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
406720 |
YES |
CMOS |
400 |
1,1.8,3.3 |
GRID ARRAY |
BGA676,26X26,40 |
Field Programmable Gate Arrays |
1 mm |
Tin/Lead (Sn/Pb) |
BOTTOM |
S-PBGA-B676 |
Not Qualified |
e0 |
1818 MHz |
400 |
||||||||||||||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
96250 |
YES |
.742 V |
5500 |
228 |
0.72 |
GRID ARRAY |
BGA676,26X26,40 |
.698 V |
1 mm |
100 Cel |
5500 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B676 |
4 |
3.52 mm |
27 mm |
ALSO OPERATES AT 0.85V NOMINAL SUPPLY |
e1 |
30 |
228 |
250 |
27 mm |
|||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
164 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
10320 |
YES |
1.03 V |
645 |
176 |
1 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA164,15X15,20 |
.97 V |
.5 mm |
100 Cel |
645 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B164 |
1.2 mm |
8 mm |
-40 TO 125 TEMPERATURE RANGE IS AVAILABLE AS EXTENDED INDUSTRIAL |
NOT SPECIFIED |
176 |
NOT SPECIFIED |
8 mm |
|||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL EXTENDED |
BALL |
81 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
8000 |
YES |
1.25 V |
500 |
250 |
1.2 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA81,9X9,16 |
Field Programmable Gate Arrays |
1.15 V |
.4 mm |
85 Cel |
500 CLBS |
0 Cel |
BOTTOM |
R-PBGA-B81 |
1 |
.54 mm |
4.377 mm |
Not Qualified |
250 |
4.496 mm |
||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
1760 |
BGA |
SQUARE |
PLASTIC/EPOXY |
2753000 |
YES |
344125 |
704 |
GRID ARRAY |
BGA1760,42X42,40 |
1 mm |
100 Cel |
344125 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B1760 |
3.881 mm |
42.5 mm |
704 |
42.5 mm |
||||||||||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
50000 |
YES |
1.13 V |
1886 |
CMOS |
240 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.07 V |
1 mm |
85 Cel |
1886 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2 mm |
23 mm |
Not Qualified |
e1 |
240 |
23 mm |
|||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
TRAY |
FLATPACK, THIN PROFILE, FINE PITCH |
1.425 V |
.5 mm |
100 Cel |
1536 CLBS, 60000 GATES |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e0 |
350 MHz |
20 |
235 |
14 mm |
||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
12060 |
YES |
1.575 V |
1206 |
185 |
1.5 |
1.5,1.5/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
85 Cel |
1206 CLBS |
0 Cel |
Tin/Lead (Sn63Pb37) |
BOTTOM |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
Not Qualified |
e0 |
320 MHz |
20 |
185 |
220 |
17 mm |
|||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
780 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
42959 |
YES |
.93 V |
1805 |
372 |
.9 |
0.9,1.2/3.3,1.5,2.5 |
GRID ARRAY, HEAT SINK/SLUG |
BGA780,28X28,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 Cel |
1805 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B780 |
2.7 mm |
29 mm |
Not Qualified |
e1 |
500 MHz |
372 |
29 mm |
||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
5136 |
YES |
2.625 V |
5136 |
CMOS |
182 |
2.5 |
1.2/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
2.375 V |
1 mm |
125 Cel |
5136 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
3.5 mm |
17 mm |
Not Qualified |
NOT SPECIFIED |
182 |
NOT SPECIFIED |
17 mm |
||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
81264 |
YES |
1.25 V |
81264 |
CMOS |
295 |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
81264 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
472.5 MHz |
295 |
23 mm |
|||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
256 |
YES |
3.465 V |
55 |
2.5 |
TRAY |
2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e3 |
NOT SPECIFIED |
55 |
NOT SPECIFIED |
14 mm |
||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
9400 |
YES |
3.465 V |
1175 |
206 |
2.5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,32 |
2.375 V |
.8 mm |
100 Cel |
6.7 ns |
1175 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
1.7 mm |
14 mm |
ALSO OPERATES 3.3V NOMINAL SUPPLY |
206 |
14 mm |
||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
121 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
540 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.5 mm |
85 Cel |
540 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B121 |
3 |
1 mm |
6 mm |
e1 |
260 |
6 mm |
||||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
121 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
4300 |
YES |
1.26 V |
540 |
100 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.5 mm |
100 Cel |
540 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B121 |
3 |
1 mm |
6 mm |
e1 |
100 |
260 |
6 mm |
||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
256 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
4300 |
YES |
1.26 V |
540 |
206 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.5 mm |
100 Cel |
540 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1 mm |
9 mm |
e1 |
206 |
260 |
9 mm |
||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
324 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
540 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.5 mm |
85 Cel |
540 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1 mm |
10 mm |
e1 |
30 |
260 |
10 mm |
|||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
121 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
4300 |
YES |
1.26 V |
540 |
100 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.5 mm |
100 Cel |
540 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B121 |
3 |
1 mm |
6 mm |
e1 |
100 |
260 |
6 mm |
||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
540 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.5 mm |
85 Cel |
540 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1 mm |
9 mm |
e1 |
260 |
9 mm |
||||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
160 |
2.5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
2.375 V |
.8 mm |
85 Cel |
160 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.7 mm |
14 mm |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e1 |
30 |
260 |
14 mm |
||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
540 |
2.5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
2.375 V |
.8 mm |
85 Cel |
540 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.7 mm |
14 mm |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e1 |
30 |
260 |
14 mm |
||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
81 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.26 V |
540 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.4 mm |
85 Cel |
540 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B81 |
1 |
.567 mm |
3.693 mm |
e1 |
260 |
3.797 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.