Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
1152 |
BGA |
SQUARE |
PLASTIC/EPOXY |
228000 |
YES |
.93 V |
9120 |
564 |
.9 |
0.9,1.2/3,1.5,2.5 |
GRID ARRAY |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 Cel |
9120 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B1152 |
3.6 mm |
35 mm |
Not Qualified |
e1 |
717 MHz |
564 |
35 mm |
|||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
49 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
384 |
YES |
1.26 V |
48 |
CMOS |
37 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.4 mm |
100 Cel |
9.36 ns |
48 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B49 |
3 |
1 mm |
3 mm |
e1 |
30 |
37 |
260 |
3 mm |
||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
132 |
BGA |
SQUARE |
PLASTIC/EPOXY |
1280 |
YES |
3.465 V |
104 |
2.5 |
TRAY |
2.5/3.3 |
GRID ARRAY |
BGA132,14X14,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B132 |
3 |
1.35 mm |
8 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e1 |
133 MHz |
30 |
104 |
250 |
8 mm |
||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
132 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
4320 |
YES |
1.26 V |
104 |
1.2 |
TRAY |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA132,14X14,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B132 |
3 |
1.35 mm |
8 mm |
Not Qualified |
e1 |
30 |
104 |
250 |
8 mm |
|||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
6864 |
YES |
3.6 V |
334 |
2.5 |
TRAY |
GRID ARRAY |
BGA484,22X22,40 |
2.375 V |
1 mm |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e1 |
30 |
334 |
250 |
23 mm |
||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
2280 |
YES |
3.465 V |
285 |
113 |
1.8 |
1.8/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.71 V |
.5 mm |
85 Cel |
285 CLBS |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
30 |
113 |
260 |
20 mm |
||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
2280 |
YES |
1.26 V |
285 |
211 |
1.2 |
1.2 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 Cel |
285 CLBS |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
S-PBGA-B256 |
3 |
1.7 mm |
17 mm |
Not Qualified |
e1 |
40 |
211 |
260 |
17 mm |
||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
1300 |
YES |
3.465 V |
160 |
206 |
2.5 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
2.375 V |
.8 mm |
100 Cel |
160 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.7 mm |
14 mm |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e1 |
30 |
206 |
260 |
14 mm |
||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
49 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
2100 |
YES |
1.26 V |
264 |
38 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.4 mm |
100 Cel |
264 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B49 |
3 |
.6 mm |
3.106 mm |
e1 |
38 |
260 |
3.185 mm |
||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
17000 |
YES |
1.26 V |
133 |
1.2 |
1.2 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
100 Cel |
.379 ns |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
375 MHz |
30 |
133 |
260 |
17 mm |
||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
33000 |
YES |
1.26 V |
295 |
1.2 |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
100 Cel |
.281 ns |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
500 MHz |
295 |
250 |
23 mm |
|||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
132 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
8000 |
YES |
1.26 V |
1000 |
CMOS |
86 |
1.2 |
1.2,1.2/3.3,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA132,14X14,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 Cel |
.494 ns |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B132 |
3 |
1.35 mm |
8 mm |
Not Qualified |
e1 |
435 MHz |
40 |
86 |
260 |
8 mm |
||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
|||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
13824 |
CMOS |
600000 |
1.5 |
TRAY |
GRID ARRAY |
1.425 V |
1 mm |
100 Cel |
13824 CLBS, 600000 GATES |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.44 mm |
23 mm |
Not Qualified |
e1 |
30 |
250 |
23 mm |
|||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
233 |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
1.14 V |
1 mm |
125 Cel |
-55 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B484 |
3 |
2.44 mm |
23 mm |
e0 |
20 |
233 |
240 |
23 mm |
||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
325 |
BGA |
SQUARE |
PLASTIC/EPOXY |
27696 |
YES |
1.26 V |
CMOS |
180 |
1.2 |
TRAY |
1.2 |
GRID ARRAY |
BGA325,21X21,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B325 |
3 |
11 mm |
Not Qualified |
180 |
11 mm |
|||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
27696 |
YES |
1.26 V |
267 |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
1.14 V |
1 mm |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.44 mm |
23 mm |
40 |
267 |
250 |
23 mm |
|||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
86184 |
YES |
1.26 V |
267 |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
1.14 V |
1 mm |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.44 mm |
23 mm |
40 |
267 |
250 |
23 mm |
|||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
86184 |
YES |
1.26 V |
AEC-Q100 |
267 |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
1.14 V |
1 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
2.44 mm |
23 mm |
40 |
267 |
250 |
23 mm |
|||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
325 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.03 V |
CMOS |
170 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA325,21X21,20 |
.97 V |
.5 mm |
100 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B325 |
1.45 mm |
11 mm |
IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY |
170 |
11 mm |
||||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
PIN/PEG |
896 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1.575 V |
75264 |
CMOS |
3000000 |
1.2 |
GRID ARRAY |
1.14 V |
1 mm |
75264 CLBS, 3000000 GATES |
PERPENDICULAR |
S-CPGA-P896 |
6.75 mm |
31 mm |
31 mm |
|||||||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
FLAT |
256 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
75264 |
YES |
1.575 V |
75264 |
CMOS |
MIL-STD-883 Class B |
3000000 |
1.2 |
1.2/1.5,1.2/3.3 |
FLATPACK, GUARD RING |
TPAK256,3SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
125 Cel |
75264 CLBS, 3000000 GATES |
-55 Cel |
QUAD |
S-CQFP-F256 |
3.3 mm |
36 mm |
Not Qualified |
250 MHz |
36 mm |
|||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
NO LEAD |
484 |
LGA |
SQUARE |
UNSPECIFIED |
75264 |
YES |
1.575 V |
75264 |
CMOS |
38535V;38534K;883S |
341 |
3000000 |
1.2 |
1.2/1.5,1.2/3.3 |
GRID ARRAY |
LGA484,22X22,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
125 Cel |
75264 CLBS, 3000000 GATES |
-55 Cel |
BOTTOM |
S-XBGA-N484 |
3.83 mm |
23 mm |
Not Qualified |
250 MHz |
341 |
23 mm |
|||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
FLAT |
256 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
75264 |
YES |
1.575 V |
75264 |
CMOS |
MIL-STD-883 Class B |
3000000 |
1.2 |
1.2/1.5,1.2/3.3 |
FLATPACK, GUARD RING |
TPAK256,3SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
125 Cel |
75264 CLBS, 3000000 GATES |
-55 Cel |
TIN LEAD |
QUAD |
S-CQFP-F256 |
3.3 mm |
36 mm |
Not Qualified |
e0 |
250 MHz |
20 |
225 |
36 mm |
|||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
NO LEAD |
484 |
LGA |
SQUARE |
UNSPECIFIED |
75264 |
YES |
1.575 V |
75264 |
CMOS |
MIL-STD-883 Class B |
341 |
3000000 |
1.2 |
1.2/1.5,1.2/3.3 |
GRID ARRAY |
LGA484,22X22,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
125 Cel |
75264 CLBS, 3000000 GATES |
-55 Cel |
BOTTOM |
S-XBGA-N484 |
3.83 mm |
23 mm |
Not Qualified |
250 MHz |
341 |
23 mm |
|||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
FLAT |
352 |
GQFF |
SQUARE |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
151824 |
YES |
1.26 V |
MIL-STD-883 Class B |
166 |
1.2 |
FLATPACK, GUARD RING |
TPAK352,2.9SQ,20 |
1.14 V |
.5 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQFP-F352 |
48 mm |
166 |
48 mm |
||||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
FLAT |
352 |
GQFF |
SQUARE |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
151824 |
YES |
1.26 V |
166 |
1.2 |
FLATPACK, GUARD RING |
TPAK352,2.9SQ,20 |
1.14 V |
.5 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQFP-F352 |
48 mm |
166 |
48 mm |
|||||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
|||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
FLAT |
352 |
GQFF |
SQUARE |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
151824 |
YES |
1.26 V |
MIL-PRF-38535 Class V |
166 |
1.2 |
FLATPACK, GUARD RING |
TPAK352,2.9SQ,20 |
1.14 V |
.5 mm |
125 Cel |
-55 Cel |
QUAD |
S-CQFP-F352 |
48 mm |
166 |
48 mm |
||||||||||||||||||||
Efinix |
FIELD PROGRAMMABLE GATE ARRAY |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
19728 |
YES |
1.25 V |
SMIC |
97 |
1.2 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
1.15 V |
.5 mm |
100 Cel |
-40 Cel |
QUAD |
S-PQFP-G144 |
1.6 mm |
20 mm |
97 |
20 mm |
||||||||||||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
11088 |
YES |
1.575 V |
1232 |
CMOS |
396 |
1.5 |
1.5,1.5/3.3,2/2.5,2.5 |
GRID ARRAY |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
.32 ns |
1232 CLBS |
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
BOTTOM |
S-PBGA-B672 |
4 |
2.65 mm |
27 mm |
Not Qualified |
e1 |
1200 MHz |
30 |
396 |
250 |
27 mm |
||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
5508 |
YES |
1.26 V |
612 |
CMOS |
158 |
250000 |
1.2 |
1.2,1.2/3.3,2.5 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 Cel |
.76 ns |
612 CLBS, 250000 GATES |
0 Cel |
Tin (Sn) |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
e3 |
572 MHz |
30 |
126 |
245 |
28 mm |
||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
1584 |
YES |
1.26 V |
176 |
CMOS |
144 |
50000 |
1.2 |
1.2,1.2/3.3,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 Cel |
.62 ns |
176 CLBS, 50000 GATES |
0 Cel |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
770 MHz |
112 |
17 mm |
||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
76800 |
YES |
1.05 V |
6000 |
HKMG |
400 |
1 |
GRID ARRAY |
BGA676,26X26,40 |
.95 V |
1 mm |
100 Cel |
1.05 ns |
6000 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B676 |
2.44 mm |
27 mm |
e1 |
1286 MHz |
400 |
27 mm |
|||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
25000 |
YES |
1.25 V |
1563 |
360 |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
1.15 V |
1 mm |
100 Cel |
1563 CLBS |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B484 |
2 mm |
23 mm |
e1 |
NOT SPECIFIED |
360 |
NOT SPECIFIED |
23 mm |
||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
150000 |
YES |
1.13 V |
CMOS |
240 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,32 |
Field Programmable Gate Arrays |
1.07 V |
.8 mm |
85 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B484 |
3 |
1.9 mm |
19 mm |
Not Qualified |
e1 |
30 |
240 |
260 |
19 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
1152 |
BGA |
SQUARE |
PLASTIC/EPOXY |
340000 |
YES |
.88 V |
12830 |
CMOS |
432 |
.85 |
0.85,1.5,2.5,2.5/3,1.2/3 |
GRID ARRAY |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.82 V |
1 mm |
85 Cel |
12830 CLBS |
0 Cel |
BOTTOM |
S-PBGA-B1152 |
3.6 mm |
35 mm |
Not Qualified |
NOT SPECIFIED |
432 |
NOT SPECIFIED |
35 mm |
||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
1152 |
BGA |
SQUARE |
PLASTIC/EPOXY |
340000 |
YES |
.88 V |
12830 |
CMOS |
432 |
.85 |
0.85,1.5,2.5,2.5/3,1.2/3 |
GRID ARRAY |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.82 V |
1 mm |
100 Cel |
12830 CLBS |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B1152 |
4 |
3.6 mm |
35 mm |
Not Qualified |
e1 |
30 |
432 |
245 |
35 mm |
|||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
TRAY |
FLATPACK, FINE PITCH |
1.425 V |
.5 mm |
85 Cel |
6144 CLBS, 250000 GATES |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
e3 |
350 MHz |
30 |
245 |
28 mm |
||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
75264 |
YES |
1.575 V |
75264 |
CMOS |
341 |
3000000 |
1.5 |
TRAY |
1.5/3.3 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
85 Cel |
75264 CLBS, 3000000 GATES |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B484 |
3 |
2.44 mm |
23 mm |
Not Qualified |
e0 |
350 MHz |
20 |
341 |
225 |
23 mm |
||||||
Microsemi |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1452 |
CMOS |
16000 |
3.3 |
FLATPACK, FINE PITCH |
3 V |
.5 mm |
85 Cel |
.9 ns |
1452 CLBS, 16000 GATES |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE |
e0 |
240 MHz |
20 |
225 |
28 mm |
|||||||||||
Actel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
1452 |
YES |
3.6 V |
1452 |
CMOS |
175 |
16000 |
3.3 |
3.3,3.3/5 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
3 V |
.5 mm |
85 Cel |
.9 ns |
1452 CLBS, 16000 GATES |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE |
e0 |
240 MHz |
175 |
28 mm |
|||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
1152 |
BGA |
SQUARE |
PLASTIC/EPOXY |
60440 |
YES |
1.25 V |
60440 |
CMOS |
534 |
1.2 |
1.2,1.2/3.3,3.3 |
GRID ARRAY |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
5.117 ns |
60440 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B1152 |
3 |
3.5 mm |
35 mm |
Not Qualified |
e1 |
717 MHz |
534 |
35 mm |
|||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
24624 |
YES |
1.25 V |
24624 |
CMOS |
156 |
1.2 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
100 Cel |
24624 CLBS |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e0 |
472.5 MHz |
156 |
17 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
22320 |
YES |
1.03 V |
1395 |
79 |
1 |
1,1.2/3.3,2.5 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.97 V |
.5 mm |
85 Cel |
1395 CLBS |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Not Qualified |
e0 |
362 MHz |
79 |
20 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
39600 |
YES |
2475 |
328 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,32 |
Field Programmable Gate Arrays |
.8 mm |
2475 CLBS |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B484 |
3 |
2.05 mm |
19 mm |
Not Qualified |
e1 |
30 |
328 |
260 |
19 mm |
|||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
1152 |
BGA |
SQUARE |
PLASTIC/EPOXY |
228000 |
YES |
.93 V |
9120 |
564 |
.9 |
GRID ARRAY |
BGA1152,34X34,40 |
.87 V |
1 mm |
100 Cel |
9120 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B1152 |
3.5 mm |
35 mm |
NOT SPECIFIED |
564 |
NOT SPECIFIED |
35 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.