Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
220000 |
YES |
.93 V |
8033 |
TSMC |
240 |
0.9 |
0.9 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,32 |
Field Programmable Gate Arrays |
.87 V |
.8 mm |
100 Cel |
8033 CLBS |
0 Cel |
BOTTOM |
S-PBGA-B484 |
3.25 mm |
19 mm |
Not Qualified |
ALSO OPERATES AT 0.95V NOMINAL SUPPLY |
NOT SPECIFIED |
240 |
NOT SPECIFIED |
19 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
1152 |
BGA |
SQUARE |
PLASTIC/EPOXY |
320000 |
YES |
.93 V |
11990 |
TSMC |
384 |
0.9 |
0.9 |
GRID ARRAY |
BGA1152,34X34,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 Cel |
11990 CLBS |
0 Cel |
BOTTOM |
S-PBGA-B1152 |
3.35 mm |
35 mm |
Not Qualified |
ALSO OPERATES AT 0.95V NOMINAL SUPPLY |
NOT SPECIFIED |
384 |
NOT SPECIFIED |
35 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL EXTENDED |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
4000 |
YES |
3.15 V |
250 |
246 |
3 |
3/3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
85 Cel |
250 CLBS |
0 Cel |
QUAD |
S-PQFP-G144 |
1.65 mm |
20 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
NOT SPECIFIED |
246 |
NOT SPECIFIED |
20 mm |
||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL EXTENDED |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
16000 |
YES |
3.15 V |
1000 |
320 |
3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP144,.87SQ,20 |
2.85 V |
.5 mm |
85 Cel |
1000 CLBS |
0 Cel |
QUAD |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
320 |
20 mm |
||||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
40000 |
YES |
1.25 V |
2500 |
500 |
1.2 |
1.2 |
GRID ARRAY |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
2500 CLBS |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B672 |
3 |
2 mm |
27 mm |
Not Qualified |
e1 |
NOT SPECIFIED |
500 |
NOT SPECIFIED |
27 mm |
||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
40000 |
YES |
1.25 V |
2500 |
500 |
1.2 |
1.2 |
GRID ARRAY |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
125 Cel |
2500 CLBS |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B256 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
NOT SPECIFIED |
500 |
NOT SPECIFIED |
17 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
40000 |
YES |
1.25 V |
2500 |
500 |
1.2 |
1.2 |
GRID ARRAY |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
2500 CLBS |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B672 |
3 |
2 mm |
27 mm |
Not Qualified |
e1 |
NOT SPECIFIED |
500 |
NOT SPECIFIED |
27 mm |
||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
50000 |
YES |
1.25 V |
3125 |
500 |
1.2 |
1.2 |
GRID ARRAY |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
3125 CLBS |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
NOT SPECIFIED |
500 |
NOT SPECIFIED |
17 mm |
||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
156000 |
YES |
1.13 V |
5890 |
416 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.07 V |
1 mm |
100 Cel |
5890 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B672 |
3 |
2.7 mm |
27 mm |
Not Qualified |
e1 |
622 MHz |
416 |
27 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
190000 |
YES |
1.13 V |
7170 |
TSMC |
544 |
1.1 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1.07 V |
1 mm |
100 Cel |
7170 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B1152 |
2.7 mm |
35 mm |
NOT SPECIFIED |
544 |
NOT SPECIFIED |
35 mm |
|||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
77000 |
YES |
1.13 V |
CMOS |
224 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,32 |
Field Programmable Gate Arrays |
1.07 V |
.8 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B484 |
1.9 mm |
19 mm |
Not Qualified |
NOT SPECIFIED |
224 |
NOT SPECIFIED |
19 mm |
||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
25000 |
YES |
1.13 V |
CMOS |
304 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.07 V |
1 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B484 |
2 mm |
23 mm |
Not Qualified |
NOT SPECIFIED |
304 |
NOT SPECIFIED |
23 mm |
||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
48000 |
YES |
1.13 V |
CMOS |
304 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.07 V |
1 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B484 |
2 mm |
23 mm |
Not Qualified |
NOT SPECIFIED |
304 |
NOT SPECIFIED |
23 mm |
||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
AUTOMOTIVE |
BALL |
484 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
77000 |
YES |
1.13 V |
CMOS |
224 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,32 |
Field Programmable Gate Arrays |
1.07 V |
.8 mm |
125 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B484 |
1.9 mm |
19 mm |
Not Qualified |
NOT SPECIFIED |
224 |
NOT SPECIFIED |
19 mm |
||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
149500 |
YES |
1.13 V |
CMOS |
240 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.07 V |
1 mm |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2 mm |
23 mm |
Not Qualified |
e1 |
240 |
23 mm |
|||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
149500 |
YES |
1.13 V |
CMOS |
240 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,32 |
Field Programmable Gate Arrays |
1.07 V |
.8 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B484 |
1.9 mm |
19 mm |
Not Qualified |
NOT SPECIFIED |
240 |
NOT SPECIFIED |
19 mm |
||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
TRAY |
FLATPACK, THIN PROFILE, FINE PITCH |
1.425 V |
.5 mm |
100 Cel |
1536 CLBS, 60000 GATES |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
350 MHz |
14 mm |
||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
TRAY |
FLATPACK, THIN PROFILE, FINE PITCH |
1.425 V |
.5 mm |
85 Cel |
1536 CLBS, 60000 GATES |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e0 |
350 MHz |
14 mm |
||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
75264 |
YES |
1.575 V |
75264 |
CMOS |
147 |
3000000 |
1.2 |
TRAY |
1.2/1.5,1.2/3.3 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
70 Cel |
75264 CLBS, 3000000 GATES |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
e3 |
250 MHz |
30 |
147 |
245 |
28 mm |
||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1232 |
CMOS |
24000 |
3.3 |
TUBE |
CHIP CARRIER |
3 V |
1.27 mm |
85 Cel |
2.8 ns |
1232 CLBS, 24000 GATES |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J84 |
3 |
4.572 mm |
29.3116 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
e3 |
94 MHz |
30 |
245 |
29.3116 mm |
||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1232 |
CMOS |
24000 |
3.3 |
TRAY |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
.5 mm |
85 Cel |
2.8 ns |
1232 CLBS, 24000 GATES |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
e3 |
94 MHz |
24 mm |
||||||||||||
Microsemi |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
2880 |
YES |
2.75 V |
2880 |
CMOS |
81 |
48000 |
2.5 |
2.5,3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
85 Cel |
1.2 ns |
2880 CLBS, 48000 GATES |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
32000 TYPICAL GATES AVAILABLE |
e3 |
238 MHz |
30 |
81 |
260 |
14 mm |
|||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
2880 |
YES |
2.75 V |
2880 |
CMOS |
81 |
48000 |
2.5 |
2.5,3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.25 V |
.5 mm |
85 Cel |
1.2 ns |
2880 CLBS, 48000 GATES |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
32000 TYPICAL GATES AVAILABLE |
e3 |
238 MHz |
30 |
81 |
260 |
14 mm |
|||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
768 |
YES |
1.575 V |
CMOS |
77 |
30000 |
1.5 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
1.425 V |
.5 mm |
100 Cel |
30000 GATES |
-40 Cel |
TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
77 |
14 mm |
|||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
3072 |
YES |
1.575 V |
CMOS |
97 |
125000 |
1.2 |
GRID ARRAY, LOW PROFILE |
BGA144,12X12,40 |
1.14 V |
1 mm |
100 Cel |
125000 GATES |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B144 |
3 |
1.55 mm |
13 mm |
Not Qualified |
e1 |
30 |
97 |
260 |
13 mm |
|||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
456 |
BGA |
SQUARE |
PLASTIC/EPOXY |
21504 |
YES |
2.7 V |
CMOS |
356 |
600000 |
2.5 |
TRAY |
2.5,2.5/3.3 |
GRID ARRAY |
BGA456,26X26,50 |
Field Programmable Gate Arrays |
2.3 V |
1.27 mm |
85 Cel |
600000 GATES |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B456 |
3 |
2.54 mm |
35 mm |
Not Qualified |
e0 |
180 MHz |
20 |
356 |
225 |
35 mm |
|||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
4224 |
YES |
1.575 V |
2816 |
CMOS |
MIL-STD-883 Class B |
248 |
250000 |
1.5 |
TRAY |
1.5,1.5/3.3,2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
125 Cel |
.99 ns |
2816 CLBS, 250000 GATES |
-55 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.7 mm |
17 mm |
Not Qualified |
250000 SYSTEM GATES AVAILABLE |
e1 |
649 MHz |
30 |
248 |
250 |
17 mm |
|||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
12060 |
YES |
1.575 V |
1206 |
185 |
1.5 |
1.5,1.5/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
85 Cel |
1206 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
Not Qualified |
e1 |
275 MHz |
185 |
17 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
12060 |
YES |
1.575 V |
1206 |
249 |
1.5 |
1.5,1.5/3.3 |
GRID ARRAY |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
85 Cel |
1206 CLBS |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.2 mm |
19 mm |
Not Qualified |
e0 |
320 MHz |
249 |
19 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
12060 |
YES |
1.575 V |
1206 |
249 |
1.5 |
1.5,1.5/3.3 |
GRID ARRAY |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
85 Cel |
1206 CLBS |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B324 |
3 |
2.2 mm |
19 mm |
Not Qualified |
e0 |
275 MHz |
249 |
19 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
5980 |
YES |
1.575 V |
598 |
185 |
1.5 |
1.5,1.5/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
85 Cel |
598 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
Not Qualified |
e1 |
405 MHz |
30 |
185 |
260 |
17 mm |
|||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL EXTENDED |
BALL |
780 |
BGA |
SQUARE |
PLASTIC/EPOXY |
32470 |
YES |
1.575 V |
3819 |
CMOS |
726 |
1.5 |
1.5,1.5/3.3 |
GRID ARRAY |
BGA780,28X28,40 |
Field Programmable Gate Arrays |
1.425 V |
1 mm |
85 Cel |
3819 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B780 |
3 |
3.5 mm |
29 mm |
Not Qualified |
e1 |
726 |
29 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
50528 |
YES |
1.25 V |
3158 |
CMOS |
450 |
1.2 |
1.2,1.5/3.3,3.3 |
GRID ARRAY |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
3158 CLBS |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B672 |
3 |
2.6 mm |
27 mm |
Not Qualified |
ALSO REQUIRES 3.3 SUPPLY |
e1 |
402.5 MHz |
434 |
27 mm |
||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10320 |
YES |
1.25 V |
10320 |
CMOS |
94 |
1.2 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.4 mm |
85 Cel |
10320 CLBS |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Not Qualified |
e0 |
472.5 MHz |
94 |
20 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
164 |
BGA |
SQUARE |
PLASTIC/EPOXY |
10320 |
YES |
2.625 V |
10320 |
CMOS |
106 |
2.5 |
1.2/3.3 |
GRID ARRAY |
BGA164,15X15,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 Cel |
10320 CLBS |
0 Cel |
BOTTOM |
S-PBGA-B164 |
Not Qualified |
NOT SPECIFIED |
106 |
NOT SPECIFIED |
|||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
55856 |
YES |
1.25 V |
55856 |
CMOS |
327 |
1.2 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,32 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
85 Cel |
55856 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B484 |
3 |
2.2 mm |
19 mm |
Not Qualified |
e1 |
472.5 MHz |
327 |
19 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
10320 |
YES |
1.03 V |
645 |
91 |
1 |
1,1.2/3.3,2.5 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
.97 V |
.5 mm |
645 CLBS |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Not Qualified |
e3 |
362 MHz |
91 |
20 mm |
||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
15408 |
YES |
1.25 V |
963 |
81 |
1.2 |
1.2,1.2/3.3,2.5 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
963 CLBS |
TIN LEAD |
QUAD |
S-PQFP-G144 |
1.65 mm |
20 mm |
Not Qualified |
e0 |
472.5 MHz |
81 |
20 mm |
|||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
780 |
BGA |
SQUARE |
PLASTIC/EPOXY |
39600 |
YES |
1.25 V |
2475 |
535 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY |
BGA780,28X28,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
2475 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B780 |
3 |
2.4 mm |
29 mm |
Not Qualified |
e1 |
472.5 MHz |
535 |
29 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
55856 |
YES |
1.03 V |
3491 |
327 |
1 |
1,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
.97 V |
1 mm |
85 Cel |
3491 CLBS |
0 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B484 |
3 |
2.4 mm |
23 mm |
Not Qualified |
e0 |
362 MHz |
327 |
23 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
75408 |
YES |
1.25 V |
4713 |
292 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,32 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
4713 CLBS |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.05 mm |
19 mm |
Not Qualified |
e1 |
292 |
19 mm |
|||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
324 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
29440 |
YES |
1.24 V |
1840 |
150 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY, LOW PROFILE |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
1.16 V |
1 mm |
85 Cel |
1840 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.55 mm |
19 mm |
Not Qualified |
e1 |
472.5 MHz |
150 |
19 mm |
|||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
121 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.26 V |
440 |
CMOS |
1.2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.14 V |
.8 mm |
100 Cel |
440 CLBS |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
S-PBGA-B121 |
3 |
1.1 mm |
9 mm |
e2 |
260 |
9 mm |
|||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
36 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
1280 |
YES |
1.26 V |
160 |
CMOS |
25 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.14 V |
.4 mm |
100 Cel |
9.36 ns |
160 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B36 |
3 |
1 mm |
2.5 mm |
e1 |
25 |
260 |
2.5 mm |
|||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
AUTOMOTIVE |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
256 |
YES |
1.26 V |
32 |
AEC-Q100 |
78 |
1.2 |
1.2 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
125 Cel |
32 CLBS |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
40 |
78 |
260 |
14 mm |
|||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
2112 |
YES |
1.26 V |
111 |
1.2 |
TRAY |
1.2 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
30 |
111 |
260 |
20 mm |
|||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
4320 |
YES |
3.465 V |
206 |
2.5 |
TRAY |
2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
2.375 V |
1 mm |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e1 |
30 |
206 |
260 |
17 mm |
|||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
6864 |
YES |
1.26 V |
206 |
1.2 |
TRAY |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,32 |
Field Programmable Gate Arrays |
1.14 V |
.8 mm |
100 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B256 |
3 |
1.7 mm |
14 mm |
Not Qualified |
e1 |
30 |
206 |
260 |
14 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.