Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
17000 |
YES |
1.26 V |
2125 |
CMOS |
201 |
1.2 |
1.2,1.2/3.3,3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 Cel |
.399 ns |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
2.1 mm |
17 mm |
Not Qualified |
e1 |
435 MHz |
201 |
260 |
17 mm |
||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
64 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
5936 |
YES |
1.26 V |
742 |
29 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA64,8X8,16 |
1.14 V |
.4 mm |
100 Cel |
742 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B64 |
1 mm |
3.5 mm |
29 |
3.5 mm |
|||||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
121 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
17000 |
YES |
1.05 V |
48 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA121,11X11,20 |
.95 V |
.5 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B121 |
3 |
1 mm |
6 mm |
30 |
48 |
260 |
6 mm |
||||||||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
9216 |
CMOS |
400000 |
1.5 |
TRAY |
FLATPACK, FINE PITCH |
1.425 V |
.5 mm |
85 Cel |
9216 CLBS, 400000 GATES |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
e3 |
350 MHz |
30 |
245 |
28 mm |
|||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
56340 |
YES |
1.26 V |
CMOS |
267 |
1.2 |
TRAY |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
100 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B484 |
3 |
2.44 mm |
23 mm |
Not Qualified |
30 |
267 |
250 |
23 mm |
|||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
56340 |
YES |
1.26 V |
CMOS |
267 |
1.2 |
TRAY |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
100 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B484 |
3 |
2.44 mm |
23 mm |
Not Qualified |
e0 |
20 |
267 |
225 |
23 mm |
||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
325 |
PLASTIC |
86316 |
SURFACE MOUNT |
CMOS |
180 |
1.2 |
TRAY |
1.2 |
BGA325,21X21,20 |
Field Programmable Gate Arrays |
85 Cel |
0 Cel |
3 |
Not Qualified |
180 |
|||||||||||||||||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
400 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
6060 |
YES |
1.26 V |
171 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA400,20X20,32 |
1.14 V |
.8 mm |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B400 |
3 |
1.51 mm |
17 mm |
40 |
171 |
250 |
17 mm |
||||||||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
325 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
56520 |
YES |
1.26 V |
200 |
1.2 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA325,21X21,20 |
1.14 V |
.5 mm |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B325 |
3 |
1.01 mm |
11 mm |
40 |
200 |
250 |
11 mm |
||||||||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
536 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
300000 |
YES |
1.03 V |
CMOS |
300 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA536,30X30,20 |
.97 V |
.5 mm |
100 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B536 |
1.45 mm |
16 mm |
IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY |
300 |
16 mm |
||||||||||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
300000 |
YES |
1.03 V |
CMOS |
284 |
1 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,32 |
.97 V |
.8 mm |
100 Cel |
0 Cel |
BOTTOM |
S-PBGA-B484 |
3.32 mm |
19 mm |
IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY |
284 |
19 mm |
||||||||||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
1152 |
BGA |
SQUARE |
PLASTIC/EPOXY |
300000 |
YES |
1.03 V |
CMOS |
512 |
1 |
GRID ARRAY |
BGA1152,34X34,40 |
.97 V |
1 mm |
100 Cel |
0 Cel |
BOTTOM |
S-PBGA-B1152 |
3.47 mm |
35 mm |
IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY |
512 |
35 mm |
||||||||||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
784 |
BGA |
SQUARE |
PLASTIC/EPOXY |
481000 |
YES |
1.03 V |
CMOS |
388 |
1 |
GRID ARRAY |
BGA784,28X28,40 |
.97 V |
1 mm |
100 Cel |
0 Cel |
BOTTOM |
S-PBGA-B784 |
3.47 mm |
29 mm |
IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY |
388 |
29 mm |
||||||||||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
1152 |
BGA |
SQUARE |
PLASTIC/EPOXY |
481000 |
YES |
1.03 V |
CMOS |
584 |
1 |
GRID ARRAY |
BGA1152,34X34,40 |
.97 V |
1 mm |
100 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B1152 |
3.47 mm |
35 mm |
IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY |
584 |
35 mm |
||||||||||||||||||
Microsemi |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
1152 |
BGA |
SQUARE |
PLASTIC/EPOXY |
481000 |
YES |
1.03 V |
CMOS |
584 |
1 |
GRID ARRAY |
BGA1152,34X34,40 |
.97 V |
1 mm |
100 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B1152 |
3.47 mm |
35 mm |
IT ALSO OPERATES AT 1.05 NOMINAL SUPPLY |
584 |
35 mm |
|||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
|||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
BALL |
1657 |
BGA |
SQUARE |
100k Rad(Si) |
PLASTIC/EPOXY |
151824 |
YES |
1.26 V |
720 |
1.2 |
GRID ARRAY |
BGA1657,41X41,40 |
1.14 V |
1 mm |
125 Cel |
-55 Cel |
BOTTOM |
S-PBGA-B1657 |
4.17 mm |
42.5 mm |
720 |
42.5 mm |
|||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
NO LEAD |
1657 |
LGA |
SQUARE |
100k Rad(Si) |
CERAMIC, METAL-SEALED COFIRED |
151824 |
YES |
1.26 V |
MIL-STD-883 Class B |
720 |
1.2 |
GRID ARRAY |
LGA1657,41X41,40 |
1.14 V |
1 mm |
125 Cel |
-55 Cel |
BOTTOM |
S-CBGA-N1657 |
3.51 mm |
42.5 mm |
720 |
42.5 mm |
|||||||||||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
|||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
101440 |
YES |
.98 V |
7925 |
300 |
0.95 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
.92 V |
.8 mm |
100 Cel |
1.27 ns |
7925 CLBS |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
S-PBGA-B324 |
3 |
1.5 mm |
15 mm |
e1 |
1098 MHz |
30 |
300 |
260 |
15 mm |
||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
325 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
52160 |
YES |
1.05 V |
4075 |
250 |
1 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA325,18X18,32 |
Field Programmable Gate Arrays |
.95 V |
.8 mm |
85 Cel |
1.27 ns |
4075 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B325 |
3 |
1.5 mm |
15 mm |
Not Qualified |
e1 |
1098 MHz |
30 |
250 |
260 |
15 mm |
|||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
1930 |
BGA |
SQUARE |
PLASTIC/EPOXY |
693120 |
YES |
1.03 V |
54150 |
CMOS |
1000 |
1 |
0.9,1.8 |
GRID ARRAY |
BGA1924,44X44,40 |
Field Programmable Gate Arrays |
.97 V |
1 mm |
85 Cel |
.74 ns |
54150 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B1930 |
3.65 mm |
45 mm |
Not Qualified |
e1 |
1818 MHz |
1000 |
45 mm |
|||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
1157 |
BGA |
SQUARE |
PLASTIC/EPOXY |
693120 |
YES |
1.03 V |
54150 |
CMOS |
600 |
1 |
1,1.8 |
GRID ARRAY |
BGA1156,34X34,40 |
Field Programmable Gate Arrays |
.97 V |
1 mm |
100 Cel |
.61 ns |
54150 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B1157 |
3.35 mm |
35 mm |
Not Qualified |
e1 |
1818 MHz |
600 |
35 mm |
||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
1927 |
BGA |
SQUARE |
PLASTIC/EPOXY |
693120 |
YES |
1.03 V |
54150 |
CMOS |
600 |
1 |
1,1.8 |
GRID ARRAY |
BGA1924,44X44,40 |
Field Programmable Gate Arrays |
.97 V |
1 mm |
100 Cel |
.58 ns |
54150 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B1927 |
4 |
3.65 mm |
45 mm |
Not Qualified |
e1 |
1818 MHz |
600 |
245 |
45 mm |
||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
TIN SILVER COPPER |
4 |
e1 |
30 |
240 |
|||||||||||||||||||||||||||||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
2892 |
BGA |
SQUARE |
PLASTIC/EPOXY |
2851800 |
YES |
.876 V |
162960 |
624 |
0.85 |
GRID ARRAY |
BGA2892,54X54,40 |
.825 V |
1 mm |
100 Cel |
162960 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B2892 |
4 |
4.51 mm |
55 mm |
e1 |
30 |
624 |
240 |
55 mm |
||||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
TIN SILVER COPPER |
4 |
e1 |
30 |
240 |
|||||||||||||||||||||||||||||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
4 |
e1 |
||||||||||||||||||||||||||||||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
780 |
BGA |
SQUARE |
PLASTIC/EPOXY |
160000 |
YES |
.93 V |
6151 |
TSMC |
288 |
0.9 |
0.9 |
GRID ARRAY |
BGA780,28X28,40 |
Field Programmable Gate Arrays |
.87 V |
1 mm |
100 Cel |
6151 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B780 |
3.35 mm |
29 mm |
Not Qualified |
NOT SPECIFIED |
288 |
NOT SPECIFIED |
29 mm |
|||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
6272 |
YES |
1.03 V |
392 |
176 |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP144,.87SQ,20 |
.97 V |
.5 mm |
100 Cel |
392 CLBS |
-40 Cel |
QUAD |
S-PQFP-G144 |
1.65 mm |
20 mm |
-40 TO 125 TEMPERATURE RANGE IS AVAILABLE AS EXTENDED INDUSTRIAL |
NOT SPECIFIED |
176 |
NOT SPECIFIED |
20 mm |
||||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
10320 |
YES |
1.03 V |
645 |
176 |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP144,.87SQ,20 |
.97 V |
.5 mm |
100 Cel |
645 CLBS |
-40 Cel |
QUAD |
S-PQFP-G144 |
1.65 mm |
20 mm |
-40 TO 125 TEMPERATURE RANGE IS AVAILABLE AS EXTENDED INDUSTRIAL |
NOT SPECIFIED |
176 |
NOT SPECIFIED |
20 mm |
||||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL EXTENDED |
BALL |
81 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
8000 |
YES |
1.25 V |
500 |
250 |
1.2 |
1.2 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA81,9X9,16 |
Field Programmable Gate Arrays |
1.15 V |
.4 mm |
85 Cel |
500 CLBS |
0 Cel |
BOTTOM |
R-PBGA-B81 |
1 |
.54 mm |
4.377 mm |
Not Qualified |
250 |
4.496 mm |
|||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL EXTENDED |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
8000 |
YES |
3.15 V |
500 |
250 |
3 |
3/3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
85 Cel |
500 CLBS |
0 Cel |
QUAD |
S-PQFP-G144 |
1.65 mm |
20 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
NOT SPECIFIED |
250 |
NOT SPECIFIED |
20 mm |
|||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
40000 |
YES |
1.25 V |
2500 |
500 |
1.2 |
1.2 |
GRID ARRAY |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
2500 CLBS |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
NOT SPECIFIED |
500 |
NOT SPECIFIED |
17 mm |
|||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
1760 |
BGA |
SQUARE |
PLASTIC/EPOXY |
2753000 |
YES |
344125 |
704 |
GRID ARRAY |
BGA1760,42X42,40 |
1 mm |
100 Cel |
344125 CLBS |
0 Cel |
BOTTOM |
S-PBGA-B1760 |
3.881 mm |
42.5 mm |
704 |
42.5 mm |
|||||||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
MILITARY |
FLAT |
208 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
2.75 V |
CMOS |
MIL-PRF-38535 Class Q |
32000 |
2.5 |
FLATPACK, GUARD RING |
2.25 V |
.5 mm |
125 Cel |
32000 GATES |
-55 Cel |
GOLD |
QUAD |
S-CQFP-F208 |
3.22 mm |
29.21 mm |
Not Qualified |
2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION |
e4 |
29.21 mm |
||||||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
76500 |
YES |
1.13 V |
CMOS |
240 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.07 V |
1 mm |
85 Cel |
0 Cel |
BOTTOM |
S-PBGA-B484 |
2 mm |
23 mm |
Not Qualified |
NOT SPECIFIED |
240 |
NOT SPECIFIED |
23 mm |
|||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
AUTOMOTIVE |
BALL |
484 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
77000 |
YES |
1.13 V |
CMOS |
224 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,32 |
Field Programmable Gate Arrays |
1.07 V |
.8 mm |
125 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B484 |
1.9 mm |
19 mm |
Not Qualified |
NOT SPECIFIED |
224 |
NOT SPECIFIED |
19 mm |
|||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
76500 |
YES |
1.13 V |
CMOS |
368 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.07 V |
1 mm |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B672 |
3 |
2 mm |
27 mm |
Not Qualified |
e1 |
368 |
27 mm |
||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
149500 |
YES |
1.13 V |
CMOS |
336 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY |
BGA672,26X26,40 |
Field Programmable Gate Arrays |
1.07 V |
1 mm |
85 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B672 |
3 |
2 mm |
27 mm |
Not Qualified |
e1 |
336 |
27 mm |
||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
|||||||||||||||||||||||||||||||||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
1932 |
BGA |
SQUARE |
PLASTIC/EPOXY |
952000 |
YES |
.93 V |
35920 |
TSMC |
840 |
.9 |
GRID ARRAY |
BGA1932,44X44,40 |
.87 V |
1 mm |
100 Cel |
35920 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B1932 |
3.85 mm |
45 mm |
NOT SPECIFIED |
840 |
NOT SPECIFIED |
45 mm |
||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
768 |
CMOS |
30000 |
1.5 |
TRAY |
FLATPACK, THIN PROFILE, FINE PITCH |
1.425 V |
.5 mm |
100 Cel |
768 CLBS, 30000 GATES |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e0 |
350 MHz |
20 |
235 |
14 mm |
||||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
1536 |
CMOS |
60000 |
1.5 |
TRAY |
FLATPACK, LOW PROFILE, FINE PITCH |
1.425 V |
.5 mm |
85 Cel |
1536 CLBS, 60000 GATES |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
350 MHz |
20 mm |
|||||||||||||
|
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
176 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1890 |
CMOS |
36000 |
3.3 |
TRAY |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
.5 mm |
85 Cel |
1.8 ns |
1890 CLBS, 36000 GATES |
-40 Cel |
QUAD |
S-PQFP-G176 |
3 |
1.6 mm |
24 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
114.75 MHz |
24 mm |
|||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL |
FLAT |
208 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.6 V |
2438 |
CMOS |
54000 |
3.3 |
FLATPACK, GUARD RING |
3 V |
.5 mm |
70 Cel |
2.3 ns |
2438 CLBS, 54000 GATES |
0 Cel |
QUAD |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
83 MHz |
29.21 mm |
||||||||||||||||
Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
COMMERCIAL |
FLAT |
208 |
GQFF |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
2414 |
YES |
3.6 V |
2438 |
CMOS |
54000 |
3.3 |
FLATPACK, GUARD RING |
3 V |
.5 mm |
70 Cel |
2.7 ns |
2438 CLBS, 54000 GATES |
0 Cel |
QUAD |
S-CQFP-F208 |
3.3 mm |
29.21 mm |
Not Qualified |
ALSO OPERATES AT 5V SUPPLY |
73 MHz |
29.21 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.