Intel - EP1C12F324C7N

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: RECTANGULAR;

ICE40HX8K-CT256 by Lattice Semiconductor is a CMOS FPGA with 7680 logic cells, 960 CLBs, and 206 inputs/outputs. Operating at up to 133 MHz, it suits industrial applications requiring low-profile grid array packages with fine pitch terminals.

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 472.5 MHz;

Intel's EP3C10E144I7N FPGA boasts 10320 logic cells, 94 inputs/outputs, and a clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temperature of 100°C.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE;

The Intel 10M40SAE144I7G is a Field Programmable Gate Array with 40000 logic cells, 2500 CLBs, and 500 inputs/outputs. It operates at temperatures ranging from -40 to 100°C and has a supply voltage of 2.85-3.15V. Ideal for industrial applications requiring high-performance programmable ICs in compact form factors.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: RECTANGULAR;

The Xilinx XC7K160T-1FFG676I is a FPGA with 162240 logic cells, 12675 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing such as telecommunications, networking, and industrial automation.

EP3C25Q240C8N by Intel is a CMOS FPGA with 24624 logic cells and CLBs. It operates at a max clock frequency of 472.5 MHz, making it suitable for high-speed applications in industries like telecommunications and data processing. With a package style of flatpack, fine pitch, this FPGA offers versatility in design and integration.

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 52160;

MPF100T-FCG484E by Microchip: FPGA with 244 inputs/outputs, CMOS tech, 1.03V max supply voltage. Ideal for high-performance applications requiring programmable gate arrays in a compact 23x23mm grid array package.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;

EP4CE55F23I7N by Intel is a FPGA with 55856 logic cells, 3491 CLBs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities, such as telecommunications equipment and industrial automation systems.

The Xilinx XC7A12T-2CSG325C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

LCMXO2-256ZE-1TG100C by Lattice Semiconductor is a 256 logic cell FPGA with 55 inputs/outputs, operating at 1.2V. It comes in a square package with gull wing terminals, suitable for applications requiring low-profile, fine-pitch ICs like consumer electronics and industrial automation.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;

LCMXO3LF-6900C-5BG324C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. It features a grid array package style, 0.8mm terminal pitch, and TIN SILVER COPPER finishing. Ideal for applications requiring low profile, fine pitch ICs in compact spaces.