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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | M2S060-FCSG325I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER; |
Datasheet | M2S060-FCSG325I Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.14 V |
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.01 mm |
No. of Inputs: | 200 |
Surface Mount: | YES |
No. of Outputs: | 200 |
Position Of Terminal: | BOTTOM |
No. of Terminals: | 325 |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
JESD-30 Code: | S-PBGA-B325 |
Package Shape: | SQUARE |
Maximum Operating Temperature: | 100 Cel |
Package Code: | TFBGA |
Width: | 11 mm |
Moisture Sensitivity Level (MSL): | 3 |
Programmable IC Type: | FIELD PROGRAMMABLE GATE ARRAY |
Maximum Supply Voltage: | 1.26 V |
Nominal Supply Voltage (V): | 1.2 |
No. of Logic Cells: | 56520 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA325,21X21,20 |
Finishing Of Terminal Used: | TIN SILVER COPPER |
Length: | 11 mm |
Form Of Terminal: | BALL |
Pitch Of Terminal: | .5 mm |
Peak Reflow Temperature (C): | 250 |