Cellphone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SI4713-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N20		.6 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
CC1101QRHBRG4Q1	Texas Instruments	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N32	2	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
CC115LRGPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.6 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
ST25R3912-AWLT	STMicroelectronics	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	BALL	30	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel		BOTTOM		R-PBGA-B30		.68 mm	2.865 mm				NOT SPECIFIED	NOT SPECIFIED	3.065 mm
ST25R3911B-AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT																				MATTE TIN				3					e3		260
HMC830LP6GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	.9 mm	6 mm			e3		260	6 mm
SX1268IMLTRT	Semtech	RF AND BASEBAND CIRCUIT		NO LEAD	24	HVQCCN	SQUARE		YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	1	1 mm	4 mm			e3		260	4 mm
SARA-R422-00B	U-blox Ag	RF AND BASEBAND CIRCUIT
ME310G1WW01T010100	Telit Communications Plc	RF AND BASEBAND CIRCUIT		NO LEAD	94	XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N94		2.6 mm	15 mm						18 mm
ST25R3918AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT
HMC832LP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	.9 mm	6 mm			e3		260	6 mm
LENA-R8001M10-00C	U-blox Ag	RF AND BASEBAND CIRCUIT
SKY65943-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1				1.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		S-XDMA-N10		.7 mm	2.5 mm				NOT SPECIFIED	NOT SPECIFIED	2.5 mm
BALF-NRG-02D3	STMicroelectronics	RF AND BASEBAND CIRCUIT		BALL	4	VBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,40/16		1 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B4		.69 mm	.855 mm			e1	30	260	1.385 mm
SARA-R500S-00B	U-blox Ag	RF AND BASEBAND CIRCUIT
SARA-R510AWS-01B	U-blox Ag	TELECOM CIRCUIT
SI4721-B20-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N20		.6 mm	3 mm	Not Qualified					3 mm
SARA-R410M-02B-04	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA96(UNSPEC)			65 Cel	-20 Cel		BOTTOM		R-XBGA-N96	4	2.78 mm	16 mm		-40 to 85 extended operating temp available				26 mm
ST25R3920B-AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT
SARA-R510S-01B	U-blox Ag	RF AND BASEBAND CIRCUIT
BGA7H1BN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-N6	1	.4 mm	.7 mm			e3			1.1 mm
CC2510F32RHHR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N36	3	1 mm	6 mm	Not Qualified		e4	NOT SPECIFIED	260	6 mm
EG25GGC-128-SGNS	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD		SMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				75 Cel	-35 Cel		SINGLE		R-XSMA-N		4.9 mm	30 mm		also available Extended Temperature Range -40 to 80 degree Celsius				51 mm
LARA-R211-02B	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	100	LGA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	300 mA	3.8 V		GRID ARRAY	LGA100(UNSPEC)			65 Cel	-20 Cel		BOTTOM		R-XLGA-N100	4	2.87 mm	24 mm		-40 to 85 extended operating temp available				26 mm
LARA-R211-02B-02	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	100		RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				65 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N100	4	2.87 mm	24 mm				NOT SPECIFIED	NOT SPECIFIED	26 mm
CC115LRTKT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm	4 mm			e4	30	260	4 mm
TOBY-L210-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM		R-XBGA-N152	4	2.87 mm	24.8 mm		-40 to 85 extended operating temp available				35.6 mm
SARA-R410M-02B-03	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA96(UNSPEC)			65 Cel	-20 Cel		BOTTOM		R-XLGA-N96	4	2.78 mm	16 mm		-40 to 85 extended operating temp available				26 mm
TOBY-L210-03S-03	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM		R-XBGA-N152		2.87 mm	24.8 mm		-40 to 85 extended operating temp available				35.6 mm
TQP3M9036	Qorvo	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		DUAL		S-PDSO-N8	1	.95 mm	2 mm					260	2 mm
ST25R3912-AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
ADF7021BCPZ-RL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified		e3		260	7 mm
SARA-R500S-01B	U-blox Ag	RF AND BASEBAND CIRCUIT
CC115LRGPT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.6 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
SARA-U201-04B-00	U-blox Ag	TELECOM CIRCUIT	COMMERCIAL	BUTT	96	BCC	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		CHIP CARRIER				65 Cel	-20 Cel		BOTTOM		R-XBCC-B96	4	3.25 mm	16 mm		ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V				26 mm
AD6636BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified		e1		260	17 mm
CC1000PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
LARA-R6001-00B	U-blox Ag	RF AND BASEBAND CIRCUIT
SA638	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		e4			7.8 mm
ADF4360-7BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
SKY13524-639LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	90 Cel	-30 Cel		QUAD		S-XQCC-N14		.5 mm	1.6 mm				NOT SPECIFIED	NOT SPECIFIED	1.6 mm
ST25R3911B-ASWB	STMicroelectronics	RF AND BASEBAND CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
LT5526EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF4360-0BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
AT86RF233-ZUR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified		e3			5 mm
ST25R3920AQWT	STMicroelectronics	RF AND BASEBAND CIRCUIT
ADF7020-1BCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified		e3	30	260	7 mm
AD607ARSZ	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e3		260	7.2 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.