Cellphone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Maximum Output Voltage	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC1111F32RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES				CMOS			3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		0 Cel		NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N36		3			Not Qualified				e4	30	260
CC2511F32RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel		0 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		S-XQCC-N36		3	.9 mm	6 mm	Not Qualified				e4	NOT SPECIFIED	260	6 mm
HMC602LP4E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-PQCC-N24		1	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
HMC702LP6CE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-PQCC-N40		1	.9 mm	6 mm	Not Qualified				e3			6 mm
LMH6521SQE/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		2			245 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	26 dB	MATTE TIN		QUAD		S-XQCC-N32		3	.8 mm	5 mm					e3	30	260	5 mm
LMH6521SQX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		2			245 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	26 dB	MATTE TIN		QUAD		S-XQCC-N32		3	.8 mm	5 mm					e3	30	260	5 mm
MAX4003ETA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1						3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel		TIN LEAD		DUAL		S-XDSO-N8		1	.8 mm	3 mm	Not Qualified				e0			3 mm
MAX4003ETA+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1						3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel		Matte Tin (Sn)		DUAL		S-XDSO-N8		1	.8 mm	3 mm	Not Qualified				e3	30	260	3 mm
MPCI-L200-03S	U-blox Ag	RF AND BASEBAND CIRCUIT
MPCI-L200-03S-00	U-blox Ag	RF AND BASEBAND CIRCUIT																																						NOT SPECIFIED	NOT SPECIFIED
MPCI-L200-03S-03	U-blox Ag	RF AND BASEBAND CIRCUIT
MPCI-L210-03S-03	U-blox Ag	RF AND BASEBAND CIRCUIT
QPF4288TR13-5K	Qorvo																									GOLD OVER NICKEL						3							e4		260
RF3183	Qorvo	RF AND BASEBAND CIRCUIT	OTHER	BUTT	11	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				85 Cel		-30 Cel				BOTTOM		S-PBCC-B11			1 mm	5 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	5 mm
RF3183TR13	Qorvo	RF AND BASEBAND CIRCUIT	OTHER	BUTT	11	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				85 Cel		-30 Cel				BOTTOM		S-PBCC-B11			1 mm	5 mm	Not Qualified							5 mm
SARA-G340-02S-00	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	96		RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel		-30 Cel				UNSPECIFIED		R-XXMA-N96		4	2.65 mm	16 mm						60	245	26 mm
SARA-R500S-61B	U-blox Ag	RF AND BASEBAND CIRCUIT
SARA-R510S-61B	U-blox Ag	RF AND BASEBAND CIRCUIT
SI4720-B20-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-20 Cel		MATTE TIN		QUAD		S-XQCC-N20		3	.6 mm	3 mm	Not Qualified				e3	40	260	3 mm
SKY13526-485LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14	HQCCN	SQUARE	UNSPECIFIED	YES	1						2.85 V		CHIP CARRIER, HEAT SINK/SLUG				90 Cel		-30 Cel				QUAD		S-XQCC-N14			.6 mm	2 mm						NOT SPECIFIED	NOT SPECIFIED	2 mm
SKY65723-81	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1						1.8 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel				DUAL		R-XDMA-N6			.8 mm	1.7 mm						NOT SPECIFIED	NOT SPECIFIED	2.3 mm
SX8653IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel				DUAL		R-PDSO-N14			.8 mm	3 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	4 mm
TOBY-L210-62S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		GRID ARRAY				65 Cel		-20 Cel				BOTTOM		R-XBGA-N152		4	2.87 mm	24.8 mm			-40 to 85 extended operating temp available					35.6 mm
TOBY-L280-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		GRID ARRAY				65 Cel		-20 Cel				BOTTOM		R-XBGA-N152		4	2.87 mm	24.8 mm			-40 to 85 extended operating temp available					35.6 mm
TRF3710IRGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD SILVER		QUAD		S-PQCC-N48		3	1 mm	7 mm	Not Qualified				e4	30	260	7 mm
ACMD-7410-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	9		RECTANGULAR	UNSPECIFIED	YES	1								MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		GOLD		UNSPECIFIED		R-XXMA-N9		3	.95 mm		Not Qualified				e4
ADF7021BCPZ-RL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3		260	7 mm
ADRF5515ABCPZN	Analog Devices	RF FRONT END CIRCUIT																														3								30	260
ADRF5515ABCPZN-R7	Analog Devices	RF FRONT END CIRCUIT																														3								30	260
AFE8030EDIALK	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1								GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel		-40 Cel		TIN LEAD		BOTTOM		S-PBGA-B400		3	2.65 mm	17 mm			RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500		e0		220	17 mm
CC110LRGPT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD SILVER		QUAD	.6 Mbps	S-PQCC-N20		3	1 mm	4 mm	Not Qualified				e4	30	260	4 mm
CC2400RSUR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N48			1 mm	7 mm	Not Qualified							7 mm
LARA-R202-02B	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	100	LGA	RECTANGULAR	UNSPECIFIED	YES	1				TS 16949		3.8 V		GRID ARRAY	LGA100(UNSPEC)			65 Cel		-20 Cel				BOTTOM		R-XLGA-N100		4	2.87 mm	24 mm			-40 to 85 extended operating temp available				245	26 mm
LISA-U200-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	76	QMA	RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel		-40 Cel				QUAD		R-XQMA-N76			2.87 mm	22.4 mm								33.2 mm
LX5584BLQ-TR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N16			1.023 mm	3 mm								3 mm
MAX9986AETP+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel		Matte Tin (Sn) - annealed		QUAD		S-XQCC-N20		1	.8 mm	5 mm	Not Qualified				e3	30	260	5 mm
MAX9986AETP-T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel		TIN LEAD		QUAD		S-XQCC-N20		1	.8 mm	5 mm	Not Qualified				e0			5 mm
MC13202FCR2	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		TIN		QUAD		S-PQCC-N32		3	1 mm	5 mm	Not Qualified				e3	40	260	5 mm
ADRF5515BCPZN-RL	Analog Devices	RF AND BASEBAND CIRCUIT																														3								30	260
SKY65048-360LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		MATTE TIN		DUAL		S-PDSO-N8		1	1 mm	2 mm	Not Qualified				e3		260	2 mm
SKY66420-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,20		.5 mm	85 Cel		-40 Cel				QUAD		S-XQCC-N16			.8 mm	3 mm						NOT SPECIFIED	NOT SPECIFIED	3 mm
MAX4003EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		TIN LEAD		DUAL		S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified				e0			3 mm
MAX4003EUA+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		Matte Tin (Sn) - annealed		DUAL		S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified				e3	30	260	3 mm
SKY66292-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT																														3									260
ADF4360-8BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-1BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF7021-NBCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN		QUAD		S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3	30	260	7 mm
MAX5864ETM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS		.0165 mA	3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel		TIN LEAD	3 V	QUAD		S-XQCC-N48	VOLTAGE	1	.8 mm	7 mm	Not Qualified	DIFFERENTIAL		1.5 V	e0		245	7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.