Quectel Wireless Solutions - BC66NB-04-STD

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

BASEBAND CIRCUIT;

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN; Surface Mount: YES;

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Shape: SQUARE; JESD-30 Code: S-XQMA-N36;

BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: RECTANGULAR;

RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 42; Package Code: QMA; Package Shape: RECTANGULAR; No. of Functions: 1;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;

Nordic Semiconductor's NRF9160-SIAA-B1A-R is a Cellphone IC with RF and Baseband Circuit for telecom. It operates in industrial temperature range (-40 to 85°C) with 3.8V supply voltage. The package is rectangular, surface mountable, grid array style, measuring 10.5mm x 16mm with 127 terminals at 0.5mm pitch suitable for various wireless applications.

The Texas Instruments CC2591RGVT is a cellphone IC with 16 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and max current of 4mA. This RF front end circuit has a terminal pitch of 0.65mm and is suitable for industrial applications requiring very thin profile components.

Quectel Wireless Solutions' BG95M1LA-64-SGNS, a CELL IC with 102 terminals in MICROELECTRONIC ASSEMBLY, operates b/w -35°C to 75°C. This RF and BASEBAND CIRCUIT has a nominal voltage of 3.3V, ideal for compact cellphone designs due to its small dimensions of 19.9mm width and 23.6mm length.