Cellphone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD607ARS	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e0		240	7.2 mm
ADF4360-7BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
SARA-R412M-02B	U-blox Ag	RF AND BASEBAND CIRCUIT	OTHER	BUTT	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY				65 Cel	-20 Cel		BOTTOM		R-XBGA-B96	4	2.78 mm	16 mm				NOT SPECIFIED	NOT SPECIFIED	26 mm
BGA725L6E6327FTSA1/SAMPLE	Infineon Technologies	BASEBAND CIRCUIT
ADF4360-0BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
CC1020RSSR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.1536 Mbps	S-XQCC-N32	3	1 mm	7 mm	Not Qualified		e4	NOT SPECIFIED	260	7 mm
MAX2620EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
MAX2620EUA+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
NRF9160-SIBA-B1A-R	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	127	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA127,21X30,20		.5 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-N127		1.1 mm	10.5 mm						16 mm
1185	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16		.95 mm	4 mm	Not Qualified					4 mm
NINA-B222-03B	U-blox Ag	RF AND BASEBAND CIRCUIT																								4
SARA-U201-03B-00	U-blox Ag	TELECOM CIRCUIT	COMMERCIAL	BUTT	96	BCC	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		CHIP CARRIER				65 Cel	-20 Cel		BOTTOM		R-XBCC-B96	4	3.25 mm	16 mm		ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V				26 mm
ADF7021BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified		e3	40	260	7 mm
RFX2401C	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N16		.6 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
SX8652IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N14	2	.8 mm	3 mm	Not Qualified		e3		260	4 mm
MAX2606EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified		e0			2.9 mm
MAX2606EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified		e3	30	260	2.9 mm
SARA-R422-01B	U-blox Ag	RF AND BASEBAND CIRCUIT
MAX-7W-0	U-blox Ag	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm	9.7 mm						10.1 mm
BGC100GN6E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT		BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS					CHIP CARRIER							BOTTOM		R-XBCC-B6	1
HMC832ALP6GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N40	1	.9 mm	6 mm			e3	30	260	6 mm
HMC830LP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	.9 mm	6 mm	Not Qualified		e3		260	6 mm
LMH2110TM	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.675 mm	.84 mm	Not Qualified					1.24 mm
SKY13522-644LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	8	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	90 Cel	-30 Cel		QUAD		S-XQCC-N8		.5 mm	1.1 mm				NOT SPECIFIED	NOT SPECIFIED	1.1 mm
CC115LRTKR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm	4 mm	Not Qualified		e4	30	260	4 mm
AD607ARS-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e0		240	7.2 mm
AD607ARSZ-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e3		260	7.2 mm
ADF4360-0BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
M95FA-03-STD	Quectel Wireless Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	42	QMA	RECTANGULAR	UNSPECIFIED	YES	1				4 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-N42		2.65 mm	19.9 mm						23.6 mm
SARA-R510M8S-71B	U-blox Ag	RF AND BASEBAND CIRCUIT
CC2591RGVR	Texas Instruments	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			4 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified		e4	30	260	4 mm
SARA-R510M8S-61B	U-blox Ag	RF AND BASEBAND CIRCUIT
HMC832ALP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N40	1	.9 mm	6 mm			e3	30	260	6 mm
LENA-R8001-00C	U-blox Ag	RF AND BASEBAND CIRCUIT
LISA-U200-01S-03	U-blox Ag	RF AND BASEBAND CIRCUIT
SI4711-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N20		.6 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SARA-R412M-02B-03	U-blox Ag	RF AND BASEBAND CIRCUIT	COMMERCIAL	NO LEAD	96	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY	LGA96(UNSPEC)			65 Cel	-20 Cel		BOTTOM		R-XLGA-N96	4	2.78 mm	16 mm		-40 to 85 extended operating temp available				26 mm
SI4711-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N20		.6 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
AT86RF231-ZF	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified		e3			5 mm
LT5575EUF#TRPBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
AD9082BBPZ-2D2AC	Analog Devices	RF AND BASEBAND CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
ME310G1-W1	Telit Communications Plc	RF AND BASEBAND CIRCUIT
S2-LPCBQTR	STMicroelectronics	RF AND BASEBAND CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
ADF4360-8BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
HL7692	Sierra Wireless	RF AND BASEBAND CIRCUIT		NO LEAD	146	LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.7 V		GRID ARRAY	LGA146(UNSPEC)			85 Cel	-40 Cel		BOTTOM		R-XBGA-N146		2.7 mm	22 mm		Also Operates with class A: -30 deg c to 70 deg c				23 mm
MAX2620EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0	20	240	3 mm
MAX2620EUA+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3	30	260	3 mm
CC1110EMK433	Texas Instruments	RF AND BASEBAND CIRCUIT

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.