Other Function uPs,uCs & Peripheral ICs

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MFRC52202HN1,151	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel	-25 Cel		QUAD						30	260			100 mA		Other Microprocessor ICs		.5 mm	S-PQCC-N32	1	Not Qualified
MIMXRT1176CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm				40	260	14 mm	CMOS					.8 mm	S-PBGA-B289	3
XC7Z020-1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm						19 mm	CMOS		1 V			.8 mm	S-PBGA-B484
MCIMX287CVM4B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.55 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.37 mm	14 mm	IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V			40	260	14 mm	CMOS		1.45 V			.8 mm	S-PBGA-B289	3	Not Qualified	e1
453-00053C	Laird Technologies	SoC
ESP32-C3-MINI-1-H4	Espressif Systems (Shanghai)	SoC		NO LEAD	53	QMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		3 V	105 Cel	-40 Cel		QUAD	2.55 mm	13.2 mm						16.6 mm	CMOS		3.3 V				R-XQMA-N53	3
ATSAMA5D27-SOM1	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	176	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY	MODULE,176LEAD	3 V	85 Cel	-40 Cel		UNSPECIFIED	2.8 mm	38 mm	UPTO 4 FLEXCOMM AVAILABLE			NOT SPECIFIED	NOT SPECIFIED	40 mm	CMOS		3.3 V		CAN(2), I2C, I2S, QSPI, SSC, SDMMC, SPI, UART(4)	.8 mm	R-XXMA-N176
MCIMX535DVV1C	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.4 V		0.9/1.25,1.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel	-20 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm				40	260	19 mm	CMOS		1.25 V	Graphics Processors		.8 mm	S-PBGA-B529	3	Not Qualified	e2
NRF52832-QFAB-T	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm						6 mm	CMOS		3 V			.4 mm	S-XQCC-N48
MIMX8MM6DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm				40	260	14 mm	CMOS		1 V			.5 mm	S-PBGA-B486	3		e2
ATECC608B-MAHDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm					260	3 mm	CMOS				I2C	.5 mm	R-PDSO-N8	1		e4
NRF52810-QCAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel		QUAD	.95 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm	CMOS		3 V			.5 mm	S-XQCC-N32
P82B715TD,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.75 mm	3.9 mm				30	260	4.9 mm	BIPOLAR		5 V			1.27 mm	R-PDSO-G8	1	Not Qualified	e4
ESP32-S3-WROOM-1U-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm						19.2 mm	CMOS		3.3 V			1.27 mm	R-XXMA-N41
SLB9670VQ20FW785XTMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	85 Cel	-20 Cel	NICKEL GOLD PALLADIUM SILVER	QUAD	.9 mm	5 mm	ALSO AVAILABLE WITH 3.3V NOM SUPPLY					5 mm	CMOS		1.8 V			.5 mm	S-PQCC-N32	1
ESP32-C3-MINI-1U-H4	Espressif Systems (Shanghai)	SoC		NO LEAD	53	QMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		3 V	105 Cel	-40 Cel		QUAD	2.55 mm	12.5 mm						13.2 mm	CMOS		3.3 V				R-XQMA-N53	3
CY8C5287AXI-LP095	Infineon Technologies	PSoC	INDUSTRIAL															PURE TIN																	3
ESP32-C3FN4	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm	ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY					5 mm	CMOS		3.3 V			.5 mm	S-PQCC-N32
MCP2221-I/SL	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		SMALL OUTLINE	SOP14,.24	3 V	85 Cel	-40 Cel	MATTE TIN	DUAL	1.75 mm	3.9 mm						8.65 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G14			e3
AR1100-I/SS	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V	TS 16949		SMALL OUTLINE, SHRINK PITCH		3.135 V	85 Cel	-40 Cel	MATTE TIN	DUAL	2 mm	5.3 mm	ALSO OPERATES AT 5V SUPPLY			40	260	7.2 mm	CMOS		3.3 V			.65 mm	R-PDSO-G20	2	Not Qualified	e3
NRF52810-QFAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel		QUAD	.95 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm	CMOS		3 V			.4 mm	S-XQCC-N48
PGA460TPWQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V	AEC-Q100		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1.2 mm	4.4 mm	ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY	0		30	260	5 mm	CMOS		12 V		SPI; UART; USART	.65 mm	R-PDSO-G16	2		e4
DA14531MOD-00F01002	Renesas Electronics	SoC																								250									3
FT230XQ-U	FTDI	MICROPROCESSOR CIRCUIT																							NOT SPECIFIED	NOT SPECIFIED		CMOS
XC7Z010-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm						17 mm	CMOS		1 V			.8 mm	S-PBGA-B400	3		e1
ATECC608A-MAHDA-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.6 mm	2 mm				30	260	3 mm	CMOS					.5 mm	R-PDSO-N8	1		e4
PN5321A3HN/C106,55	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			3/5	CHIP CARRIER	LCC40,.24SQ,20		85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD						30	260			150 mA		Other Microprocessor ICs		.5 mm	S-PQCC-N40	2	Not Qualified	e4
ESP32-S3-WROOM-1U-N16R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm						19.2 mm	CMOS		3.3 V			1.27 mm	R-XXMA-N41
AR1100-I/SO	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	3.465 V	TS 16949		SMALL OUTLINE	SOP20,.4	3.135 V	85 Cel	-40 Cel	MATTE TIN	DUAL	2.65 mm	7.5 mm	ALSO OPERATES AT 5V SUPPLY				260	12.8 mm	CMOS		3.3 V			1.27 mm	R-PDSO-G20	1	Not Qualified	e3
XC7Z020-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm						17 mm	CMOS		1 V			.8 mm	S-PBGA-B400	3		e1
ESP32-S3-WROOM-1U-N4R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm						19.2 mm	CMOS		3.3 V			1.27 mm	R-XXMA-N41
XC7Z020-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm						17 mm	CMOS		1 V			.8 mm	S-PBGA-B400	3		e1
ESP32-WROOM-32UE-N8R2	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm				30	250	19.2 mm	CMOS		3.3 V			1.27 mm	R-XXMA-N38	3
NRF52810-QCAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel		QUAD	.95 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm	CMOS		3 V			.5 mm	S-XQCC-N32
XTDA4VHXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel	0 Cel		BOTTOM	3.341 mm	31 mm						31 mm	CMOS		.8 V			.8 mm	S-PBGA-B1414
BGM13P32F512GA-V2R	Silicon Labs	SoC
P82B715DRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V			SMALL OUTLINE		4.5 V	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1.75 mm	3.9 mm	VCCB(Min)(V) is 3, VCCB(Max)(V) is 12	0	.4 MHz	NOT SPECIFIED	260	4.9 mm	BIPOLAR		5 V		I2C	1.27 mm	R-PDSO-G8	1	Not Qualified	e4
SM-K26-XCL2GI-ED	Xilinx	PSoC
NRF52810-QFAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-40 Cel		QUAD	.95 mm	6 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm	CMOS		3 V			.4 mm	S-XQCC-N48
XC7Z030-2FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm						27 mm	CMOS		1 V			1 mm	S-PBGA-B676
NRF52805-CAAA-R7	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm						2.482 mm	CMOS		3 V			.4 mm	R-PBGA-B28
MIMX8MQ6DVAJZAB	NXP Semiconductors	SoC																TIN SILVER							40	260									3		e2
XC7Z020-L1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.6 mm	19 mm						19 mm	CMOS		1 V			.8 mm	S-PBGA-B484
ESP32-S3-WROOM-1U-N8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm						19.2 mm	CMOS		3.3 V			1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1U-N16R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm						19.2 mm	CMOS		3.3 V			1.27 mm	R-XXMA-N41
SM-K26-XCL2GC-ED	Xilinx	PSoC
XC7Z010-1CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel	-40 Cel		BOTTOM	1.5 mm	13 mm						13 mm	CMOS		1 V			.8 mm	S-PBGA-B225
XC7Z010-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm	17 mm						17 mm	CMOS		1 V			.8 mm	S-PBGA-B400	3		e1