Other Function uPs,uCs & Peripheral ICs

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	DAC Channels	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XC7Z020-3CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM		1.6 mm			17 mm								17 mm			CMOS			1 V						.8 mm	S-PBGA-B400	3		e1
MIMXRT1173CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel		-40 Cel				BOTTOM		1.52 mm			14 mm						40	260	14 mm			CMOS									.8 mm	S-PBGA-B289	3
CC3220MODASF12MONR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED	YES	3.6 V		NO		CHIP CARRIER		2.3 V	85 Cel		-40 Cel	NICKEL GOLD	YES		BOTTOM	NO	2.41 mm	1024000	256	20.5 mm	0		TIMER(4), WDT	0		30	260	25 mm		262144	CMOS	4-Ch 12-Bit		3.3 V	NO		I2C, I2S, SPI, UART	FLASH	I2C; I2S; SPI; UART	1.27 mm	R-XBCC-B63	3		e4	8	25
ESP32-S3-WROOM-1U-N16	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel				UNSPECIFIED		3.35 mm			18 mm								19.2 mm			CMOS			3.3 V						1.27 mm	R-XXMA-N41
XC7Z010-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM		1.6 mm			17 mm								17 mm			CMOS			1 V						.8 mm	S-PBGA-B400	3		e1
ATWINC1500-MR210PB1954	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel				UNSPECIFIED		2.113 mm			14.73 mm						NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS			3.3 V							R-XXMA-N28
ATWINC1510-MR210PB1952	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949			MICROELECTRONIC ASSEMBLY	MODULE28(UNSPEC)	2.7 V	80 Cel		-40 Cel				UNSPECIFIED		2.11 mm			14.73 mm					48 MHz			21.72 mm			CMOS			3.3 V							R-XXMA-N28
MIMX8QX6AVLFZAC	NXP Semiconductors	SYSTEM ON CHIP	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel		-40 Cel	TIN SILVER			BOTTOM		2.52 mm			21 mm						40	260	21 mm			CMOS			1.1 V						.8 mm	S-PBGA-B609	3		e2
ATWINC1510-MR210UB1961	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949			MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel				UNSPECIFIED		2.113 mm			14.73 mm								21.72 mm			CMOS			3.3 V							R-XXMA-N28
SLM9670AQ20FW1311XTMA1	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1.95 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.65 V	105 Cel		-40 Cel	NICKEL GOLD PALLADIUM SILVER			QUAD		.9 mm			5 mm		ALSO OPERATES WITH 3.3V SUPPLY						5 mm			CMOS			1.8 V						.5 mm	S-XQCC-N32	1
MFRC52201HN1,115	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel				QUAD											30	260						100 mA			Other Microprocessor ICs				.5 mm	S-PQCC-N32	1	Not Qualified
MCIMX6Q7CVT08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm			21 mm		EACH GPIO MODULE SUPPORTS 32 BITS OF I/O				40	260	21 mm			CMOS			1.4 V						.8 mm	S-PBGA-B624	3		e1
NRF52805-CAAA-R	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel		-40 Cel				BOTTOM		.535 mm			2.464 mm								2.482 mm			CMOS			3 V						.4 mm	R-PBGA-B28
MIMXRT117FCVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel		-40 Cel				BOTTOM		1.52 mm			14 mm								14 mm			CMOS									.8 mm	S-PBGA-B289
PGA460TPWRQ1	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V	AEC-Q100			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD			DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm			CMOS			12 V					SPI; UART; USART	.65 mm	R-PDSO-G16	2		e4
CC1310F128RHBR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			QUAD		1 mm			5 mm						NOT SPECIFIED	260	5 mm		28672	CMOS			3.3 V						.5 mm	S-PQCC-N32	3		e4
MIMXRT1052CVJ5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel		-40 Cel	TIN SILVER			BOTTOM		1.52 mm			12 mm						40	260	12 mm			CMOS									.8 mm	S-PBGA-B196	3		e2
SM-K26-XCL2GC	Xilinx	PSoC
MIMXRT1064CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel				BOTTOM		1.43 mm			10 mm						40	260	10 mm			CMOS									.65 mm	S-PBGA-B196	3
ATWINC1500-MR210UB1954	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	3.6 V				MICROELECTRONIC ASSEMBLY		2.7 V	85 Cel		-40 Cel				UNSPECIFIED		2.113 mm			14.73 mm						NOT SPECIFIED	NOT SPECIFIED	21.72 mm			CMOS			3.3 V							R-XXMA-N28
FT245BL	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V				FLATPACK, LOW PROFILE		4.35 V	70 Cel		0 Cel	MATTE TIN			QUAD		1.6 mm			7 mm						30	260	7 mm			CMOS			5 V						.8 mm	S-PQFP-G32	3	Not Qualified	e3
CY8C3866AXI-040T	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		N	QUAD		1.6 mm			14 mm								14 mm	65536 Bits		CMOS			3.3 V		Other uPs/uCs/Peripheral ICs				.5 mm	S-PQFP-G100	3	Not Qualified
XC7Z010-L1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel				BOTTOM		1.6 mm			17 mm								17 mm			CMOS			1 V						.8 mm	S-PBGA-B400
MCIMX6Q5EYM10AD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.35 V	105 Cel		-20 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm			21 mm		24MHZ NOMINAL FREQ AVAILABLE				40	260	21 mm			CMOS									.8 mm	S-PBGA-B624	3		e1
FT245RQ-REEL	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		3.3 V	85 Cel		-40 Cel				QUAD		1 mm			5 mm								5 mm			CMOS									.5 mm	S-XQCC-N32	3	Not Qualified
ATECC608B-MAHCZ-S	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel				DUAL		.6 mm			2 mm								3 mm			CMOS								1-WIRE	.5 mm	R-PDSO-N8
DA14531-00000FX2	Renesas Electronics	SoC																																																1		e4
INEMO-M1	STMicroelectronics	MICROPROCESSOR CIRCUIT
MIMX8MN6DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel		0 Cel	TIN SILVER			BOTTOM		1.25 mm			14 mm						40	260	14 mm			CMOS			1 V						.5 mm	S-PBGA-B486	3		e2
MFRC52202HN1,118	NXP Semiconductors	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES				3/3.3	CHIP CARRIER	LCC32,.2SQ,20		85 Cel		-25 Cel				QUAD											30	260						100 mA			Other Microprocessor ICs				.5 mm	S-PQCC-N32	1	Not Qualified
P82B715D	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	12 V				SMALL OUTLINE		4.5 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			DUAL		1.75 mm			3.9 mm		VCCB(Min)(V) is 3, VCCB(Max)(V) is 12		0	.4 MHz	NOT SPECIFIED	260	4.9 mm			BIPOLAR			5 V					I2C	1.27 mm	R-PDSO-G8	1	Not Qualified	e4
CY8C3866AXI-040	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		N	QUAD		1.6 mm			14 mm						40	260	14 mm	65536 Bits		CMOS			3.3 V		Other uPs/uCs/Peripheral ICs				.5 mm	S-PQFP-G100	3	Not Qualified	e4
MCIMX6S7CVM08AC	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm			CMOS									.8 mm	S-PBGA-B624	3		e1
MIMX8MM5DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel		0 Cel	TIN SILVER			BOTTOM		1.25 mm			14 mm						40	260	14 mm			CMOS			1 V						.5 mm	S-PBGA-B486	3		e2
MIMXRT1021CAF4B	NXP Semiconductors	SoC																																40	260															3
NRF52811-QCAA-R7	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.7 V	85 Cel		-40 Cel				QUAD		.9 mm			5 mm								5 mm			CMOS			3 V						.5 mm	S-XQCC-N32
MCIMX6Y2DVM09AB	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.25 V	95 Cel		0 Cel	TIN SILVER COPPER			BOTTOM		1.32 mm			14 mm						40	260	14 mm			CMOS			1.275 V						.8 mm	S-PBGA-B289	3		e1
SE050C1HQ1/Z01SCZ	NXP Semiconductors	CRYPTOGRAPHIC AUTHENTICATOR	OTHER	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.12SQ,16	1.62 V	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD SILVER			QUAD		.33 mm			3 mm						30	260	3 mm			CMOS			1.8 V						.4 mm	S-PQCC-N20	1		e4
XC7Z007S-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel				BOTTOM		1.6 mm			17 mm								17 mm			CMOS			1 V						.8 mm	S-PBGA-B400
XC7Z030-1FBG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel				BOTTOM		2.54 mm			27 mm								27 mm			CMOS			1 V						1 mm	S-PBGA-B676
XC7Z020-L1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel				BOTTOM		1.6 mm			17 mm								17 mm			CMOS			1 V						.8 mm	S-PBGA-B400
DS28CM00R-A00+T	Analog Devices	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V				SMALL OUTLINE, LOW PROFILE, SHRINK PITCH		1.62 V	85 Cel		-40 Cel	Matte Tin (Sn) - annealed			DUAL		1.45 mm			1.625 mm		IT ALSO OPERATE AT 1.8 V SUPPLY				30	260	2.9 mm			CMOS			5 V						.95 mm	R-PDSO-G5	1	Not Qualified	e3
EFR32BG22C112F352GM32-C	Silicon Labs	SoC																		MATTE TIN														40	260															2
XC7Z015-1CLG485C	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	85 Cel		0 Cel				BOTTOM		1.6 mm			19 mm								19 mm			CMOS			1 V						.8 mm	S-PBGA-B485
XC7Z015-2CLG485I	Xilinx	SYSTEM ON CHIP		BALL	485	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA485,22X22,32	.95 V	100 Cel		-40 Cel				BOTTOM		1.6 mm			19 mm								19 mm			CMOS			1 V						.8 mm	S-PBGA-B485
XCZU4CG-1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	784	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY			100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM											30	250				CMOS			.85 V							S-PBGA-B784	4		e1
XC7Z007S-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel		0 Cel				BOTTOM		1.5 mm			13 mm								13 mm			CMOS			1 V						.8 mm	S-PBGA-B225
ATSAMA5D27-WLSOM1	Microchip Technology	MICROPROCESSOR CIRCUIT		NO LEAD	188	DIE	SQUARE	UNSPECIFIED	YES	5.5 V				UNCASED CHIP		3 V	85 Cel		-40 Cel				UPPER											NOT SPECIFIED	NOT SPECIFIED				CMOS			3.3 V							S-XUUC-N188