Texas Instruments - PGA460TPWQ1

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;

NT3H2111W0FHK by NXP Semiconductors is a surface mount microprocessor circuit with 8 terminals. It operates at a supply voltage range of 1.67V to 3.6V and can withstand temperatures from -40°C to 105°C. This chip carrier package is commonly used in industrial applications requiring NFC functionality.

SoC; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

CC2541F128RHAT by Texas Instruments is a 40-terminal microprocessor circuit with 8192 bytes of RAM. Operating at 3V, it supports I2C, SPI, USART, and USB bus compatibility. Ideal for industrial applications requiring a temperature range of -40 to 85°C.

MSP430F6779AIPEUR by Texas Instruments is a 16-bit microprocessor with 128 terminals, 524288 ROM words, and 32 RAM words. It features 6 ADC channels, DMA support, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .5 mm;

NXP Semiconductors PN7150B0HN/C11002E is a NFC controller with 40 terminals, CMOS technology, and 1.8V nominal voltage. It operates b/w -30 to 85°C, suitable for applications requiring surface mount chips in plastic/epoxy packages like contactless payment systems.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

SoC;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 485; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR;

SoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

MCIMX6Y2DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating b/w 0-95°C, it supports a supply voltage range of 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.