Other Function uPs,uCs & Peripheral ICs

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	No. of Bits	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Analog To Digital Convertors	Nominal Supply Voltage	PWM Channels	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
XC7Z030-3FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		0 Cel				BOTTOM		2.54 mm			23 mm								23 mm		CMOS		1 V						1 mm		S-PBGA-B484
MIMX8MN2CVTIZAA	NXP Semiconductors	SYSTEM ON CHIP																					TIN SILVER														40	260														3			e2
MCIMX7D3EVK10SD	NXP Semiconductors	SYSTEM ON CHIP	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1.25 V							GRID ARRAY, THIN PROFILE, FINE PITCH	BGA488,28X28,16	1.2 V	105 Cel		-20 Cel				BOTTOM		1.1 mm			12 mm						40	260	12 mm		CMOS		1.225 V						.4 mm		S-PBGA-B488	3
MCIMX6Q7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V							GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		2.16 mm			21 mm		EACH GPIO MODULE SUPPORTS 32 BITS OF I/O				40	260	21 mm		CMOS		1.4 V						.8 mm		S-PBGA-B624	3			e1
STSPIN32F0A	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	45 V							CHIP CARRIER, HEAT SINK/SLUG		6.7 V	125 Cel		-40 Cel				QUAD					7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS		8 V						.5 mm		S-XQCC-N48
XA7Z020-1CLG484Q	Xilinx	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100					1,1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32		125 Cel		-40 Cel	TIN SILVER COPPER		N	BOTTOM		1.6 mm			19 mm						30	260	19 mm		CMOS				Other uPs/uCs/Peripheral ICs				.8 mm		S-PBGA-B484	3	Not Qualified		e1
AX8052F143-3-TX30	Onsemi	SYSTEM ON CHIP	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.28,20	1.8 V	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM			QUAD		1 mm			5 mm						30	260	7 mm		CMOS		3 V						.5 mm		R-PQCC-N40	1
ESP32-WROOM-32UE	Espressif Systems (Shanghai)	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V							MICROELECTRONIC ASSEMBLY		3 V	85 Cel		-40 Cel				UNSPECIFIED		3.35 mm			18 mm							250	19.2 mm		CMOS		3.3 V						1.27 mm		R-XXMA-N38	3
PN7150B0HN/C11002Y	NXP Semiconductors	NFC CONTROLLER		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.95 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	1.65 V	85 Cel		-30 Cel	NICKEL PALLADIUM GOLD			QUAD		1 mm			6 mm						30	260	6 mm		CMOS		1.8 V						.5 mm		S-XQCC-N40	3			e4
NRF52805-CAAA-B-R	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel		-40 Cel				BOTTOM		.535 mm			2.464 mm								2.482 mm		CMOS		3 V						.4 mm		R-PBGA-B28
XC7Z045-2FFG900I	Xilinx	SYSTEM ON CHIP		BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel		-40 Cel				BOTTOM		3.24 mm			27 mm								27 mm		CMOS		1 V						1 mm		S-PBGA-B900
14450R-500	Renesas Electronics	SoC
XC7Z010-3CLG225E	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		0 Cel				BOTTOM		1.5 mm			13 mm								13 mm		CMOS		1 V						.8 mm		S-PBGA-B225
MCIMX6Y2CVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.32 mm			14 mm						40	260	14 mm		CMOS								.8 mm		S-PBGA-B289	3			e1
XC7Z020-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM		1.6 mm			17 mm								17 mm		CMOS		1 V						.8 mm		S-PBGA-B400	3			e1
FT800Q-T	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.97 V	85 Cel		-40 Cel				QUAD		1 mm			7 mm						NOT SPECIFIED	NOT SPECIFIED	7 mm		CMOS		3.3 V						.5 mm		S-XQCC-N48
STSPIN32F0601TR	STMicroelectronics	MICROPROCESSOR CIRCUIT																																			NOT SPECIFIED	NOT SPECIFIED
XC7Z030-2FBG484E	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		0 Cel				BOTTOM		2.54 mm			23 mm								23 mm		CMOS		1 V						1 mm		S-PBGA-B484
CC-WMX-J97C-TN	Digi International	MICROPROCESSOR CIRCUIT	OTHER	NO LEAD	400	LGA	SQUARE	UNSPECIFIED	YES								GRID ARRAY			70 Cel		-20 Cel				BOTTOM					50 mm								50 mm		CMOS								2 mm		S-XBGA-N400
BGM220PC22HNA2	Silicon Labs	SoC
PGA460TPWR	Texas Instruments	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	28 V							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		6 V	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD			DUAL		1.2 mm			4.4 mm		ALSO OPERATES AT 6V-15V FOR TRANSFORMER TOPOLOGY		0		30	260	5 mm		CMOS		12 V					SPI; UART; USART	.65 mm		R-PDSO-G16	2			e4
TMS320DM368ZCEDF	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V					32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm		CMOS		1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
MIMXRT1051CVJ5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel		-40 Cel	TIN SILVER			BOTTOM		1.52 mm			12 mm						40	260	12 mm		CMOS								.8 mm		S-PBGA-B196	3			e2
MIMXRT1064DVL6BR	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	95 Cel		0 Cel				BOTTOM		1.43 mm			10 mm						40	260	10 mm		CMOS								.65 mm		S-PBGA-B196	3
ATECC608B-SSHCZ-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V							SMALL OUTLINE	SOP8,.23	2 V	85 Cel		-40 Cel				DUAL		1.75 mm			3.9 mm								4.9 mm		CMOS							1-WIRE	1.27 mm		R-PDSO-G8
FT245RL	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	SQUARE	PLASTIC/EPOXY	YES	5.25 V							SMALL OUTLINE, SHRINK PITCH		3.3 V	85 Cel		-40 Cel				DUAL		2 mm			5.3 mm						40	260	10.2 mm		CMOS								.65 mm		S-PDSO-G28	3
TMS320DM368ZCED	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V					32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.3 mm		8192	13 mm				32		30	260	13 mm		CMOS		1.35 V		Digital Signal Processors			I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
MIMXRT1021CAG4B	NXP Semiconductors	SoC																																			40	260														3
XC7Z010-1CLG225C	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	85 Cel		0 Cel				BOTTOM		1.5 mm			13 mm								13 mm		CMOS		1 V						.8 mm		S-PBGA-B225
ATECC608A-MAHDA-T	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	TS 16949						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD			DUAL		.6 mm			2 mm						30	260	3 mm		CMOS								.5 mm		R-PDSO-N8	1			e4
ATECC608B-SSHCZ-B	Microchip Technology	CRYPTOGRAPHIC AUTHENTICATOR	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V							SMALL OUTLINE	SOP8,.23	2 V	85 Cel		-40 Cel				DUAL		1.75 mm			3.9 mm								4.9 mm		CMOS							1-WIRE	1.27 mm		R-PDSO-G8
NRF52811-QCAA-R	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.7 V	85 Cel		-40 Cel				QUAD		.9 mm			5 mm								5 mm		CMOS		3 V						.5 mm		S-XQCC-N32
CY8C4146LQI-S422	Infineon Technologies	PROGRAMMABLE SoC	INDUSTRIAL																				PURE TIN																													3
MIMXRT1021CAF4A	NXP Semiconductors	SoC	INDUSTRIAL																				TIN														40	260														3			e3
XC7Z010-2CLG225I	Xilinx	SYSTEM ON CHIP		BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA225,15X15,32	.95 V	100 Cel		-40 Cel				BOTTOM		1.5 mm			13 mm								13 mm		CMOS		1 V						.8 mm		S-PBGA-B225
MIMXRT1061CVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.43 mm			10 mm						40	260	10 mm		CMOS								.65 mm		S-PBGA-B196	3			e1
RN2903A-I/RM103	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	3.6 V	TS 16949						MICROELECTRONIC ASSEMBLY		2.1 V	85 Cel		-40 Cel	NICKEL GOLD			UNSPECIFIED		3.34 mm			17.78 mm							250	26.67 mm		CMOS		3.3 V						1.27 mm		R-XXMA-N47				e4
5CSTFD6D5F31I7N	Intel	SoC
FT245RL-TUBE	FTDI	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V							SMALL OUTLINE, SHRINK PITCH		3.3 V	85 Cel		-40 Cel				DUAL		2 mm			5.3 mm								10.2 mm		CMOS								.65 mm		R-PDSO-G28		Not Qualified
XC7Z030-2FBG484I	Xilinx	SYSTEM ON CHIP		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA484,22X22,40	.95 V	100 Cel		-40 Cel				BOTTOM		2.54 mm			23 mm								23 mm		CMOS		1 V						1 mm		S-PBGA-B484
DA14531-00000OG2	Renesas Electronics	SoC																																																		1
CC1310F128RGZT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.8 V	85 Cel	CORTEX-M3	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)			QUAD		1 mm			7 mm						NOT SPECIFIED	260	7 mm	28672	CMOS		3.3 V						.5 mm		S-PQCC-N48	3			e4
MIMXRT1051CVL5B	NXP Semiconductors	SYSTEM ON CHIP	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel		-40 Cel	TIN SILVER COPPER			BOTTOM		1.43 mm			10 mm						40	260	10 mm		CMOS								.65 mm		S-PBGA-B196	3			e1
ESP32-PICO-V3-02	Espressif Systems (Shanghai)	SoC		NO LEAD	48	HQCCN	SQUARE		YES	3.6 V							CHIP CARRIER, HEAT SINK/SLUG	LCC48,.27SQ,20	3 V	85 Cel		-40 Cel				QUAD		1.21 mm			7 mm								7 mm		CMOS		3.3 V						.5 mm		S-XQCC-N48
XC7Z010-3CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM		1.6 mm			17 mm								17 mm		CMOS		1 V						.8 mm		S-PBGA-B400	3			e1
XC7Z035-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V							GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel				BOTTOM		3.24 mm			27 mm								27 mm		CMOS		1 V						1 mm		S-PBGA-B676
MCP25050-E/P	Microchip Technology	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	TS 16949		8			5	IN-LINE	DIP14,.3	4.5 V	125 Cel		-40 Cel	MATTE TIN			DUAL		4.318 mm			7.62 mm								19.05 mm		CMOS		5 V		Parallel IO Port				2.54 mm		R-PDIP-T14		Not Qualified		e3
MSP430F67791AIPEUR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		0		NO	16		FLATPACK, LOW PROFILE, FINE PITCH		2.4 V	85 Cel	MSP430	-40 Cel	NICKEL PALLADIUM GOLD	YES		QUAD	YES	1.6 mm	524288	32	14 mm	0	IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY	BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT	0	.032768 MHz	30	260	20 mm	32768	CMOS	6-Ch 10-Bit	3.3 V	YES		I2C(2), IRDA(4), SPI(6), UART(4)	FLASH	I2C; SPI; UART	.5 mm		R-PQFP-G128	3		25 rpm	e4	8	90