Xilinx - XC7Z010-2CLG400E

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

CC-WMX-J97C-TN by Digi International is a 400-terminal microprocessor circuit with CMOS technology. It operates b/w -20°C to 70°C, in a square grid array package style measuring 50mm x 50mm. Ideal for applications requiring high-performance processing in compact spaces.

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT;

XC7Z035-3FFG900E by Xilinx is a 900-terminal programmable SoC with CMOS technology. Operating at 0-100°C, it has a supply voltage range of 0.95-1.05 V and terminal pitch of 1 mm. Ideal for applications requiring high-performance computing in compact spaces.

XC7Z012S-2CLG485I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a low profile grid array package, it's ideal for various embedded applications.

CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

Other uPs/uCs/Peripheral ICs; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

SYSTEM ON CHIP; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;

The Xilinx XCZU9EG-2FFVB1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. Ideal for applications requiring high-performance computing and signal processing capabilities.

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

SoC; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: SQUARE;

XC7Z010-2CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

PSoC;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;