Xilinx - XC7Z030-1SBG485C

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

MCIMX6S5DVM10AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates at a voltage range of 1.35V to 1.5V and has a max temperature of 95°C. This semiconductor is commonly used in other function uPs, uCs, and peripheral ICs applications.

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVSON; Package Shape: RECTANGULAR;

LS1021AXE7KQB by NXP Semiconductors is a microprocessor circuit with a package style of grid array and heat sink/slug. It has a max supply voltage of 1.03V and a min supply voltage of 0.97V. This IC is commonly used in applications requiring high-performance processing capabilities.

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

The NXP Semiconductors MFRC52201HN1,118 is a MICROPROCESSOR CIRCUIT with 32 terminals in a SQUARE CHIP CARRIER package. It operates at -25 to 85 °C and requires 3/3.3V power supply. Ideal for applications requiring contactless communication such as RFID systems and access control devices.

SYSTEM ON CHIP; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3;

ST4SI2M0020TPIFW by STMicroelectronics is a cryptographic authenticator IC with CMOS technology. It has 8 terminals, small outline package style, and operates b/w -40 to 105°C. Suitable for secure authentication applications requiring compact design and high reliability.

MIMX8MM6DVTLZAA by NXP Semiconductors is a low-profile, fine-pitch SoC with 486 terminals. It operates at a voltage range of 0.95V to 1.05V and can withstand temperatures up to 95°C. This versatile chip is commonly used in various applications requiring high-performance microcontrollers and peripheral ICs.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LFBGA; Package Shape: SQUARE;

XCZU3CG-1SFVC784I by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 784 BALL terminals. It operates in industrial temperature range (-40 to 100 °C) and has a supply voltage of 0.85 V. Ideal for applications requiring high-performance computing in harsh environments.

XCZU9EG-2FFVB1156I by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 1156 terminals in a GRID ARRAY package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This industrial-grade IC is ideal for applications requiring high-performance processing capabilities.

W5300 by Wiznet is a 100-terminal IC with 3-3.6V supply voltage range, ideal for microprocessor circuits. Its CMOS technology and quad terminal position make it suitable for commercial extended temperature applications at up to 80°C. The package style is flatpack with low profile and fine pitch, making it surface-mountable in a compact 14x14mm square shape.

Other uPs/uCs/Peripheral ICs;

MICROPROCESSOR CIRCUIT; Technology: CMOS;

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;

ESP32-S3-WROOM-1-N4R8 by Espressif Systems is a 41-terminal SoC with 3.6V max supply voltage, ideal for IoT applications. Operating b/w -40°C to 65°C, it features CMOS technology and a compact rectangular package style, making it suitable for various embedded systems requiring low power consumption and high performance.