Multi-functional Peripherals

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	Maximum Standby Current	No. of I/O Lines
CY8C20636A-24LTXIT	Infineon Technologies		INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0	8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8192	512	7 mm		NO	0	25.2 MHz	20	260	7 mm		1024	CMOS	4 mA	3 V		Microcontrollers	FLASH	USB	.5 mm	S-XQCC-N48	3	Not Qualified	25.2 rpm	e4		36
CY8C20646A-24LTXI	Cypress Semiconductor		INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0	8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.71 V	85 Cel	M8C	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm	16384	1024	7 mm		NO	0	25.2 MHz	20	260	7 mm		2048	CMOS	4 mA	3 V		Microcontrollers	FLASH	USB	.5 mm	S-XQCC-N48	3	Not Qualified	25.2 rpm	e4		36
CY8C20666A-24LTXI	Cypress Semiconductor		INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0	8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.71 V	85 Cel	M8C	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm	32768	1024	7 mm		NO	0	25.2 MHz	20	260	7 mm		2048	CMOS	4 mA	3 V		Microcontrollers	FLASH	USB	.5 mm	S-XQCC-N48	3	Not Qualified	25.2 rpm	e4		36
CY8C24423A-24LTXI	Infineon Technologies		INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V	0	8	2.7/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	4096	256	5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO	0	24.6 MHz	40	260	5 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	USB	.5 mm	S-XQCC-N32	3	Not Qualified	24 rpm	e4		24
CY8C26233-24SXI	Cypress Semiconductor		INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0		3.3/5	SMALL OUTLINE	SOP20,.4	3 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	N	DUAL	2.667 mm		256	7.505 mm		NO	0	.032768 MHz	20	260	12.8265 mm	8192 Bits		CMOS		3.3 V		Other Microprocessor ICs			1.27 mm	R-PDSO-G20	3	Not Qualified		e4	.000005 Amp	16
CY8C27143-24PXI	Cypress Semiconductor		INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V	0	8	3.3/5	IN-LINE	DIP8,.3	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	4.572 mm	16384	256	7.62 mm	ALSO OPERATES AT 3V WITH 93KHZ	NO	0	24 MHz		260	9.779 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	I2C; USB	2.54 mm	R-PDIP-T8	1	Not Qualified	24 rpm	e3		6
CY8C27243-24SXI	Cypress Semiconductor		INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	3.3/5	SMALL OUTLINE	SOP20,.4	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.667 mm	16384	256	7.505 mm	ALSO OPERATES AT 3V WITH 93KHZ	NO	0	24 MHz	20	260	12.8265 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	I2C; USB	1.27 mm	R-PDSO-G20	3	Not Qualified	24 rpm	e4		16
CY8C27443-24PXI	Cypress Semiconductor		INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V	0	8	3.3/5	IN-LINE	DIP28,.3	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	4.82 mm	16384	256	7.62 mm	ALSO OPERATES AT 3V WITH 93KHZ	NO	0	24 MHz	40	260	34.67 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	I2C; USB	2.54 mm	R-PDIP-T28	1	Not Qualified	24 rpm	e4		24
CY8C28643-24LTXI	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V	0	8	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	16384	1024	7 mm	ALSO OPERATES AT 3V MINIMUM SUPPLY	NO	0	24 MHz	20	260	7 mm		1024	CMOS	14 mA	5 V		Microcontrollers	FLASH	I2C, IRDA, SPI, UART, USB	.5 mm	S-XQCC-N48	3	Not Qualified	24 rpm	e4		44
CY8C29466-24PVXA	Cypress Semiconductor		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V	0	8	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm	32768	1024	5.3 mm	ALSO OPERATES AT 3V SUPPLY	NO	0	24 MHz	20	260	10.2 mm		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH	USB	.65 mm	R-PDSO-G28	3	Not Qualified	24 rpm	e4		24
CY8C3666AXI-052	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	0	8	2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	8051	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm	65536	4096	14 mm		YES	0	67 MHz	40	260	14 mm		8192	CMOS		3.3 V		Microcontrollers	FLASH	I2C; USB	.5 mm	S-PQFP-G100	3	Not Qualified	67 rpm	e4		62
CY8C3866LTI-030	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0		2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.3SQ,40	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		4096	8 mm		YES	0	67 MHz	30	260	8 mm	65536 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs			.4 mm	S-XQCC-N68	3	Not Qualified		e4		48
CY8C4013SXI-411T	Infineon Technologies																														NOT SPECIFIED	NOT SPECIFIED
CY8C4014FNI-421AT	Infineon Technologies																			TIN SILVER COPPER																									1			e1
CY8C4125AXI-483T	Infineon Technologies																														NOT SPECIFIED	NOT SPECIFIED
CY8C4126AXI-M443T	Infineon Technologies																			PURE TIN																									3
CY8C4127AXI-S443	Infineon Technologies	MULTIFUNCTION PERIPHERAL																		PURE TIN																									3
CY8C4145AZI-PS433	Infineon Technologies	MULTIFUNCTION PERIPHERAL																		PURE TIN																									3
CY8C4245AXI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V				FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		2048	14 mm		NO		48 MHz			14 mm			CMOS	13.8 mA		11			I2C; SPI; UART; IRDA; IDE; LIN	.8 mm	S-PQFP-G64	3			e4		51
CY8C4245AZI-473	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		4K	7 mm		YES		48 MHz			7 mm			CMOS	13.8 mA	1.8 V	3			I2C	.5 mm	S-PQFP-G48	3					36
CY8C4245AZI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	0			FLATPACK, LOW PROFILE, FINE PITCH	QFP64(UNSPEC)	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		4K	10 mm		NO	0	48 MHz			10 mm			CMOS	13.8 mA	3.3 V	11			I2C; SPI; UART; IRDA; IDE; LIN	.5 mm	S-PQFP-G64	3			e4		51
CY8C4245LTI-DM405	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		2048	8 mm		NO	0	48 MHz			8 mm			CMOS		3.3 V				I2C; SPI; UART; IRDA; IDE; LIN	.4 mm	S-XQCC-N68	3			e4		55
CY8C4245LTI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		2048	8 mm		NO		48 MHz			8 mm			CMOS	13.8 mA		11			I2C; SPI; UART; IRDA; IDE; LIN	.4 mm	S-XQCC-N68	3			e4		55
CY8C4246LTI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		4096	8 mm		NO		48 MHz			8 mm			CMOS	13.8 mA		11			I2C; SPI; UART; IRDA; IDE; LIN	.4 mm	S-XQCC-N68	3			e4		55
CY8C4247AZI-L445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		8192	10 mm		NO		48 MHz			10 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.5 mm	S-PQFP-G64	3					53
CY8C4247AZI-M475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	0			FLATPACK, LOW PROFILE, FINE PITCH	QFP64(UNSPEC)	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		16K	10 mm		NO	0	48 MHz			10 mm			CMOS	13.8 mA	3.3 V	11			I2C; SPI; UART; IRDA; IDE; LIN	.5 mm	S-PQFP-G64	3			e4		51
CY8C4247LQI-BL453T	Infineon Technologies																														NOT SPECIFIED	NOT SPECIFIED
CY8C4248FNI-BL563T	Infineon Technologies																														NOT SPECIFIED	NOT SPECIFIED
CY8C4248LQI-BL563T	Infineon Technologies		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	.6 mm		16384	7 mm		NO	0	48 MHz			7 mm			CMOS		3.3 V				I2C; I2S; SPI; UART; IRDA; LIN; IDE	.4 mm	S-XQCC-N56	3					36
CY8C5246LTI-029	Cypress Semiconductor		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0		1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		32768	8 mm		YES	0	40 MHz		260	8 mm	65536 Bits		CMOS		1.8 V		Other Microprocessor ICs			.4 mm	S-XQCC-N68	3	Not Qualified		e4		48
CY8C5468LTI-037	Cypress Semiconductor		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	2.7 V	85 Cel		-40 Cel		N	QUAD	1 mm		32768	8 mm		NO		25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	2097152 Bits		CMOS		5 V		Other Microprocessor ICs		I2C; USB	.4 mm	S-XQCC-N68		Not Qualified				46
CY8C5488FNI-LP212	Infineon Technologies		INDUSTRIAL	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			BOTTOM	.6 mm		32768	5.192 mm		YES		33 MHz			5.94 mm			CMOS		1.8 V				I2C; USB	.5 mm	R-PBGA-B99						62
CY8C5666AXQ-LP004	Cypress Semiconductor		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	0		1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	105 Cel		-40 Cel		N	QUAD	1.6 mm		32768	14 mm		YES	0	33 MHz			14 mm	524288 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; I2S, LIN; PS/2; SPI, USB	.5 mm	S-PQFP-G100		Not Qualified				62
CYBL10561-56LQXI	Cypress Semiconductor		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel			QUAD	.6 mm		8192	7 mm		YES		48 MHz			7 mm			CMOS		1.8 V				I2C	.4 mm	S-XQCC-N56						36
CYBL10563-68FNXI	Infineon Technologies		INDUSTRIAL	BALL	68	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			BOTTOM	.55 mm		8192	3.52 mm		YES		48 MHz	NOT SPECIFIED	NOT SPECIFIED	3.91 mm			CMOS		1.8 V				I2C; USB	.4 mm	R-PBGA-B68						36
CYBL10573-56LQXI	Cypress Semiconductor		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V	0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel			QUAD	.6 mm		16384	7 mm		NO	0	48 MHz			7 mm			CMOS		3.3 V				I2C; I2S; IDE; IRDA; LIN; SPI; UART	.4 mm	S-XQCC-N56						36
EFR32BG21B010F1024IM32-B	Silicon Labs	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V	0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		98304	4 mm		NO	0	38.4 MHz			4 mm			CMOS		3 V	3			I2C, I2S, IRDA, SPI, UART, USART	.4 mm	S-XQCC-N32						20
EFR32FG23A010F256GM48-BR	Silicon Labs	SYSTEM ON CHIP
EFR32FG23A020F256GM48-B	Silicon Labs	SYSTEM ON CHIP
EFR32FG23B010F512IM40-BR	Silicon Labs	SYSTEM ON CHIP
EFR32FG23B020F512IM40-BR	Silicon Labs	SYSTEM ON CHIP
EFR32FG23B020F512IM48-BR	Silicon Labs	SYSTEM ON CHIP
EFR32ZG23B011F512IM40-B	Silicon Labs	SYSTEM ON CHIP
FW82801DB	Intel			BALL	421	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	32			GRID ARRAY		1.425 V						BOTTOM	2.59 mm		256	31 mm	ALSO REQUIRES 3.3V SUPPLY	NO	32	66 MHz			31 mm			CMOS		1.5 V				PCI; USB; LPC	1.27 mm	S-PBGA-B421	1					29
FW82801EB	Intel																																			CMOS
FW82801EBSL73Z	Intel																																			CMOS
LE3100MICH/SL9PU	Intel			BALL	1284	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY								BOTTOM						NO								CMOS						PCI; SATA; SMBUS; UART; USB		S-PBGA-B1284						38
MGM13P02F512GA-V2R	Silicon Labs

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.