Multi-functional Peripherals

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
CY8C6347BZI-BLD53T	Infineon Technologies																				TIN SILVER COPPER																											3				e1
CY8C4248LQI-BL553T	Infineon Technologies																																NOT SPECIFIED	NOT SPECIFIED
CY8C29566-24AXIT	Infineon Technologies		INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	FLATPACK, LOW PROFILE	TQFP44,.47SQ,32	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		QUAD	1.6 mm	32768	1024	10 mm	ALSO OPERATES AT 3V SUPPLY	NO		0	24 MHz	20	260	10 mm		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH		.8 mm		S-PQFP-G44	3	Not Qualified	24 rpm		e3	40
CY8C4245AXI-473	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				FLATPACK, LOW PROFILE	QFP44,.47SQ,32	1.71 V	105 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		2048	10 mm		NO			48 MHz	20	260	10 mm			CMOS	13.8 mA	3.3 V	3			I2C; IDE; IRDA; LIN; SPI; UART	.8 mm		S-PQFP-G44	3	Not Qualified			e3	36
CY8C4246AZI-L433	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.8 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		4096	7 mm		NO			48 MHz			7 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.5 mm		S-PQFP-G48	3					38
EFR32FG23A010F512GM40-B	Silicon Labs	SYSTEM ON CHIP
LS1046ASE8T1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES		64		30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
CY8C4014LQI-422	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	24	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG	LCC24,.16SQ,20	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.55 mm		1024	4 mm		NO			16 MHz	30	260	4 mm			CMOS	4.5 mA	3.3 V				I2C	.5 mm		S-XQCC-N24	3				e4	20
CY8C5488FNI-LP212T	Infineon Technologies		INDUSTRIAL	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	.6 mm		32768	5.192 mm		YES		0	33 MHz			5.94 mm			CMOS		3.3 V				I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB	.5 mm		R-PBGA-B99	1				e1	62
CY8C4246AZI-M443	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		4096	7 mm		NO			48 MHz			7 mm			CMOS	13.8 mA		11			I2C; SPI; UART; IRDA; IDE; LIN	.5 mm		S-PQFP-G48	3					38
CY8C28452-24PVXIT	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm	16384	1024	5.3 mm	ALSO OPERATES AT 3V MINIMUM SUPPLY	NO		0	24 MHz	20	260	10.2 mm		1024	CMOS	14 mA	5 V		Microcontrollers	FLASH	I2C, IRDA, SPI, UART, USB	.65 mm		R-PDSO-G28	3	Not Qualified	24 rpm		e4	24
CY8C4247AZI-L433T	Infineon Technologies		INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	0			FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		8192	7 mm		NO		0	48 MHz			7 mm			CMOS		1.8 V				I2C; SPI; UART; USB	.5 mm		S-PQFP-G48	3					38
CC3235SM2RGKR	Texas Instruments		INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		2.1 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		256K	9 mm		YES	TIMER, WDT	0		30	260	9 mm		262144	CMOS		3.3 V				I2C, I2S, SPI, UART	.5 mm		S-PQCC-N64	3				e4	27
EFR32FG23A021F512GM40-B	Silicon Labs	SYSTEM ON CHIP
CY8C5666AXI-LP004	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	N	QUAD	1.6 mm		8192	14 mm		YES			33 MHz	30	260	14 mm	524288 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.5 mm		S-PQFP-G100	3	Not Qualified			e3	72
EFR32FG23A011F512GM40-B	Silicon Labs	SYSTEM ON CHIP
CY8C4246AZI-L423	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.8 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		4096	7 mm		NO			48 MHz			7 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.5 mm		S-PQFP-G48	3					38
MCIMX6G2AVM07AB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM	1.32 mm			14 mm		YES		16		40	260	14 mm			CMOS							.8 mm	FIXED POINT	S-PBGA-B289	3		696 rpm	YES	e2
MCIMX6Q5EYM10AE	NXP Semiconductors																				TIN SILVER COPPER												40	260														3				e1
CY8C4014PVI-422	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm		1024	5.3 mm		NO			16 MHz			10.2 mm			CMOS	4.5 mA	3.3 V				I2C	.65 mm		R-PDSO-G28	3				e4	20
CY8C4124PVI-442	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm		2048	5.3 mm		NO		0	24 MHz	30	260	10.2 mm			CMOS	7.2 mA	1.8 V	0			I2C, I2S, SPI, UART	.65 mm		R-PDSO-G28	3	Not Qualified			e4	24
CY8C4247AXI-M485	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		8192	14 mm		NO			48 MHz			14 mm			CMOS	13.8 mA		11			I2C; SPI; UART; IRDA; IDE; CAN; LIN	.8 mm		S-PQFP-G64	3	Not Qualified			e4	51
EFR32FG23B010F512IM48-B	Silicon Labs	SYSTEM ON CHIP
EFR32FG23B020F512IM40-B	Silicon Labs	SYSTEM ON CHIP
CY8C4124PVI-442T	Infineon Technologies																																NOT SPECIFIED	NOT SPECIFIED
CY8C4246AZI-L433T	Infineon Technologies		INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	0			FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		4096	7 mm		NO		0	48 MHz			7 mm			CMOS		1.8 V				I2C; SPI; UART; USB	.5 mm		S-PQFP-G48	3					38
EFR32FG23B010F512IM40-B	Silicon Labs	SYSTEM ON CHIP
CY8C24123A-24SXI	Infineon Technologies		INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0	8	2.7/5	SMALL OUTLINE	SOP8,.25	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	1.727 mm	4096	256	3.8985 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO		0	24.6 MHz	20	260	4.889 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	USB	1.27 mm		R-PDSO-G8	3	Not Qualified	24 rpm		e3	6
CY8C27643-24PVXI	Infineon Technologies		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.794 mm	16384	256	7.505 mm	ALSO OPERATES AT 3V WITH 93KHZ	NO		0	24 MHz	20	260	15.875 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	I2C; USB	.635 mm		R-PDSO-G48	3	Not Qualified	24 rpm		e4	44
CY8C4247AZI-L433	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	0			FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		16K	7 mm		YES		0	48 MHz			7 mm			CMOS	14.5 mA	1.8 V				I2C; USB; LPC	.5 mm		S-PQFP-G48	3					38
CY8C4248AZI-L485T	Infineon Technologies																																															3
EFR32FG23B020F512IM48-B	Silicon Labs	SYSTEM ON CHIP
MIMX8QP6AVUFFAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	1313	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V	0			GRID ARRAY, FINE PITCH		1.05 V	125 Cel		-40 Cel	TIN SILVER BISMUTH		BOTTOM	2.52 mm		524288	29 mm	lsio contains 8 GPIO lines	YES		0	24 MHz	40	260	29 mm			CMOS	5000 mA	1.1 V				CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.75 mm		S-PBGA-B1313	3				e6	1
CY8C6347FMI-BLD13T	Infineon Technologies																				TIN SILVER COPPER																											1				e1
CYBLE-022001-00	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	21		SQUARE	UNSPECIFIED		YES	5.5 V	0			MICROELECTRONIC ASSEMBLY		1.71 V	85 Cel		-40 Cel			UNSPECIFIED	1.6 mm		8192	10 mm	SEATED HGT-NOM	NO		0				10 mm			CMOS		3.3 V				I2C, I2S, IDE, SPI, UART	.76 mm		S-XXMA-N21	3					17
CY8C24123A-24PXI	Infineon Technologies		INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.25 V	0	8	2.7/5	IN-LINE	DIP8,.3	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	4.572 mm	4096	256	7.62 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO		0	24.6 MHz		260	9.779 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	USB	2.54 mm		R-PDIP-T8	1	Not Qualified	24 rpm		e3	6
CY8C4246AZI-L423T	Infineon Technologies		INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	0			FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		4096	7 mm		NO		0	48 MHz			7 mm			CMOS		1.8 V				I2C; SPI; UART	.5 mm		S-PQFP-G48	3					38
CY8C4247AZI-L475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.8 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		8192	10 mm		NO			48 MHz			10 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.5 mm		S-PQFP-G64	3					53
CY8C4124AXI-443	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				FLATPACK, LOW PROFILE	QFP44,.47SQ,32	1.71 V	85 Cel		-40 Cel	MATTE TIN		QUAD	1.6 mm		2048	10 mm		NO		0	24 MHz	20	260	10 mm			CMOS	7.2 mA	1.8 V	0			I2C, I2S, SPI, UART	.8 mm		S-PQFP-G44	3	Not Qualified			e3	36
CY8C4125LQI-483	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	40	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG	LCC40,.24SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm		2048	6 mm		NO		0	24 MHz			6 mm			CMOS	7.2 mA	1.8 V	0			I2C, I2S, SPI, UART	.5 mm		S-XQCC-N40	3	Not Qualified			e4	34
CY8C4248FNI-BL583T	Infineon Technologies		INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		BOTTOM	.55 mm		16384	3.87 mm		NO		0	48 MHz			4.04 mm			CMOS		3.3 V				I2C; I2S; SPI; UART; IRDA; LIN; IDE	.4 mm		R-PBGA-B76	1				e4	36
CY8C4247LTI-L475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		8192	8 mm		NO			48 MHz			8 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.4 mm		S-XQCC-N68	3				e4	57
CY8C20546A-24PVXIT	Infineon Technologies		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	0	8	1.8/5	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.794 mm	16384	1024	7.505 mm		NO		0	25.2 MHz	20	260	15.875 mm		2048	CMOS	4 mA	3 V		Microcontrollers	FLASH	USB	.635 mm		R-PDSO-G48	3	Not Qualified	25.2 rpm		e4	34
CY8C29566-24AXI	Infineon Technologies		INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	FLATPACK, LOW PROFILE	TQFP44,.47SQ,32	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm	32768	2K	10 mm	ALSO OPERATES AT 3V SUPPLY	NO		0	24 MHz	20	260	10 mm		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH		.8 mm		S-PQFP-G44	3	Not Qualified	24 rpm		e4	40
CY8C4245PVI-DS402T	Infineon Technologies																																															3
LS1046ASN8P1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES		64	1400 MHz	30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
MIMX8QM5CVUFFAB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	1313	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V	0			GRID ARRAY, FINE PITCH		1.05 V	105 Cel		-40 Cel	TIN SILVER BISMUTH		BOTTOM	2.52 mm		524288	29 mm		YES		0	24 MHz	40	260	29 mm			CMOS	5000 mA	1.1 V				CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB	.75 mm		S-PBGA-B1313	3				e6	1
CY8C4045AZI-S413T	Infineon Technologies																				PURE TIN																											3

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.