Multi-functional Peripherals

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
EFR32FG23A010F256GM40-B	Silicon Labs	SYSTEM ON CHIP
CY8C24423A-24PXI	Cypress Semiconductor		INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.25 V	0	8	2.7/5	IN-LINE	DIP28,.3	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	4.82 mm	4096	256	7.62 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO	0	24.6 MHz	40	260	34.67 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	USB	2.54 mm		R-PDIP-T28	1	Not Qualified	24 rpm		e4	24
CY8C22545-24AXI	Infineon Technologies		INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm	16384	512	10 mm		NO	0	24 MHz	20	260	10 mm		1024	CMOS	12 mA	5 V		Microcontrollers	FLASH		.8 mm		S-PQFP-G44	3	Not Qualified	24.6 rpm		e4	38
CY8C29666-24PVXI	Infineon Technologies		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.794 mm	32768	1024	7.505 mm	ALSO OPERATES AT 3V SUPPLY	NO	0	24 MHz	20	260	15.875 mm		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH		.635 mm		R-PDSO-G48	3	Not Qualified	24 rpm		e4	44
CY8C20234-12LKXI	Infineon Technologies		INDUSTRIAL	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED		YES	5.25 V	0	8	2.7/5	CHIP CARRIER, VERY THIN PROFILE	LCC16,.12SQ,20	3 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	8192	512	3 mm	IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ	NO	0	12 MHz	20	260	3 mm		512	CMOS	2.5 mA	4.75 V		Microcontrollers	FLASH	USB	.5 mm		S-XQCC-N16	3	Not Qualified	12 rpm		e4	13
EFR32BG21B020F1024IM32-B	Silicon Labs	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	3.8 V	0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16	1.71 V	125 Cel		-40 Cel			QUAD	.9 mm		98304	4 mm		NO	0	38.4 MHz			4 mm			CMOS		3 V	3			I2C, I2S, IRDA, SPI, UART, USART	.4 mm		S-XQCC-N32						20
NH82801GBSL8FX	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY		YES				1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40							BOTTOM														CMOS				Other Microprocessor ICs			1 mm		S-PBGA-B652		Not Qualified
STID337-DCB	STMicroelectronics																															NOT SPECIFIED	NOT SPECIFIED
CY8C20636A-24LTXI	Infineon Technologies		INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	0	8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	8192	512	7 mm		NO	0	25.2 MHz	20	260	7 mm		1024	CMOS	4 mA	3 V		Microcontrollers	FLASH	USB	.5 mm		S-XQCC-N48	3	Not Qualified	25.2 rpm		e4	36
CY8C22545-24AXIT	Infineon Technologies		INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm	16384	512	10 mm		NO	0	24 MHz	20	260	10 mm		1024	CMOS	12 mA	5 V		Microcontrollers	FLASH		.8 mm		S-PQFP-G44	3	Not Qualified	24.6 rpm		e4	38
CY8C27543-24AXI	Infineon Technologies		INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm	16384	256	10 mm	ALSO OPERATES AT 3V WITH 93KHZ	NO	0	24 MHz	20	260	10 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	I2C; USB	.8 mm		S-PQFP-G44	3	Not Qualified	24 rpm		e4	40
MCIMX6D5EYM10AE	NXP Semiconductors																				TIN SILVER COPPER											40	260														3				e1
BD82QM57SLGZQ	Intel			BALL	1071	HBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1.1 V	32			GRID ARRAY, HEAT SINK/SLUG		.998 V						BOTTOM	2.358 mm			25 mm		YES	32	14.318 MHz	NOT SPECIFIED	NOT SPECIFIED	27 mm			CMOS		1.05 V				USB; PCI; I2C; LPC; PS/2	.6 mm		R-PBGA-B1071
CY8C24223A-24PVXI	Infineon Technologies		INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0	8	2.7/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm	4096	256	5.3 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO	0	24.6 MHz	30	260	7.2 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	USB	.65 mm		R-PDSO-G20	3	Not Qualified	24 rpm		e4	16
CY8C3666LTI-027	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	0	8	2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel	8051	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	65536	4096	8 mm		YES	0	67 MHz	30	260	8 mm		8192	CMOS		3.3 V		Microcontrollers	FLASH	I2C; USB	.4 mm		S-XQCC-N68	3	Not Qualified	67 rpm		e4	38
CY8C4024LQI-S411T	Infineon Technologies																				NICKEL PALLADIUM GOLD											30	260														3				e4
EFR32ZG23B020F512IM40-B	Silicon Labs	SYSTEM ON CHIP
MCIMX6G2DVM05AA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V						BOTTOM	1.32 mm			14 mm		YES	16		40	260	14 mm			CMOS							.8 mm	FIXED POINT	S-PBGA-B289	3		528 rpm	YES
CY8C20534-12PVXI	Infineon Technologies		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0	8	2.7/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	3 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm	8192	512	5.3 mm	IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ	NO	0	12 MHz	20	260	10.2 mm		512	CMOS	2.5 mA	4.75 V		Microcontrollers	FLASH	USB	.65 mm		R-PDSO-G28	3	Not Qualified	12 rpm		e4	24
CY8C24423A-24LTXIT	Infineon Technologies		INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V	0	8	2.7/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	4096	256	5 mm	ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO	0	24.6 MHz	40	260	5 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	USB	.5 mm		S-XQCC-N32	3	Not Qualified	24 rpm		e4	24
CY8C3246AXI-138T	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	0		1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN	N	QUAD	1.6 mm		4096	14 mm		YES	0	33 MHz			14 mm	524288 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB	.5 mm		S-PQFP-G100	3	Not Qualified				62
CY8C4125AZI-473	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.28SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		2048	7 mm		NO	0	24 MHz			7 mm			CMOS	7.2 mA	1.8 V	0			I2C, I2S, SPI, UART	.5 mm		S-PQFP-G48	3					36
CY8C4126AZI-S445	Infineon Technologies	MULTIFUNCTION PERIPHERAL																			PURE TIN																										3
CY8C4127FNI-BL483T	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	68	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA68,8X9,16	1.8 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	.55 mm		8192	3.52 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	NO			30	260	3.91 mm			CMOS	25 mA	3.3 V				I2C, SPI, UART	.4 mm		R-PBGA-B68	1				e1	36
CYBL10462-56LQXI	Cypress Semiconductor		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel			QUAD	.6 mm		8192	7 mm		YES		48 MHz			7 mm			CMOS		1.8 V				I2C	.4 mm		S-XQCC-N56						36
CYW43907KWBGT	Infineon Technologies																																														1
EFR32ZG23B010F512IM48-B	Silicon Labs	SYSTEM ON CHIP
LS1027AXN7NQA	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH	BGA448,30X30,30	.97 V	105 Cel		-40 Cel			BOTTOM	2.61 mm		262144	17 mm		YES	32		40	260	17 mm			CMOS		1 V	8			I2C, SAI, SPI, UART	.75 mm		S-PBGA-B448	3					68
AF82801IBM	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES					GRID ARRAY								BOTTOM						NO			NOT SPECIFIED	NOT SPECIFIED				CMOS						PCI; USB; LPC			S-PBGA-B676
CY8C28513-24AXI	Cypress Semiconductor		INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	4.75 V	85 Cel	M8C	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1.6 mm	16384	512	10 mm	ALSO OPERATES AT 3V MINIMUM SUPPLY	NO	0	24 MHz	20	260	10 mm		1024	CMOS	14 mA	5 V		Microcontrollers	FLASH	USB	.8 mm		S-PQFP-G44	3	Not Qualified	24 rpm		e4	40
CY8C29466-24PXI	Cypress Semiconductor		INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.25 V	0	8	3.3/5	IN-LINE	DIP28,.3	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	4.82 mm	32768	1024	7.62 mm	ALSO OPERATES AT 3V SUPPLY	NO	0	24 MHz	40	260	34.67 mm		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH		2.54 mm		R-PDIP-T28	1	Not Qualified	24 rpm		e4	24
CY8C29666-24LTXIT	Infineon Technologies		INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V	0	8	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	32768	1024	7 mm	ALSO OPERATES AT 3V SUPPLY	NO	0	24 MHz	20	260	7 mm		2048	CMOS	14 mA	5 V		Microcontrollers	FLASH		.5 mm		S-XQCC-N48	3	Not Qualified	24 rpm		e4	44
CY8C3666LTI-201	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V			1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1 mm		4096	8 mm		YES		33 MHz	30	260	8 mm	524288 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2; 8051	.4 mm		S-XQCC-N68	3	Not Qualified			e4	46
CY8C3866AXI-208	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN	N	QUAD	1.6 mm		4096	14 mm		YES		33 MHz			14 mm	524288 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2; 8051	.5 mm		S-PQFP-G100	3	Not Qualified				72
CY8C4124FNI-443T	Infineon Technologies		INDUSTRIAL	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			BOTTOM	.482 mm		2048	2.097 mm		NO	0	48 MHz			2.582 mm			CMOS		3.3 V				I2C; SPI; UART	.35 mm		R-PBGA-B35	1					31
CY8C4125PVI-PS421	Infineon Technologies	MULTIFUNCTION PERIPHERAL																			NICKEL PALLADIUM GOLD																										3				e4
CY8C4126AXI-M443	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				FLATPACK, LOW PROFILE	QFP44,.47SQ,32	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		4096	10 mm		NO		48 MHz			10 mm			CMOS	7.2 mA		7			I2C; IRDA; LIN; SPI; UART	.8 mm		S-PQFP-G44	3				e4	36
CY8C4126LTI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		4096	8 mm		NO		48 MHz			8 mm			CMOS	7.2 mA		7			I2C; IRDA; LIN; SPI; UART	.4 mm		S-XQCC-N68	3				e4	55
CY8C5468AXI-LP042	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	0		1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN	N	QUAD	1.6 mm		32768	14 mm		YES	0	33 MHz			14 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.5 mm		S-PQFP-G100	3	Not Qualified				72
CY8C5488AXI-LP120	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	PURE TIN	N	QUAD	1.6 mm		32768	14 mm		YES		33 MHz			14 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB	.5 mm		S-PQFP-G100	3	Not Qualified				62
CY8CTST241-LQI-01	Cypress Semiconductor																																				CMOS
CYBL10162-56LQXI	Cypress Semiconductor		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm		8192	7 mm		YES		48 MHz			7 mm			CMOS		1.8 V				I2C	.4 mm		S-XQCC-N56	3				e4	36
CYBL10563-56LQXI	Cypress Semiconductor		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel			QUAD	.6 mm		8192	7 mm		YES		48 MHz			7 mm			CMOS		1.8 V				I2C	.4 mm		S-XQCC-N56						36
DW82801HBM	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES		32			GRID ARRAY								BOTTOM	2.49 mm			31 mm	PITCH_MINI	NO	32	48 MHz			31 mm			CMOS		1.05 V				USB; PCI; I2C	1 mm		S-PBGA-B676
EFR32ZG23A020F512GM40-BR	Silicon Labs	SYSTEM ON CHIP
MC68901FN	Motorola		COMMERCIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY		YES	5.5 V	5			CHIP CARRIER		4.5 V	70 Cel		0 Cel	TIN LEAD		QUAD	4.57 mm			19.1262 mm		NO	8	4 MHz			19.1262 mm			MOS	180 mA	5 V	1			MC68000	1.27 mm		S-PQCC-J52		Not Qualified			e0	8
MIMX8QX6CVLFZAC	NXP Semiconductors																															40	260														3
CY8C20236A-24LKXI	Infineon Technologies		INDUSTRIAL	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	0	8	1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC16,.12SQ,20	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	8192	512	3 mm		NO	0	25.2 MHz	30	260	3 mm		1024	CMOS	4 mA	3 V		Microcontrollers	FLASH	USB	.5 mm		S-XQCC-N16	3	Not Qualified	25.2 rpm		e4	13

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.