Multi-functional Peripherals

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Ultraviolet Erasable	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
MCIMX6QP6AVT1AAR	NXP Semiconductors																								TIN SILVER COPPER															40	260																		3
MGM13P12F512GA-V2R	Silicon Labs
TDA2EGBHQCBDRQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	16				GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel			-40 Cel	TIN SILVER COPPER			BOTTOM		1.298 mm		512K	17 mm			YES		32	38.4 MHz	30	260	17 mm				CMOS			1.15 V						CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3				e1		186
CC1111F32RSPR	Texas Instruments		OTHER	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY		YES								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			85 Cel	8051		0 Cel	NICKEL PALLADIUM GOLD			QUAD		.9 mm			6 mm							30	260	6 mm			4096	CMOS										.5 mm		S-PQCC-N36	3	Not Qualified			e4		21
CY7C60323-LTXC	Cypress Semiconductor		COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V			0		8	2.4/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2.7 V	70 Cel	M8C		0 Cel	NICKEL PALLADIUM GOLD			QUAD		1 mm	8192	512	5 mm		IT ALSO OPERATES AT 2.4V AT 93KHZ	NO		0	12 MHz	40	260	5 mm			512	CMOS		2 mA	3 V			Microcontrollers		FLASH	I2C; USB	.5 mm		S-XQCC-N32	3	Not Qualified	24.6 rpm		e4		28
CY8C24423A-24SXI	Infineon Technologies		INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V			0		8	2.7/5	SMALL OUTLINE	SOP28,.4	4.75 V	85 Cel	M8C		-40 Cel	NICKEL PALLADIUM GOLD			DUAL		2.67 mm	4096	256	7.505 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO		0	24.6 MHz	20	260	17.905 mm			256	CMOS		8 mA	5 V			Microcontrollers		FLASH	USB	1.27 mm		R-PDSO-G28	3	Not Qualified	24 rpm		e4		24
CY8C4013LQI-411	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V							CHIP CARRIER, HEAT SINK/SLUG	LCC16,.12SQ,20	1.8 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD			QUAD		.6 mm		1024	3 mm			NO			16 MHz	30	260	3 mm				CMOS		4.5 mA	3.3 V						I2C	.5 mm		S-XQCC-N16	3				e4		12
CY8C4013SXI-400	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V							SMALL OUTLINE, LOW PROFILE	SOP8,.25	1.8 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD			DUAL		1.727 mm		1024	3.89 mm			NO			16 MHz	30	260	4.889 mm				CMOS		4.5 mA	3.3 V						I2C	1.27 mm		R-PDSO-G8	3				e4		5
CY8C4125LQI-PS423	Infineon Technologies	MULTIFUNCTION PERIPHERAL																							NICKEL PALLADIUM GOLD																																		3				e4
CY8C4246AZI-M475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			0				FLATPACK, LOW PROFILE, FINE PITCH	QFP64(UNSPEC)	1.71 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD			QUAD		1.6 mm		8K	10 mm			NO		0	48 MHz			10 mm				CMOS		13.8 mA	3.3 V		11				I2C; SPI; UART; IRDA; IDE; LIN	.5 mm		S-PQFP-G64	3				e4		51
CY8C4247LTI-L485	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.8 V	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD			QUAD		1 mm		8192	8 mm			NO			48 MHz			8 mm				CMOS		14.5 mA							I2C; IRDA; LIN; SPI; UART; USB	.4 mm		S-XQCC-N68	3				e4		57
CY8C5246AXI-054	Cypress Semiconductor		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			0			1.8/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel			-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		N	QUAD		1.6 mm		32768	14 mm			YES		0	40 MHz	40	260	14 mm	65536 Bits			CMOS			1.8 V			Other Microprocessor ICs				.5 mm		S-PQFP-G100	3	Not Qualified			e4		72
CY8C5466LTI-063	Cypress Semiconductor		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V						3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	2.7 V	85 Cel			-40 Cel			N	QUAD		1 mm		8192	8 mm			NO			25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	524288 Bits			CMOS			5 V			Other Microprocessor ICs			I2C; USB	.4 mm		S-XQCC-N68		Not Qualified					46
CY8C5566LTI-017	Cypress Semiconductor		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V						3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	2.7 V	85 Cel			-40 Cel			N	QUAD		1 mm		8192	8 mm			NO			25 MHz	NOT SPECIFIED	NOT SPECIFIED	8 mm	65536 Bits			CMOS			5 V			Other Microprocessor ICs			I2C; USB	.4 mm		S-XQCC-N68		Not Qualified					46
CY8C6247FDI-D02T	Infineon Technologies																																							NOT SPECIFIED	NOT SPECIFIED
CY8C624AFNI-S2D43T	Infineon Technologies																																							NOT SPECIFIED	NOT SPECIFIED
EFR32ZG23A020F512GM40-B	Silicon Labs	SYSTEM ON CHIP
EFR32ZG23B020F512IM40-BR	Silicon Labs	SYSTEM ON CHIP
LS1026ASE8T1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V			14				GRID ARRAY, FINE PITCH		.97 V					TIN SILVER COPPER			BOTTOM		2.61 mm			23 mm			YES		64		30	250	23 mm				CMOS			1 V						I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1		76
LS1026AXN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V			14				GRID ARRAY, FINE PITCH		.87 V					Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM		2.61 mm			23 mm			YES		64		30	250	23 mm				CMOS			.9 V						I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1		76
LS1046ASE8P1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V			14				GRID ARRAY, FINE PITCH		.97 V					TIN SILVER COPPER			BOTTOM		2.61 mm			23 mm			YES		64		30	250	23 mm				CMOS			1 V						I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1		76
MCIMX6QP6AVT1ABR	NXP Semiconductors
MCIMX7D5EVM10SC	NXP Semiconductors			BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V							GRID ARRAY, LOW PROFILE, FINE PITCH		1.045 V								BOTTOM		1.4 mm			19 mm							40	260	19 mm				CMOS			1.1 V							.75 mm		S-PBGA-B541	3
MIMX8DX5CVLFZAC	NXP Semiconductors																								TIN SILVER															40	260																		3				e2
SCH3116-NU	Microchip Technology	MULTIFUNCTION PERIPHERAL	COMMERCIAL	GULL WING	128	TQFP	SQUARE	PLASTIC/EPOXY		YES	3.63 V			4			3.3	FLATPACK, THIN PROFILE	TQFP128,.63SQ,16	2.97 V	70 Cel			0 Cel	MATTE TIN			QUAD		1.2 mm		256	14 mm			NO		4				14 mm				CMOS		1 mA	3.3 V			Other uPs/uCs/Peripheral ICs			LPC	.4 mm		S-PQFP-G128		Not Qualified			e3		46
XS1-L4A-64-TQ48-C4	Xmos		COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	1.05 V			0				FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH		.95 V	70 Cel			0 Cel				QUAD		1.2 mm		32768	7 mm			YES		0	100 MHz			7 mm				CMOS			1 V						SPI, USB	.5 mm		S-PQFP-G48							28
CY8C24123A-24SXIT	Infineon Technologies		INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V			0		8	2.7/5	SMALL OUTLINE	SOP8,.25	4.75 V	85 Cel	M8C		-40 Cel	MATTE TIN			DUAL		1.727 mm	4096	256	3.8985 mm		ALSO OPERATES AT 2.7V AND 3.3V SUPPLY	NO		0	24.6 MHz	20	260	4.889 mm			256	CMOS		8 mA	5 V			Microcontrollers		FLASH	USB	1.27 mm		R-PDSO-G8	3	Not Qualified	24 rpm		e3		6
CY8C24223-24PI	Cypress Semiconductor		INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.25 V			0		8	3.3/5	IN-LINE	DIP20,.3	3 V	85 Cel	M8C		-40 Cel	TIN LEAD			DUAL		4.826 mm	4096	256	7.62 mm			NO		0	24.24 MHz			25.527 mm			256	CMOS		8 mA	3.3 V			Microcontrollers		FLASH		2.54 mm		R-PDIP-T20		Not Qualified	24 rpm		e0		16
CY8C4025LQI-S401T	Infineon Technologies																								NICKEL PALLADIUM GOLD															30	260																		3				e4
CY8C4147AZI-S443	Infineon Technologies	MULTIFUNCTION PERIPHERAL																							PURE TIN																																		3
CY8C4246AZI-L445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			0				FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	1.71 V	85 Cel			-40 Cel	PURE TIN			QUAD		1.6 mm		8K	10 mm			YES		0	48 MHz			10 mm				CMOS		14.5 mA	1.8 V						I2C; USB; LPC	.5 mm		S-PQFP-G64	3						53
CY8C4247AZI-L423T	Infineon Technologies		INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			0				FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	85 Cel			-40 Cel	PURE TIN			QUAD		1.6 mm		8192	7 mm			NO		0	48 MHz			7 mm				CMOS			1.8 V						I2C; SPI; UART	.5 mm		S-PQFP-G48	3						38
CY8C5888FNI-LP210	Infineon Technologies		INDUSTRIAL	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V							GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel			-40 Cel				BOTTOM		.6 mm		32768	5.192 mm			YES			33 MHz		260	5.94 mm				CMOS			1.8 V						I2C; USB	.5 mm		R-PBGA-B99	1				e4		62
LS1026ASE8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V			14				GRID ARRAY, FINE PITCH		.87 V					TIN SILVER COPPER			BOTTOM		2.61 mm			23 mm			YES		64		30	250	23 mm				CMOS			.9 V						I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1		76
LS1026AXE8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V			14				GRID ARRAY, FINE PITCH		.87 V					Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM		2.61 mm			23 mm			YES		64		30	250	23 mm				CMOS			.9 V						I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1		76
LS1046ASE8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V			14				GRID ARRAY, FINE PITCH		.87 V					TIN SILVER COPPER			BOTTOM		2.61 mm			23 mm			YES		64		30	250	23 mm				CMOS			.9 V						I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1		76
MCIMX6G2DVK05AB	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	OTHER	BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V			26				GRID ARRAY, LOW PROFILE, FINE PITCH		1.15 V	95 Cel			0 Cel				BOTTOM		1.23 mm			9 mm			YES		16		40	260	9 mm				CMOS										.5 mm	FIXED POINT	S-PBGA-B272	3		528 rpm	YES
SCH3114-NU	Microchip Technology	MULTIFUNCTION PERIPHERAL	COMMERCIAL	GULL WING	128	TQFP	SQUARE	PLASTIC/EPOXY		YES	3.63 V			4			3.3	FLATPACK, THIN PROFILE	TQFP128,.63SQ,16	2.97 V	70 Cel			0 Cel	MATTE TIN			QUAD		1.2 mm		256	14 mm			NO		4		40	260	14 mm				CMOS		1 mA	3.3 V			Other uPs/uCs/Peripheral ICs			LPC	.4 mm		S-PQFP-G128	3	Not Qualified			e3		46
STA1295EOA	STMicroelectronics	MULTIFUNCTION PERIPHERAL
TDA3MVRBFABFRQ1	Texas Instruments	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	367	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.11 V		AEC-Q100	16				GRID ARRAY, FINE PITCH	BGA367,22X22,25	1.02 V	125 Cel			-40 Cel	TIN SILVER COPPER			BOTTOM		2.82 mm		524288	15 mm			YES		32	38.4 MHz	30	250	15 mm				CMOS			1.06 V		13				CAN(2), I2C(2), QSPI, SPI(4), UART(3)	.65 mm		S-PBGA-B367	3				e1		126
AXM0F243-1-TX40	Onsemi								NO			32			YES	32						CORTEX-M0	8			YES			NO		65536			0			BROWN-OUT DETECT, COMPARATOR(2), POR, TIMER(5), WDT			NOT SPECIFIED	NOT SPECIFIED			5	8192		1-Ch 12-Bit			YES			I2C(2), SPI(2), UART(2)	FLASH			FIXED POINT				48 rpm	YES		8
CY8C4024LQI-S413T	Infineon Technologies																								PURE TIN																																		3
CY8C5667AXI-LP006	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V						2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel			-40 Cel	MATTE TIN		N	QUAD		1.6 mm		16384	14 mm			YES			33 MHz	30	260	14 mm	1048576 Bits			CMOS			1.8 V			Other uPs/uCs/Peripheral ICs			I2C; USB; PS/2	.5 mm		S-PQFP-G100	3	Not Qualified			e3		72
NH82801GBM	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY		YES							1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40									BOTTOM																		CMOS						Other Microprocessor ICs				1 mm		S-PBGA-B652		Not Qualified
NH82801GBM/SL8YB	Intel			BALL	652	BGA	SQUARE	PLASTIC/EPOXY		YES							1.05,1.5,3.3,5	GRID ARRAY	BGA652,28X28,40									BOTTOM																		CMOS						Other Microprocessor ICs				1 mm		S-PBGA-B652		Not Qualified
CY8C24794-24LTXI	Infineon Technologies		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V			0		8	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	4.75 V	85 Cel	M8C		-40 Cel	MATTE TIN			QUAD		1 mm	16384	512	8 mm		IT ALSO OPERATES AT 3 V MINIMUM SUPPLY	NO		0	24 MHz	20	260	8 mm			1024	CMOS		27 mA	5 V			Microcontrollers		FLASH	I2C; USB	.5 mm		S-XQCC-N56	3	Not Qualified	24.96 rpm		e3		50
CY8CTMA120-56LFXA	Cypress Semiconductor		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED		YES	5.25 V			0				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		4.75 V	85 Cel			-40 Cel	MATTE TIN			QUAD		1 mm		512	8 mm		IT ALSO OPERATES 93KHZ AT 3 V	NO		0	24 MHz			8 mm				CMOS			5 V						USB	.5 mm		S-XQCC-N56	3	Not Qualified			e3		49
BD82QM67SLJ4M	Intel			BALL	989	FBGA	SQUARE	PLASTIC/EPOXY		YES				32			1.05,1.5,1.8,3.3,5	GRID ARRAY, FINE PITCH	BGA989(UNSPEC)									BOTTOM		2.205 mm			25 mm		SEATED HT-CALCULATED	YES		16	48 MHz			25 mm				CMOS			1.05 V			Bus Controllers			USB; PCI; I2C	.6 mm		S-PBGA-B989		Not Qualified

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.