Multi-functional Peripherals | Vyrian

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
DRH404HSCIPTP	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRB402BIPTP	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRH402IPTP	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRA404CIPTP	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRA402IZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRI404AIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRB404CIPTP	Texas Instruments	MULTIFUNCTION PERIPHERAL
CC1111F8RSP	Texas Instruments		OTHER	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY		YES							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			85 Cel	8051	0 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm		6 mm				30	260	6 mm	4096	CMOS							.5 mm		S-PQCC-N36	3	Not Qualified			e4	21
DRH404IZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
TFB2002BPPM	Texas Instruments		OTHER	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V			36			FLATPACK, FINE PITCH		4.75 V	85 Cel		-20 Cel		QUAD	4.1 mm		28 mm	YES	64	25 MHz			28 mm		CMOS		5 V				680X0; 88XXX; 80X86; SPARC; R4000; AXP	.5 mm		S-PQFP-G208		Not Qualified				0
DRE402AIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRA756PPIGABZRQ1	Texas Instruments		AUTOMOTIVE	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm	2.5M	23 mm	YES	32	32 MHz	30	250	23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1500 rpm		e1	247
DRA710BEGCBDRQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.298 mm	512K	17 mm	YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3		600 rpm		e1	186
DRA724JGABCRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V	8	AEC-Q100	16			GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	512K	23 mm	YES	32	38.4 MHz	30	250	23 mm		CMOS	.01 mA	1.15 V	1			CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B760	3		1000 rpm	YES	e1	215
XTDA2EGBHQCBDQ1	Texas Instruments												AEC-Q100
DRE404AIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRB404HSIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRH402AIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
CC3130RNMRGKR	Texas Instruments	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V			0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	2.1 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		9 mm	NO	0	40 MHz	30	260	9 mm		CMOS		3.3 V		1		SPI, UART	.5 mm		S-PQCC-N64	3				e4
66AK2H14DXAAWA24	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32			GRID ARRAY		.95 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm	YES	128		30	245	40 mm		CMOS		1 V				ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
DRA776PPIGACDQ1	Texas Instruments		AUTOMOTIVE	BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	32			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm	2.5M	23 mm	YES	64	38.4 MHz	30	250	23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; SPI; UART; USB	.8 mm		S-PBGA-B784	3		1800 rpm		e1	247
DRA767PSGACDQ1	Texas Instruments		AUTOMOTIVE	BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	32			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm	2.5M	23 mm	YES	64	38.4 MHz	30	250	23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; SPI; UART; USB	.8 mm		S-PBGA-B784	3		1800 rpm		e1	247
DRH404CIPTP	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRA714BEGCBDQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.298 mm	512K	17 mm	YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3		600 rpm		e1	186
VCE6467TZUTL1	Texas Instruments		OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.365 V			0	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel		0 Cel		BOTTOM	3.3 mm	128	19 mm	YES	0	35 MHz	30	245	19 mm		CMOS		1.3 V			Digital Signal Processors	I2C; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified				33
66AK2H12DAAWA24	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32			GRID ARRAY		.95 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm	YES	128		30	245	40 mm		CMOS		1 V				ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
DRE404BIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRB404HSBIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRF404HSBIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRI404CIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
TDA2EGBHQCBDQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.298 mm	512K	17 mm	YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3				e1	186
DRI404AIPTP	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRE402AIPTP	Texas Instruments	MULTIFUNCTION PERIPHERAL
TDA2SGBRQABCRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		AEC-Q100	16	32		GRID ARRAY, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm	2.5M	23 mm	YES	32	38.4 MHz	30	250	23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.8 mm	FLOATING POINT	S-PBGA-B760	3		750 rpm	YES	e1	247
DRA793BDGCBDQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.298 mm	512K	17 mm	YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3		500 rpm		e1	186
66AK2H12DAAWA2	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			32			GRID ARRAY		.95 V	100 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.62 mm	6M	40 mm	YES	128		30	245	40 mm		CMOS		1 V				ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
DRB404AIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
XTDA2PSXTQABZ	Texas Instruments		AUTOMOTIVE	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	1.63 mm	2.5M	23 mm	YES	32	38.4 MHz			23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760						247
DRE404HSIPTP	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRA790BAGCBDRQ1	Texas Instruments		AUTOMOTIVE	BALL	538	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.298 mm	512K	17 mm	YES	32	38.4 MHz	30	260	17 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.65 mm		S-PBGA-B538	3		300 rpm		e1	186
DRB404AIPTP	Texas Instruments	MULTIFUNCTION PERIPHERAL
XDRA756PPIGABZ	Texas Instruments		AUTOMOTIVE	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	32			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	1.63 mm	2.5M	23 mm	YES	64	38.4 MHz			23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; SPI; UART; USB	.8 mm		S-PBGA-B760						247
XDRA777PSIGACD	Texas Instruments		AUTOMOTIVE	BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	32			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel		BOTTOM	1.63 mm	2.5M	23 mm	YES	64	38.4 MHz			23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; SPI; UART; USB	.8 mm		S-PBGA-B784						247
DRA752PPGABZQ1	Texas Instruments		AUTOMOTIVE	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm	512K	23 mm	YES	32	32 MHz	30	250	23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.8 mm		S-PBGA-B760	3		1500 rpm		e1	247
DRB404HSAIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL
TDA2PSXVQACDRQ1	Texas Instruments		AUTOMOTIVE	BALL	784	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V		AEC-Q100	16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm	2.5M	23 mm	YES	32	38.4 MHz	30	250	23 mm		CMOS		1.15 V				CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB	.8 mm		S-PBGA-B784	3				e1	247
DRH404HSIPTP	Texas Instruments	MULTIFUNCTION PERIPHERAL
DRA404HSAIZDU	Texas Instruments	MULTIFUNCTION PERIPHERAL

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.