Texas Instruments - TDA3MVRBFABFRQ1

TDA3MVRBFABFRQ1 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TDA3MVRBFABFRQ1
Description MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 367; Package Code: FBGA; Package Shape: SQUARE;
Datasheet TDA3MVRBFABFRQ1 Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.02 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.06 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.82 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 367
No. of Serial I/Os: 13
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
No. of I/O Lines: 126
Address Bus Width: 16
Screening Level: AEC-Q100
Technology: CMOS
RAM Words: 524288
JESD-30 Code: S-PBGA-B367
Maximum Clock Frequency: 38.4 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Width: 15 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: MULTIFUNCTION PERIPHERAL
Maximum Supply Voltage: 1.11 V
Boundary Scan: YES
External Data Bus Width: 32
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA367,22X22,25
Length: 15 mm
Peak Reflow Temperature (C): 250
Bus Compatibility: CAN(2), I2C(2), QSPI, SPI(4), UART(3)
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
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