Zilog - Z84C4206PEG

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: TFQFP; Package Shape: SQUARE;

PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA1152,34X34,40;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 485; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

PSoC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

NRF52811-QCAA-R by Nordic Semiconductor Asa is a MICROPROCESSOR CIRCUIT with 32 terminals, operating from -40 to 85 °C. It has a supply voltage range of 1.7V to 3.6V and comes in a SQUARE package style suitable for various applications requiring low-profile, high-performance uCs.

Other uPs/uCs/Peripheral ICs; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;

ATWINC1500-MR210UB1961 by Microchip operates at 2.7-3.6V, with a temp range of -40 to 85°C. It is a CMOS microprocessor circuit in a rectangular package style for industrial applications, featuring 28 terminals and surface mount capability.

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Other uPs/uCs/Peripheral ICs; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;

AM4378BZDN100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C with supply voltage range of 1.272-1.378V, making it ideal for embedded applications requiring high performance and compact design.

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

Other uPs/uCs/Peripheral ICs;

Other uPs/uCs/Peripheral ICs; No. of Terminals: 144; JESD-609 Code: e4; Terminal Finish: SILVER;