Infineon Technologies - CYAT827AZA59-22002

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

Other uPs/uCs/Peripheral ICs;

The NXP MIMXRT1064DVL6BR is a low-profile, fine-pitch SoC with 196 terminals. It operates b/w 0-95°C, with supply voltage ranging from 1.15-1.26V. Ideal for applications requiring high-performance uPs and uCs in a compact form factor.

OMAPL138EZWT3 by Texas Instruments is a low-profile, fine-pitch microprocessor circuit with 361 terminals. It operates at a max clock frequency of 50 MHz and has a data bus width of 32. This versatile IC is compatible with I2C, SPI, UART, and USB buses, making it suitable for various applications requiring high-speed processing.

MICROPROCESSOR CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE; Package Equivalence Code: TQFP128,.63SQ,16;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

Other uPs/uCs/Peripheral ICs;

SYSTEM ON CHIP;

SoC; JESD-609 Code: e2; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3;

SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;

SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B288;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Technology: CMOS;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;

EFR32MG24A010F1536IM40-B by Silicon Labs is a SoC peripheral IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 125°C, with supply voltage ranging from 1.71V to 3.8V. Ideal for applications requiring low-profile and high-temperature performance like IoT devices and wearables.

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

AM4378BZDN100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C with supply voltage range of 1.272-1.378V, making it ideal for embedded applications requiring high performance and compact design.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 71; Package Code: VFLGA; Package Shape: SQUARE;

ATECC608B-SSHDA-T by Microchip Technology is a cryptographic authenticator IC with I2C bus compatibility. It operates b/w -40 to 85°C, has a supply voltage range of 2-5.5V, and comes in a small outline package suitable for industrial applications.