Xilinx - XAZU5EV-1SFVC784Q

XAZU5EV-1SFVC784Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XAZU5EV-1SFVC784Q
Description MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
Datasheet XAZU5EV-1SFVC784Q Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .85 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.32 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Terminals: 784
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Length: 23 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B784
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Peak Reflow Temperature (C): 250
Package Code: FBGA
Width: 23 mm
Terminal Pitch: .8 mm
Temperature Grade: AUTOMOTIVE
Moisture Sensitivity Level (MSL): 4
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