Texas Instruments - AM4376BZDN80

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;

Other uPs/uCs/Peripheral ICs;

SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

The Xilinx XC7Z010-2CLG400E is a System on Chip with 400 terminals in a low profile, fine pitch grid array package. It operates b/w 0-100°C with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact form factors.

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 112; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;

Microchip ATECC608A-SSHCZ-B is a cryptographic authenticator IC with 8 terminals, CMOS technology, and 2-5.5V supply range. Ideal for secure applications in industrial settings due to TS 16949 screening, -40 to 85°C operating temp, and compact rectangular package design.

NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.

CC2543RHBR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32 terminals, operating b/w -40 to 85 °C. It supports I2C, SPI, UART, and USART bus compatibility at 3V nominal voltage. Ideal for industrial applications requiring CMOS technology in a compact square package style.

ESP32-WROOM-32UE-H4 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage range of 3-3.6V. Ideal for IoT applications due to its compact size and surface mount capability.

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

AM6411BKCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715 to 0.79 V. Ideal for applications requiring fine pitch and ball terminal form technology.

ATECC608B-SSHDA-T by Microchip Technology is a cryptographic authenticator IC with I2C bus compatibility. It operates b/w -40 to 85°C, has a supply voltage range of 2-5.5V, and comes in a small outline package suitable for industrial applications.

PSoC;

Other uPs/uCs/Peripheral ICs; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;

MIMXRT1062CVJ5A by NXP Semiconductors is a CMOS SoC with 196 terminals in a low profile, fine pitch grid array package. It operates in industrial temperature range (-40 to 105 °C) and has a max supply voltage of 1.26 V. This IC is suitable for various applications requiring high-performance microcontrollers.

The NXP Semiconductors MIMX8MN5DVTJZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE;

Siemens 6AV2181-8XP00-0AX0 is a surface mount rectangular chip with CMOS technology. It operates at temperatures ranging from 0 to 50°C and has a nominal voltage of 3.3V. This microprocessor circuit is commonly used in commercial applications requiring other function uPs, uCs, and peripheral ICs.

SLB9670VQ20FW785XTMA1 by Infineon: 32-terminal IC with max supply voltage of 1.95V, ideal for cryptographic authentication applications. Features CMOS technology, operates b/w -20 to 85 °C, and has a compact square package style suitable for surface mount assembly.

XCZU7EV-2FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for applications requiring high performance and reliability in compact designs.