NXP Semiconductors - MCIMX286CVM4BR2

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 60; Package Code: VBCC; Package Shape: SQUARE;

MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Nominal Supply Voltage: 1.8 V;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: QCCN; Package Shape: SQUARE;

SLB9670VQ20FW785XUMA1 by Infineon: 32-terminal chip carrier with CMOS tech, operates b/w -20 to 85 °C. Ideal for cryptographic authentication applications due to low supply voltage range of 1.65-1.95 V and compact square package design.

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

XCZU7EV-L2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C, with supply voltage range of 0.698-0.742 V. This GRID ARRAY package is ideal for applications requiring high performance uPs/uCs & Peripheral ICs in various industries.

PSoC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

NXP Semiconductors' MIMXRT1061CVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.15-1.26V and peak reflow temp of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; Package Code: BGA; Package Shape: UNSPECIFIED; Package Style (Meter): GRID ARRAY; Technology: CMOS;

PSoC; Temperature Grade: INDUSTRIAL; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Qualification: Not Qualified; Maximum Time At Peak Reflow Temperature (s): 30;

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 112; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;

SLS32AIA010MSUSON10XTMA2 by Infineon is a cryptographic authenticator IC with 10 terminals, CMOS technology, and 3.3V nominal voltage. It operates b/w -25 to 85 °C and has a small outline square package style suitable for surface mount applications. The IC's terminal pitch is 0.5mm, making it ideal for compact electronic devices.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

Other uPs/uCs/Peripheral ICs;

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 485; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

FTDI's FT245RL-TUBE is a CMOS microprocessor circuit with 28 terminals. It operates b/w -40 to 85 °C, with supply voltage range of 3.3V to 5.25V. Ideal for industrial applications requiring small outline package style and surface mount compatibility.