Infineon Technologies - CY8C4248LQI-BL553

XC7Z015-1CLG485C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;

SYSTEM ON CHIP;

Other uPs/uCs/Peripheral ICs;

SoC; Terminal Form: NO LEAD; No. of Terminals: 38; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Supply Voltage: 3 V;

The Xilinx XC7Z014S-2CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

The Xilinx XC7Z030-2FBG676E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessing capabilities.

AM4372BZDNA80 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.21V to 1.326V. This low profile, fine pitch GRID ARRAY package with 491 terminals is ideal for industrial applications requiring high performance and reliability.

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

XCZU4EV-2FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package. Suitable for industrial use, it requires a supply voltage of 0.825V to 0.876V and can withstand peak reflow temperature of 245C.

SoC; Terminal Form: BALL; No. of Terminals: 425; Package Code: VFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 441; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B441;

SoC;

Other uPs/uCs/Peripheral ICs;

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 404; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

MCP25020-I/SL by Microchip Tech is an 8-bit peripheral IC with a supply voltage range of 2.7-5.5V, ideal for industrial applications. It features a small outline package style, dual terminal position, and CMOS technology, suitable for microprocessor circuits requiring TS 16949 screening level. With dimensions of 8.65mm x 3.9mm x 1.75mm and operating temperature range of -40 to 85°C, it offers high performance in compact designs.

SE050C1HQ1/Z01SCZ by NXP Semiconductors is a cryptographic authenticator IC with CMOS technology. It operates b/w -25 to 85 °C, with supply voltage range of 1.62V to 3.6V. This quad-terminal chip carrier is ideal for secure applications requiring high-level authentication and encryption.

SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B288;